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quality Multilayer Ceramic Capacitors Chinocera HGC0402R5226M100NTEJ General Purpose Series for SMT Assembly factory
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quality Multilayer Ceramic Capacitors Chinocera HGC0402R5226M100NTEJ General Purpose Series for SMT Assembly factory
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Specifications
Voltage Rating:
10V
Capacitance:
22uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
HGC0402R5226M100NTEJ
Package:
0402
Key Attributes
Model Number: HGC0402R5226M100NTEJ
Product Description

Product Overview

The Hongming Huaci Technology Co., Ltd. Multilayer Ceramic Capacitors (MLCC) - General Purpose Series (4V~63V) are designed for high-density and high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G, C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in small dimensions. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.

Product Attributes

  • Brand: Hongming Huaci Technology Co., Ltd.
  • Series: General Purpose Series (4V~63V)
  • Origin: Suining, China (Implied by supplier name)
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Category Specification Details
Product Information Part Name Multilayer Ceramic Capacitors
Supplier Suining Hongming Huaci Technology Co., Ltd.
Version HC202002
Series & Size Series General Purpose Series (4V~63V)
Specification (Size) 0201 ~ 1210
Ordering Information (Example: HGC 0805 R7 104 K 500 N T H J) Series Code HGC (General Purpose)
Size (Inch/mm) 0201 (0603) to 1210 (3225)
Dielectric Material Code R5=X5R, R7=X7R, G0=C0G
Capacitance Code e.g., 104 = 100nF, 105 = 1F
Tolerance Code A=0.05pF, B=0.1pF, C=0.25pF, D=0.5pF, F=1%, G=2%, J=5%, K=10%, L=15%, M=20%, S=-20%~+50%
Rated Voltage Code 4R0=4Vdc, 6R3=6.3Vdc, 100=10Vdc, 160=16Vdc, 250=25Vdc, 500=50Vdc, 101=100Vdc, etc.
Termination Type Code N=Cu/Ni/Sn, C=Cu/Resin/Ni/Sn
Packaging Type Code T=Paper taping, B=Bulk, S=Embossed taping
Thickness Code (mm) A=0.1mm, B=0.2mm, C=0.3mm, D=0.4mm, E=0.5mm, F=0.6mm, G=0.7mm, H=0.8mm, J=1.0mm, L=1.25mm, P=1.6mm, U=2.0mm, V=2.5mm
Reel Size Code J=7Inch, D=13Inch
Temperature Characteristics Dielectric Reference Temp. Temperature Coefficient Operating Temp. Range
C0G 20C 0 30 ppm/ -55C ~ 125C
C0H 20C 0 60 ppm/ -55C ~ 125C
X7R 20C 15% -55C ~ 125C
X5R 20C 15% -55C ~ 85C
X7S 20C 22% -55C ~ 125C
X6S 20C 22% -55C ~ 105C
External Dimensions (L x W x T) Size Length (mm) Width (mm) Thickness (mm) / Code End Width MB (mm)
0201 (0603) 0.600.03 0.300.03 0.300.03 / C 0.150.05
0402 (1005) 1.000.05 0.500.05 0.500.05 / E 0.250.10
0603 (1608) 1.600.20 0.800.20 0.800.20 / H 0.400.15
0805 (2012) 2.000.20 1.250.20 0.700.10 / G, 0.800.20 / H, 1.250.20 / L 0.500.20
1206 (3216) 3.200.20 1.600.20 0.700.10 / G, 0.800.20 / H, 1.000.10 / J, 1.250.20 / L, 1.600.20 / P 0.600.20
1210 (3225) 3.200.30 2.500.30 1.250.20 / L, 1.600.20 / P, 2.000.20 / U, 2.500.30 / V 0.750.25
Packaging Standard Quantity Size Thickness (mm) / Symbol Paper Tape (7" reel) Plastic Tape (7" reel)
