Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency Surface Mount Technology (SMT) applications. These general-purpose series capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in small form factors. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: Hongming Huaci Technology
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Name | Multilayer Ceramic Capacitors | |
| Series | General Purpose Series (4V~63V) | |
| Available Sizes | 0201 ~ 1210 | |
| General Info | Suitable for high density and high efficiency SMT applications. | |
| Features | Wide selection of sizes (0201 to 1210). High capacity achieved in small sizes. | |
| Applications | General digital circuits, Power supply bypass, Consumer electronics, Telecommunication industry. | |
| Model Designation | HGC (Series) + Size + Dielectric + Capacitance + Tolerance + Rated Voltage + Termination + Packaging + Thickness Code + Reel Size | See detailed breakdown in original document. |
| Temperature Coefficient/Characteristics |
| |
| External Dimensions (Example: 0201) | Length: 0.600.03 mm, Width: 0.300.03 mm, Thickness: 0.300.03 mm | Other sizes available (0402 to 1210). |
| Packaging Standard Quantity (Example: 0201) | Paper tape 7" reel: 15,000 pcs | Various quantities for different sizes and packaging types (Paper tape, Plastic tape). |
| Reliability Test - Appearance & Electrical Performance | Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability. | Detailed requirements and test methods provided in the original document. |
| Storage Method | Guaranteed solderability period: 6 months. Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%. | |
| Precautions for Use | Potential for failure in short/open circuits, risk of fire/explosion under severe conditions. Follow specifications and contact technical department for unclear matters. | |
| Soldering Conditions | Recommended temperature profiles for Reflow Soldering, Wave Soldering, and Hand Soldering. Specific temperature differentials (T) provided for different series. | Detailed profiles and conditions in the original document. |
2410121645_Chinocera-HGC1206R7226M160NSPJ_C7432788.pdf
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