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Specifications
Voltage Rating:
250V
Capacitance:
22pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
HHV0805G0220J251NTGJ
Package:
0805
Key Attributes
Model Number:
HHV0805G0220J251NTGJ
Product Description
Product Overview
The Multi-layer Ceramic Capacitors (MLCC) - Mid-High Volts Series from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface-mount applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R dielectric materials, offering superior electrical performance and high reliability. Key features include high voltage capability within a given case size and excellent stability. They are suitable for a wide range of applications, including analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: HHV
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Series: Mid-High Volts Series
- Dielectric Materials: NP0 (C0G, C0H), X7R, X5R, X6R, X6S, X7S, X7T, X8R
- Origin: China
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Series | Mid-High Volts Series | 100V ~ 3000V |
| Size (Inch/mm) | 0402 (1005) to 1812 (4532) | Specific dimensions provided in detail tables. |
| Temperature Coefficient / Characteristics | C0G (C0H) | 30 ppm/ (-55125) |
| C0H | 60 ppm/ (-55125) | |
| X7R | 15% (-55125) | |
| X7S | 22% (-55125) | |
| Capacitance Range | 0.5pF to 100F (depending on dielectric and size) | Detailed ranges provided in tables. |
| Rated Voltage (VDC) | 100V to 3000V | Specific ratings available per size and dielectric. |
| Tolerance | 0.05pF to 50% | (e.g., 0.05pF, 0.1pF, 1%, 5%, 10%, 20%, -20%~+50%) |
| Termination Options | Cu/Ni/Sn, Cu/Resin/Ni/Sn | N, C |
| Packaging Options | Paper Taping, Bulk, Embossed Taping | T, B, S |
| Reel Size | 7 Inch, 13 Inch | J, D |
| Reliability Test Standards | Appearance, Dimensions, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability | Detailed requirements and test methods provided. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% | Guaranteed solderability period: 6 months. |
| Soldering Methods | Reflow Soldering, Wave Soldering, Manual Soldering | Recommended temperature profiles and conditions provided. |
2410121646_Chinocera-HHV0805G0220J251NTGJ_C5186739.pdf
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