0201 (0603) 0.300.03 / C 15,000 -
0402 (1005) 0.500.05 / E 10,000 -
0603 (1608) 0.800.20 / H 4,000 -
0805 (2012) 0.700.10 / G, 0.800.20 / H 4,000 2,000/3,000 (for L thickness)
1206 (3216) 0.700.10 / G, 0.800.20 / H 4,000 3,000 (for J, L thicknesses)
1210 (3225) 1.250.20 / L, 1.600.20 / P, 2.000.20 / U, 2.500.30 / V - 2,000 (for L, P, U thicknesses), 1,000 (for V thickness)
Capacitance Range & Rated Voltage (Example: C0G dielectric) Dielectric Size Rated Voltage (VDC) Capacitance
C0G / C0H 0201 16, 25, 50 0.3pF to 0.10F
C0G / C0H 0402 25, 50 0.3pF to 0.10F
C0G / C0H 0603 16, 25, 50 0.3pF to 0.10F
C0G / C0H 0805 25, 50 0.3pF to 0.10F
C0G / C0H 1206 10, 16, 25, 50 1.2pF to 0.10F
C0G / C0H 1210 10, 16, 25, 50 1.2pF to 0.10F
X7R 0201 6.3, 10, 16, 25, 50 100pF to 0.10F
X7R 0402 6.3, 10, 16, 25, 50 100pF to 0.12F
X7R 0603 6.3, 10, 16, 25, 50 100pF to 0.15F
X7R 0805 6.3, 10, 16, 25, 50 100pF to 1.0F
X7R 1206 6.3, 10, 16, 25, 50 100pF to 1.0F
X7R 1210 10, 16, 25, 50 100pF to 47F
X7S 0402 6.3, 10, 16, 25 1.0F to 22F
X7S 0603 6.3, 10, 16, 25 1.0F to 22F
X7S 0805 10, 16, 25, 50, 100 1.0F to 100F
X7S 1206 6.3, 10, 16, 25, 50 1.0F to 100F
X7S 1210 6.3, 10, 16, 25, 50 1.0F to 100F
X5R 0201 6.3, 10, 16, 25, 50 100pF to 0.10F
X5R 0402 6.3, 10, 16, 25, 50 100pF to 0.15F
X5R 0603 6.3, 10, 16, 25, 35, 50 100pF to 0.22F
X5R 0805 6.3, 10, 16, 25, 35, 50 100pF to 1.0F
X5R 1206 6.3, 10, 16, 25, 35, 50 100pF to 1.0F
X5R 1210 4, 6.3, 10, 16, 25, 35, 50 100pF to 220F
X6S 0402 6.3, 10, 16, 25 0.10F to 3.3F
X6S 0603 4, 6.3, 10, 16, 25 0.10F to 3.3F
X6S 0805 4, 6.3, 10, 16, 25, 50 0.10F to 4.7F
X6S 1206 4, 6.3, 10, 16, 25, 50 0.10F to 10F
X6S 1210 4, 6.3, 10, 16, 25, 50 0.10F to 10F
Reliability Test Item Technical Requirements Test Method
Appearance No remarkable defects or abnormalities. Microscope (10)
Size Within specified size range. Vernier caliper
Capacitance (Class I) Within specified tolerance. 253C, 1MHz10% (C1000pF), 1KHz10% (C>1000pF), 1.00.2Vrms
Capacitance (Class II) Within specified tolerance. 253C, 1KHz10% (C10F), 12024 Hz (C>10F), 1.00.2Vrms (C10F), 0.50.1Vrms (C>10F)
Dissipation Factor (DF, tan) (Class I) Specified DF standards based on capacitance. 253C, 1MHz10% (C1000pF), 1KHz10% (C>1000pF), 1.00.2Vrms
Dissipation Factor (DF, tan) (Class II) Specified DF standards based on rated voltage and capacitance. 253C, 1KHz10% (C10F), 12024 Hz (C>10F), 1.00.2Vrms (C10F), 0.50.1Vrms (C>10F)
Insulation Resistance (IR) (Class I) Ri50000M (C10nF), RiCR500S (C>10nF) Rated voltage, 605s, 50mA charge/discharge current, 253C, 75% RH
Insulation Resistance (IR) (Class II) Ri10000M (C25nF), RiCR100S (C>25nF) Rated voltage, 605s, 50mA charge/discharge current, 253C, 75% RH
Dielectric Withstanding Voltage (DWV) No breakdown or damage. Class I: 300% Rated voltage; Class II: 250% Rated voltage, 1-5s
Solderability 95% tin coverage, no visible damage. Lead-free: 2455C for 20.5s; Leaded: 2355C for 20.5s, after 10-30s preheat at 80-120C.
Termination Adhesion No visible damage. Force applied based on size (2N for 0201, 5N for 0402-0805, 10N for 1206) for 101s.
