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Specifications
Impedance:
50Ω
Insertion Loss:
0.5dB
Mfr. Part #:
BTLL001608JXVSBA10
Package:
0603
Key Attributes
Model Number:
BTLL001608JXVSBA10
Product Description
Product Overview
The Chilisin BTLL001608JXVSBA10 is a miniaturized SMD component designed for high-frequency and space-limited applications. It offers low insertion loss and high attenuation, making it ideal for eliminating noise across a wide frequency range. Its compact size, low profile, and lightweight design, combined with high soldering heat resistance for both flow and re-flow methods, ensure suitability for automatic mounting via tape and reel packaging. This component is RoHS, Halogen Free, and REACH compliant, and is suitable for LTE, WLAN, Bluetooth, and Home RF applications.
Product Attributes
- Brand: Chilisin
- Certifications: RoHS & Halogen Free & REACH Compliance
- Packaging: Tape and reel for automatic mounting
- Series Type: LTE, WLAN, Bluetooth, Home RF
Technical Specifications
| Specification | Value |
| Product Code | BTLL001608JXVSBA10 |
| Dimensions (L x W x H) | 1.600.10 x 0.800.10 x 0.65 max. (mm) |
| Operating Temperature Range | -40~85C |
| Power Capacity | 3W max. |
| Pass Band Insertion Loss | 0.5 dB max. (410~2690 MHz) |
| Return Loss | 10 dB min. |
| Attenuation (4950~6000 MHz) | 35 dB min. |
| Attenuation (6000~7500 MHz) | 35 dB min. |
| Attenuation (7500~8100 MHz) | 35 dB min. |
| Attenuation (8100~12500 MHz) | 27 dB min. |
| Test Instrument | Agilent E5071C Network Analyzer |
| Vibration Test | 10 Hz/min~55 Hz/min~10 Hz/min vibration frequency with 1.5 mm amplitude for two hours in x, y, z directions |
| Drop Shock Test | Dropped onto printed circuit board from 100cm height three times in x, y, z directions. Terminals protected. |
| Soldering Heat Resistance Test | Preheating: 15010 (1-2 min); