86--15347289033
feliciazhou@pa.ecer.com
Online Service

Online Service

Contact Person
feliciazhou@pa.ecer.com
8615347289033
+86 136 6733 2386
quality High Reliability Multilayer Ceramic Capacitors Chinocera HGC1206R5226K160NSPJ in General Purpose Series factory
<
quality High Reliability Multilayer Ceramic Capacitors Chinocera HGC1206R5226K160NSPJ in General Purpose Series factory
>
Specifications
Voltage Rating:
16V
Capacitance:
22uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
HGC1206R5226K160NSPJ
Package:
1206
Key Attributes
Model Number: HGC1206R5226K160NSPJ
Product Description

Product Overview

The Suining Hongming Huaci Technology Co., Ltd. Multilayer Ceramic Capacitors (MLCC) - General Purpose Series (4V~63V) are designed for high-density, high-efficiency surface mount technology (SMT) applications. These capacitors are manufactured using NP0 (C0G, C0H), X7R, X5R, X7S, and X6S dielectric materials, offering excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in small dimensions. Applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.

Product Attributes

  • Brand: HGC
  • Supplier: Suining Hongming Huaci Technology Co., Ltd.
  • Series: General Purpose Series (4V~63V)
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Specification Details
Part Name MULTILAYER CERAMIC CAPACITORS
Series General Purpose Series (4V~63V)
Available Sizes 0201 ~ 1210
How to Order (Example Breakdown) HGC (Series) + 0805 (Size) + R7 (Dielectric) + 104 (Capacitance) + K (Tolerance) + 500 (Rated Voltage) + N (Termination) + T (Packaging) + H (Thickness) + J (Reel Size)
Dielectric Characteristics
  • C0G/C0H: Temperature Coefficient: 30 ppm/ (030 ppm/), Operating Temperature: -55125
  • X7R: Temperature Coefficient: 15%, Operating Temperature: -55125
  • X5R: Temperature Coefficient: 15%, Operating Temperature: -5585
  • X7S: Temperature Coefficient: 22%, Operating Temperature: -55125
  • X6S: Temperature Coefficient: 22%, Operating Temperature: -55105
Product Peripheral Dimensions (Example: 0201)
  • Size: 0201 (0603)
  • Length (L): 0.600.03 mm
  • Width (W): 0.300.03 mm
  • Thickness (T): 0.300.03 mm (Symbol C)
  • Terminal Width (MB): 0.150.05 mm
  • Soldering Method: R (Reflow Soldering)
Packaging Standard Quantity (Example: 0201)
  • Size: 0201 (0603)
  • Thickness (Symbol C): 0.300.03 mm
  • Paper Tape (7" reel): 15,000 pcs
Capacitance Range and Rated Voltage (Partial Example: C0G Dielectric)
  • Size 0201: Capacitance from 0.3pF (0R3) to 0.10F (104) with Rated Voltages 16V, 25V, 50V.
  • Size 1210: Capacitance from 1.2pF (1R2) to 0.10F (104) with Rated Voltages 10V, 16V, 25V, 50V.
Capacitance Range and Rated Voltage (Partial Example: X7R Dielectric)
  • Size 0201: Capacitance from 100pF (101) to 0.10F (104) with Rated Voltages 6.3V, 10V, 16V, 25V, 50V.
  • Size 1210: Capacitance from 10pF (102) to 47F (476) with Rated Voltages 10V, 16V, 25V, 50V.
Reliability Test - Appearance & Electrical Performance
  • Appearance: No remarkable defects or abnormalities.
  • Size: Within specified range.
  • Capacitance: Within specified tolerance (Class I: 1MHz/1KHz; Class II: 1KHz/120Hz).
  • Dissipation Factor (DF): Specified limits for Class I and Class II based on voltage and capacitance.
  • Insulation Resistance (IR): Specified limits for Class I and Class II based on capacitance.
  • Dielectric Withstanding Voltage (DWV): No breakdown or damage (Class I: 300% rated voltage; Class II: 250% rated voltage).
  • Solderability: 95% tin coverage, no visible damage.
  • Termination Adhesion: No visible damage, specified force and time.
  • Resistance to Soldering Heat: Within specified C/C, DF, IR, and appearance limits.
  • Resistance to Flexure of Substrate: C/C 10%, no visible damage.
  • Moisture Resistance (Steady State): Specified C/C, DF, IR, and appearance limits after 500 hours at 402, 90%~95%RH.
  • Temperature Cycle: Specified C/C limits after 5 cycles between -55 and +125 (or other specified temperatures).
  • Durability: Specified C/C, DF, IR, and appearance limits after 1000 hours at elevated temperature and voltage.
Packaging - Paper Taping Dimensions
  • 0201/0402: Specific dimensions for A0, B0, W, F*, E, P1, P2*, P0, D0, T.
  • 0603, 0805, 1206: Specific dimensions for A, B, C, D*, E, F, G*, H, J, T.
Packaging - Embossed Taping Dimensions
  • 0805~1812: Specific dimensions for Tapesize, A, B, C, D*, E, F, G*, H, J, T.
Reel Dimensions
  • 8mm/7' REEL: 1782.0 mm (A), 3.0 mm (B), 130.5 mm (C), 210.8 mm (D), 50 or more (E), 10.01.5 mm (F), 14.4max (G).
  • 13' REEL: 3302.0 mm (A), 3.0 mm (B), 130.5 mm (C), 210.8 mm (D), 50 or more (E), 10.01.5 mm (F), 14.4max (G).
  • 12mm/7' REEL: 1782.0 mm (A), 3.0 mm (B), 130.5 mm (C), 210.8 mm (D), 50 or more (E), 13.41.5 mm (F), 18.4max (G).
Taping Specification
  • Paper Taping: Standard: 0.1N < peeling strength < 0.7N.
  • Embossed Taping: Standard: 0.1N < peeling strength < 0.7N.
Storage Methods
  • Guaranteed Solderability Period: 6 months (under delivered package condition).
  • Storage Conditions: Temperature: 5~40, Relative Humidity: 20%~70%.
Precautions For Use
  • MLCCs may fail in short or open circuits, and can burn, flame, or explode under severe conditions exceeding ratings. Follow specifications and contact technical department for unclear issues.
  • Soldering Conditions: Follow temperature profile charts to avoid cracking or explosion due to sudden temperature changes.
  • Manual Soldering: Handle carefully to avoid thermal shock, select soldering iron tip and control temperature precisely. Avoid direct contact of soldering iron tip with ceramic body.
  • Optimum Solder Amount: Ensure appropriate solder amount to avoid chip damage (too much) or poor connection (too little).
  • Recommended Soldering Temperature Profiles: Provided for Reflow Soldering (SnPb and Lead-free) and Wave Soldering.
  • Reflow/Wave Soldering Temperature Differential (T): Specified limits for different series (e.g., T150 for HGC0201/HGC0402/HGC0603/HGC0805/HGC1206).
  • Hand Soldering Conditions: Preheating 130, Max Iron Temperature 350, Max Power 20W, Recommended Tip Diameter 1mm, Max Soldering Time 3s, Solder Paste 1/2 chip thickness. Avoid direct contact between soldering iron head and ceramic components.
Typical Characteristic Data Graph
  • |Z|-Frequency Characteristics Curve
  • Temperature Characteristics
  • DC Bias Characteristics

2410121645_Chinocera-HGC1206R5226K160NSPJ_C7472971.pdf

Request A Quote

Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible

You Can Upload Up To 5 Files And Each File Sized 10M Max