Product Overview
The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density, high-efficiency SMT applications. Available in sizes from 0201 to 1210, these capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering excellent electrical performance and high reliability. They are suitable for general digital circuits, power supply bypass capacitors, consumer electronics, and telecommunication applications.
Product Attributes
- Brand: HGC
- Supplier: (Suining Hongming Huaci Technology Co., Ltd.)
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Specification | Details | ||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Name | Multilayer Ceramic Capacitors | ||||||||||||||||||||||||||||||||||||||||||
| Series | General Purpose Series (4V~63V) | ||||||||||||||||||||||||||||||||||||||||||
| Specification (Size) | 0201 ~ 1210 | ||||||||||||||||||||||||||||||||||||||||||
| Supplier | Suining Hongming Huaci Technology Co., Ltd. | ||||||||||||||||||||||||||||||||||||||||||
| Issue Date | 20201116 | ||||||||||||||||||||||||||||||||||||||||||
| Product Features | Wide selection of sizes (0201 to 1210), High capacity in small size. | ||||||||||||||||||||||||||||||||||||||||||
| Applications | General digital circuits, Power supply bypass capacitors, Consumer electronics, Telecommunication. | ||||||||||||||||||||||||||||||||||||||||||
| How to Order (Example Structure) | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | ||||||||||||||||||||||||||||||||||||||||||
| Temperature Coefficient/Characteristics |
| ||||||||||||||||||||||||||||||||||||||||||
| Product Peripheral Dimensions |
| ||||||||||||||||||||||||||||||||||||||||||
| Packaging Standard Quantity |
| ||||||||||||||||||||||||||||||||||||||||||
| Reliability Test - Appearance and Electrical Performance |
| ||||||||||||||||||||||||||||||||||||||||||
| Storage Methods | Guaranteed solderability for 6 months. Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%. | ||||||||||||||||||||||||||||||||||||||||||
| Precautions for Use | MLCCs may fail in short or open circuits. Avoid severe conditions beyond ratings. Follow safety precautions and application notes. Refer to technical department for any uncertainties. | ||||||||||||||||||||||||||||||||||||||||||
| Soldering Profile | Follow recommended temperature curves to avoid cracking or explosion. Refer to enclosure for graphs. | ||||||||||||||||||||||||||||||||||||||||||
| Manual Soldering | Handle carefully to avoid thermal shock. Pay attention to soldering iron tip selection and temperature control. Avoid direct contact with ceramic body. | ||||||||||||||||||||||||||||||||||||||||||
| Optimum Solder Amount | Ensure appropriate solder amount for reflow and wave soldering to prevent damage or poor connection. | ||||||||||||||||||||||||||||||||||||||||||
| Recommended Soldering Temperature Profile | Includes Reflow Soldering (SnPb and Lead-free) and Wave Soldering profiles. Minimize temperature differential (T) during preheating (T150 for most sizes, T130 for HGC1210). Hand soldering: Max 350, Max 20W, Max 3s, avoid direct contact with ceramic. | ||||||||||||||||||||||||||||||||||||||||||
| Typical Characteristic Data Graph | Includes |Z|-Frequency Characteristics, Temperature Characteristics, and DC Bias Characteristics. (Note: These are for reference only.) |
2410121645_Chinocera-HGC1206R7333K500NTHJ_C5186847.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible