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Specifications
Voltage Rating:
6.3V
Capacitance:
22uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
HGC0402R5226M6R3NTEJ
Package:
0402
Key Attributes
Model Number:
HGC0402R5226M6R3NTEJ
Product Description
Product Overview
The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density, high-efficiency surface-mount applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in small form factors. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: HGC
- Supplier: (Suining Hongming Huaci Technology Co., Ltd.)
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Details |
|---|---|
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] |
| Available Sizes (Inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) |
| Rated Voltage Range | 4Vdc to 630Vdc (Specific values include 4R0, 6R3, 100, 160, 250, 500, 101, 201, 251, 501, 631) |
| Capacitance Range | 0.3pF to 220F (Refer to detailed tables for specific dielectric and size combinations) |
| Tolerance Levels | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% |
| Temperature Coefficients / Characteristics |
|
| Product Dimensions (L x W x T) |
|
| Termination Types | Cu/Ni/Sn (N) |
| Packaging Options | Paper taping (T), Bulk packaging (B), Embossed taping (S) |
| Reel Sizes | 7 Inch (J, K), 13 Inch (D) |
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) |
| Reliability Test Standards | Appearance, Dimensions, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance, Temperature Cycle, Durability. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% |
| Guaranteed Solderability Period | 6 months (Under deliver package condition) |
2410121645_Chinocera-HGC0402R5226M6R3NTEJ_C7432764.pdf
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