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quality High Density SMT Multilayer Ceramic Capacitors Chinocera HGC0805S6106K160NSLJ with Wide Voltage Range factory
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quality High Density SMT Multilayer Ceramic Capacitors Chinocera HGC0805S6106K160NSLJ with Wide Voltage Range factory
>
Specifications
Voltage Rating:
16V
Capacitance:
10uF
Temperature Coefficient:
X6S
Tolerance:
±10%
Mfr. Part #:
HGC0805S6106K160NSLJ
Package:
0805
Key Attributes
Model Number: HGC0805S6106K160NSLJ
Product Description

Product Overview

The Suining Hongming Huaci Technology Co., Ltd. Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency SMT applications. These general-purpose series capacitors are available in sizes from 0201 to 1210 and offer a voltage range from 4V to 63V. Manufactured with NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, they provide excellent electrical performance and high reliability. Ideal for general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.

Product Attributes

  • Brand: HGC
  • Supplier: Suining Hongming Huaci Technology Co., Ltd.
  • Series: General Purpose Series (4V~63V)
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
  • Origin: China (implied by supplier name)

Technical Specifications

Category Specification Details
Product Name Multilayer Ceramic Capacitors
Series General Purpose Series (4V~63V)
Available Sizes 0201 to 1210
Model Designation Series Code: HGC
Size (inch/mm) 0201(0603), 0402(1005), 0603(1608), 0805(2012), 1206(3216), 1210(3225)
Dielectric R5=X5R, R7=X7R, G0=C0G
Capacitance e.g., 104=100nF, 105=1F, 106=10F (Refer to detailed tables for specific values)
Tolerance A=0.05pF, B=0.1pF, C=0.25pF, D=0.5pF, F=1%, G=2%, J=5%, K=10%, L=15%, M=20%, S=-20%~+50%
Rated Voltage 4R0=4Vdc, 6R3=6.3Vdc, 100=10Vdc, 160=16Vdc, 250=25Vdc, 500=50Vdc, 101=100Vdc (Refer to detailed tables for specific values)
Termination Type N=Cu/Ni/Sn, C=Cu/Resin/Ni/Sn
Packaging T=Paper taping, B=Bulk, S=Embossed taping
Thickness Code A=0.1mm, B=0.2mm, C=0.3mm, D=0.4mm, E=0.5mm, F=0.6mm, G=0.7mm, H=0.8mm, J=1.0mm, L=1.25mm, P=1.6mm, U=2.0mm, V=2.5mm
Reel Size J=7Inch, D=13Inch (12mm width tape)
Temperature Coefficient / Characteristics Dielectric Reference Temp. Temp. Coefficient Operating Temp. Range
C0G 20 30 ppm/ -55125
C0H 20 60 ppm/ -55125
X7R 20 15% -55125
X5R 20 15% -5585
X7S 20 22% -55125
X6S 20 22% -55105
External Dimensions (mm) Size Length (L) Width (W) Thickness (T) / Code Termination Width (MB)
0201 (0603) 0.600.03 0.300.03 0.300.03 C 0.150.05
0402 (1005) 1.000.05 0.500.05 0.500.05 E 0.250.10
0603 (1608) 1.600.20 0.800.20 0.800.20 H 0.400.15
0805 (2012) 2.000.20 1.250.20 0.700.10 G / 0.800.20 H / 1.250.20 L 0.500.20
1206 (3216) 3.200.20 1.600.20 0.700.10 G / 0.800.20 H / 1.000.10 J / 1.250.20 L / 1.600.20 P 0.600.20
1210 (3225) 3.200.30 2.500.30 1.250.20 L / 1.600.20 P / 2.000.20 U / 2.500.30 V 0.750.25
Packaging Standard Quantity Size Thickness (mm)/Symbol Paper Tape (7" Reel) Plastic Tape (7" Reel)
0201 (0603) 0.300.03 C 15,000 -
0402 (1005) 0.500.05 E 10,000 -
Capacitance Range and Rated Voltage Dielectric Size Rated Voltage (VDC) Capacitance
C0G, C0H 0201 16, 25, 50 0.3pF to 100pF
C0G, C0H 0402 25, 50 0.3pF to 120pF
C0G, C0H 0603 25, 50 0.3pF to 1000pF
C0G, C0H 0805 10, 16, 25, 50 0.3pF to 4700pF
C0G, C0H 1206 10, 16, 25, 50 1.2pF to 0.10F
C0G, C0H 1210 10, 16, 25, 50 1.2pF to 0.10F