Resistance to Soldering Heat C/C, DF, IR within limits; no visible damage, 95% tin coverage. Solder temp: 2655C for 101s, after 20.5min preheat at 100-200C (Class II), 24h recovery. (1210+ use reflow)
Moisture Resistance (Steady State) C/C, DF, IR within limits; no visible damage. 402C, 90%-95%RH for 500h, 24h recovery.
Temperature Cycle C/C within limits. 5 cycles: -55C (30min) -> +20C (2-3min) -> Upper limit temp (30min) -> +20C (2-3min). 24h recovery.
Durability C/C, DF, IR within limits; no visible damage. 1.5x Rated Voltage at elevated temperatures (125C/85C/105C) for 1000h, 24h recovery.
Packaging Dimensions Type Dimensions (mm) Details
Paper Taping (0201/0402) A0, B0, W, F, E, P1, P2, P0, D0, T Specific dimensions provided for each size.
Paper Taping (0603, 0805, 1206) A, B, C, D, E, F, G, H, J, T Specific dimensions provided for each size.
Embossed Taping (0805~1210) A, B, C, D, E, F, G, H, J, T Specific dimensions provided for each size.
Reel Dimensions 7" Reel, 13" Reel, 12mm/7" Reel A, B, C, D, E, F, G Specific dimensions provided for each reel size.
Taping Specification Top tape peeling strength 0.1N < peeling strength < 0.7N Paper Taping & Embossed Taping
Storage Methods Storage Temperature 5C ~ 40C Guaranteed solderability for 6 months.
Storage Methods Storage Relative Humidity 20% ~ 70% Guaranteed solderability for 6 months.
Precautions for Use General MLCCs may fail short or open circuit. Exceeding ratings or severe conditions can lead to burn out, flaming, or explosion. Follow specifications and contact technical department for clarification.
Soldering Profile Follow recommended temperature profiles to avoid cracks or explosions due to sudden temperature changes. (Refer to enclosure graphs).
Manual Soldering Handle with care to avoid thermal shock. Pay attention to soldering iron tip selection and temperature control. Avoid direct contact with ceramic body.
Optimum Solder Amount Reflow Soldering Optimal solder fillet amounts for reflow soldering.
Optimum Solder Amount Wave Soldering Optimal solder fillet amounts for wave soldering.
Optimum Solder Amount Manual Rework Optimal solder fillet amounts for rework.
Recommended Soldering Temperature Profile Reflow Soldering (Leaded/Lead-free) Specific temperature profiles provided. T 150C for HGC0201/0402/0603/0805/1206, T 130C for HGC1210.
Recommended Soldering Temperature Profile Wave Soldering Specific temperature profiles provided. T 150C for HGC0603/0805/1206.
Recommended Soldering Temperature Profile Hand Soldering Conditions: Preheating T130C, Max temp 350C, Max power 20W, Tip diameter 1mm recommended, Max 3s soldering time, Solder paste 1/2 chip thickness. Avoid direct contact with ceramic.
Typical Characteristic Data Graphs |Z|-Frequency Characteristics, Temperature Characteristics, DC Bias Characteristics. (Note: Characteristics are for reference only).

2410121645_Chinocera-HGC0402R5226M100NTEJ_C22367823.pdf

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