Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency Surface Mount Technology (SMT) applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in compact dimensions. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: Hongming Huaci Technology
- Supplier: (Suining Hongming Huaci Technology Co., Ltd.)
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Specification | Details | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Model Naming Convention | HGC [Series] [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | ||||||||||||
| Available Sizes (Inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) | ||||||||||||
| Dielectric Characteristics |
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| Rated Voltages (VDC) | 4V, 6.3V, 10V, 16V, 25V, 50V, 100V, 200V, 250V, 500V, 630V, 1kV, 1.5kV, 2kV, 2.5kV, 3kV, 4kV, 5kV, 6kV | ||||||||||||
| Capacitance Range | 0.3pF to 220F (varies by dielectric and size) | ||||||||||||
| Tolerance | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% | ||||||||||||
| Termination Types | Cu/Ni/Sn (N) | ||||||||||||
| Packaging Options | Paper taping (T), Bulk (B), Embossed taping (S) | ||||||||||||
| Reel Sizes | 7 Inch (J, K), 13 Inch (D) | ||||||||||||
| Dimensions (L x W x T in mm) |
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| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) | ||||||||||||
| Reliability Test Standards | Appearance, Dimensions, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability. | ||||||||||||
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability for 6 months) |
2410121645_Chinocera-HGC1210R5106K500NSVK_C7432789.pdf
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