X7R 0201 6.3, 10, 16, 25, 50 100pF to 0.10F
X7R 0402 6.3, 10, 16, 25, 50 100pF to 0.12F
X7R 0603 6.3, 10, 16, 25, 50 100pF to 0.15F
X7R 0805 6.3, 10, 16, 25, 50 100pF to 1.0F
X7R 1206 6.3, 10, 16, 25, 50 100pF to 1.0F
X7R 1210 10, 16, 25, 50 100pF to 47F
X7S 0402 6.3, 10, 16, 25 1.0F to 0.082F
X7S 0603 6.3, 10, 16, 25 1.0F to 0.10F
X7S 0805 10, 16, 25, 50, 100 1.0F to 0.10F
X7S 1206 6.3, 10, 16, 25, 50 1.0F to 0.10F
X7S 1210 6.3, 10, 16, 25, 50 1.0F to 100F
X5R 0201 6.3, 10, 16, 25, 50 100pF to 0.10F
X5R 0402 6.3, 10, 16, 25, 50 100pF to 0.15F
X5R 0603 6.3, 10, 16, 25, 35, 50 100pF to 0.22F
X5R 0805 6.3, 10, 16, 25, 35, 50 100pF to 1.0F
X5R 1206 6.3, 10, 16, 25, 35, 50 100pF to 1.0F
X5R 1210 4, 6.3, 10, 16, 25, 35, 50 100pF to 100F
X6S 0402 6.3, 10, 16, 25 0.10F to 0.47F
X6S 0603 4, 6.3, 10, 16, 25 0.10F to 0.47F
X6S 0805 4, 6.3, 10, 16, 25, 50 0.10F to 4.7F
X6S 1206 4, 6.3, 10, 16, 25, 50 0.10F to 10F
X6S 1210 4, 6.3, 10, 16, 25, 50 0.10F to 100F
Reliability Test (Appearance & Electrical Performance) Item Technical Requirements Test Method
Capacitance (Class I) Within specified tolerance 253, 1MHz10% or 1KHz10%
Capacitance (Class II) Within specified tolerance 253, 1KHz10% or 12024 Hz
Dissipation Factor (DF) Refer to table 253, 1KHz10% or 12024 Hz
Insulation Resistance (IR) Refer to table 253, 75% RH
Dielectric Withstanding Voltage (DWV) No breakdown or damage 300% Rated Voltage (Class I), 250% Rated Voltage (Class II) for 1-5s
Solderability 95% coverage 2355 (Leaded), 2455 (Lead-free) for 20.5s
Termination Adhesion No visible damage 2N (0201), 5N (0402-0805), 10N (1206) for 101s
Resistance to Soldering Heat C/C 0.5% (Class I), -5%~+10% (Class II); DF & IR within initial standards; No visible damage Preheating, 2655 for 101s, followed by 24h recovery
Resistance to Flexure of Substrate C/C 10%; No visible damage 1.60.2mm PCB, 1mm flexure, 51s hold
Moisture Resistance (Steady State) C/C 2% or 1pF (Class I), 10% (Class II); DF & IR within limits; No damage 402, 90%-95% RH for 500h, followed by 24h recovery
Temperature Cycle C/C 1% or 1pF (Class I), 10% (Class II) 5 cycles of -55 to +125 (or other specified temps), 30 min per step, followed by 24h recovery
Durability C/C 2% or 1pF (Class I), 20% (Class II); DF & IR within limits; No damage 1.5x Rated Voltage at elevated temperatures (125/85/105) for 1000h, followed by 24h recovery
Packaging Structure Paper Taping Dimensions Refer to detailed diagrams (0201, 0402, 0603, 0805, 1206)
Embossed Taping Dimensions Refer to detailed diagrams (0805~1812)
Reel Dimensions 7" Reel, 13" Reel (8mm, 12mm width tapes)
Storage Methods Guaranteed Solderability Period: 6 months (under delivered package condition) Storage Conditions: Temperature: 5~40, Relative Humidity: 20%~70%
Precautions For Use MLCCs may fail short or open circuit. Avoid severe conditions beyond ratings. Follow specifications and contact technical department for clarification.
Soldering Profile Refer to temperature profile charts for Reflow Soldering (Leaded/Lead-free), Wave Soldering, and Hand Soldering to prevent cracking or explosion due to sudden temperature changes. Maintain minimal temperature differentials (T) during preheating.
Typical Characteristic Data Graph |Z|-Frequency Characteristics, Temperature Characteristics, DC Bias Characteristics (for reference only)

2410121645_Chinocera-HGC0805S6106K160NSLJ_C7472964.pdf

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