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Specifications
Impedance:
50Ω
Insertion Loss:
1.8dB
Mfr. Part #:
BTLB0020123G6H6A10
Package:
0805
Key Attributes
Model Number:
BTLB0020123G6H6A10
Product Description
Product Overview
The Chilisin BTLB0020123G6H6A10 is a miniaturized SMD component designed for high-frequency and space-limited applications, including WLAN, Bluetooth, and Home RF. It features a compact, low-profile, and lightweight design with internal shielding. This component offers low insertion loss and high attenuation across a wide frequency range, making it ideal for noise elimination. Its high soldering heat resistance supports both flow and re-flow soldering methods, and it is available in tape and reel packaging for automatic mounting.
Product Attributes
- Brand: Chilisin
- RoHS & Halogen Free & REACH Compliance
- Packaging: Tape and reel for automatic mounting
Technical Specifications
| Part Number | Pass Band | Insertion Loss in BW | VSWR In BW | Attenuation | Operating Temperature Range | Power Capacity |
|---|---|---|---|---|---|---|
| BTLB0020123G6H6A10 | 3300~3900 MHz | 1.8 dB max. | 2 max. | 15 dB min. at 100~2600 MHz 20 dB min. at 6000~9000 MHz | -40~85C | 3W max. |
Dimensions
| Dimension | Value (mm) |
|---|---|
| L (a) | 2.000.15 |
| W (b) | 1.250.15 |
| T (c) | 0.950.10 |
| Height (d) | 1.60+0.10 -0.15 |
| Terminal (e) | 0.30+0.10 -0.15 |
| Terminal (f) | 0.300.20 |
| Terminal (g) | 0.300.20 |
Mechanical & Environmental Tests
| Test Item | Test Condition | Specification |
|---|---|---|
| Vibration | 10 Hz/min~55 Hz/min~10 Hz/min vibration frequency with 1.5 mm amplitude for two hours in x, y, z directions | No apparent damage |
| Drop shock | Dropped onto printed circuit board from 100cm height three times in x, y, z directions. The terminals shall be protected. | No apparent damage |
| Soldering heat resistance | Preheating temperature: 15010 (1-2 min), Solder bath temperature: 2605 (50.5 sec) | No apparent damage |
| Bending test onto printed circuit board | Apply load until bending reaches 2 mm on recommended PCB pattern. | No apparent damage |
| Solderability | Dipped in solder bath of 2455 for 30.5 seconds. | At least 75% covered with solder. |
| Thermal shock | -40~85 for 100 cycles (30 min each cycle) | No apparent damage; Fulfill electrical spec. after test |
| Humidity resistance | 852, 80~90% R.H. for 500 hours | No apparent damage; Fulfill electrical spec. after test |
| High temperature resistance | 852 for 500 hours | No apparent damage; Fulfill electrical spec. after test |
| Low temperature resistance | -403 for 500 hours | No apparent damage; Fulfill electrical spec. after test |
Taping Specifications
| Series | PCS/Reel | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) |
|---|---|---|---|---|---|---|---|
| 5824 | 5000 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
| 5724 | 3000 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
| 5320 | 1000 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
| 5220 | 2000 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
| 4532 | 2500 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
| 4516 | 3000 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
| 3225 | 4000 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
| 3216 | 10000 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
| 2520 | 5000 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
| 2012 | 3000 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
| 1608 | 1000 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
| 1109 | 2000 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
| 1005 | 2500 | 1781 | 60+0.5 -0 | 130.2 | 90.5 | 120.5 | 8 mm |
Reel Dimensions
| No. of Reels | W (cm) | L (cm) | H (cm) |
|---|---|---|---|
| 2 | 180.5 | 180.5 | 2.40.2 |
| 3 | 180.5 | 180.5 | 3.60.2 |
| 4 | 180.5 | 180.5 | 4.80.2 |
| 5 | 180.5 | 180.5 | 6.00.2 |
Important Notes
- Operating Temperature: -40~85
- Recommended Storage Conditions: Temperature within -40~85 and humidity less than 75% RH.
- Shelf Life: Product should be used within 6 months from the time of delivery.
- PCB Design: Design PCB to prevent mechanical stress from board wrapage. Locate products in the sideway direction to mechanical stress. Products (A,B,C,D) should be located carefully to avoid stress due to board warping, as stress can be applied in the order of A>C>BD.
2410121527_Chilisin-BTLB0020123G6H6A10_C2981218.pdf
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