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Specifications
Mfr. Part #:
BTLU0016083G6S1A10
Package:
0603
Key Attributes
Model Number:
BTLU0016083G6S1A10
Product Description
Product Overview
The BTLU0016083G6S1A10 is a miniaturized SMD packaged component designed for LTE mobile systems and WiFi communication. It features a compact, low-profile, and lightweight design, making it ideal for high-frequency and space-limited applications. This component offers low insertion loss and high soldering heat resistance, supporting both flow and re-flow soldering methods. Its internal shielding effectively eliminates noise over a wide frequency range. The product is available in tape and reel packaging for automatic mounting and is RoHS & Halogen Free & REACH Compliant.
Product Attributes
- Brand: Chilisin Electronics Corp
- Certifications: RoHS & Halogen Free & REACH Compliant
- Packaging: Tape and reel for automatic mounting
- Material Type: Indicated by 'xx' in product code (specific material not detailed)
- Origin: Taiwan (Chilisin Electronics Corp)
Technical Specifications
| Part Number | Frequency Bandwidth | VSWR | Insertion Loss in BW | Phase Difference at Balance Port | Amplitude Imbalance at Balance Port | Impedance (Unbalance / Balance Port) | Operating Temperature Range | Power Capacity |
|---|---|---|---|---|---|---|---|---|
| BTLU0016083G6S1A10 | 3600 MHz 300 MHz | 2 max. | 1 dB max. | 18015 | 1.2 dB max. | 50 / 100 | -40~85C | 3W max. |
Dimensions
| Designation | L | W | T | a | b | c | p |
|---|---|---|---|---|---|---|---|
| Dimensions (mm) | 1.600.15 | 0.800.10 | 0.600.10 | 0.200.10 | 0.150.10 | 0.200.15 | 0.500.05 |
Port Identification
- Unbalanced Port
- GND or DC feed + RF GND
- Balanced Port1
- Balanced Port2
- GND
- N.C
Mechanical Test Specifications
| Test Item | Test Condition | Specification |
|---|---|---|
| Vibration | 10 Hz/min~55 Hz/min~10 Hz/min vibration frequency with 1.5 mm amplitude for two hours in x, y, z directions | No apparent damage |
| Drop shock | Dropped onto printed circuit board from 100cm height three times in x, y, z directions. The terminals shall be protected. | No apparent damage |
| Soldering heat resistance | Preheating: 15010 (1-2 min); Solder bath: 2605 (50.5 sec) | No apparent damage |
| Bending test onto printed circuit board | Apply load until bending reaches 2 mm on recommended PCB pattern. | No apparent damage |
| Solderability | Dipped surface of the terminal shall be at least 75% covered with solder after dipped in solder bath of 2455 for 30.5 seconds. | No apparent damage |
Environmental Test Specifications
| Test Item | Test Condition | Specification |
|---|---|---|
| Thermal shock | -40~85 for 100 cycles (30 min per cycle) | No apparent damage; Fulfill electrical spec. after test |
| Humidity resistance | 852, 80~90% R.H. for 500 hours | No apparent damage; Fulfill electrical spec. after test |
| High temperature resistance | 852 for 500 hours | No apparent damage; Fulfill electrical spec. after test |
| Low temperature resistance | -403 for 500 hours | No apparent damage; Fulfill electrical spec. after test |
Taping Specifications
| Series | PCS/Reel | P (mm) | TYPE | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) |
|---|---|---|---|---|---|---|---|---|---|
| 5824 | 5000 | 4 | 8 mm | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | - |
| 5724 | 3000 | 4 | 12 mm | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
| 5320 | 1000 | 4 | 12 mm | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
| 5220 | 2000 | 4 | 12 mm | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
| 4532 | 2500 | 4 | 12 mm | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
| 4516 | 3000 | 4 | 12 mm | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
| 3225 | 4000 | 4 | 12 mm | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
| 3216 | 10000 | 4 | 12 mm | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
| 2520 | 10000 | 4 | 12 mm | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
| 2012 | 10000 | 4 | 12 mm | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
| 1608 | 10000 | 4 | 12 mm | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
| 1109 | 10000 | 4 | 12 mm | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
| 1005 | 10000 | 4 | 12 mm | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
Reel Dimensions
| No. of Reels | W (cm) | L (cm) | H (cm) |
|---|---|---|---|
| 2 | 180.5 | 180.5 | 2.40.2 |
| 3 | 180.5 | 180.5 | 3.60.2 |
| 4 | 180.5 | 180.5 | 4.80.2 |
| 5 | 180.5 | 180.5 | 6.00.2 |
Soldering Temperature Profile
| Feature | Sn-Pb | Pb-Free |
|---|---|---|
| Preheat ts (seconds) | 60~120 | 60~180 |
| Tsmin () | 100 | 150 |
| Tsmax () | 150 | 200 |
| Average ramp-up rate (Tsmax to TP) (/second) | 3 max. | 3 max. |
| Time main above Temperature (TL) () | 183 | 217 |
| Time (tL) (seconds) | 60~150 | 60~150 |
| Peak temperature (TP) () | 230 | 250~260 |
| Time within 5 of actual peak temperature (tP) (seconds) | 10 | 10 |
| Ramp-down rate (/sec) | 6 max. | 6 max. |
| Time 25 to peak temperature (minutes) | 6 max. | 8 max. |
Important Notes
- The temperature should be within -40~85 and humidity should be less than 75% RH.
- The product should be used within 6 months from the time of delivery.
- PCB shall be designed so that products are not subjected to mechanical stress from board warpage. Product shall be located in the sideways direction to the mechanical stress.
- Products (A,B,C,D) shall be located carefully so that products are not subjected to mechanical stress due to warping the board. They may be subjected to mechanical stress in the order of A>C>BD.
- The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order.
2411220122_Chilisin-BTLU0016083G6S1A10_C2981222.pdf
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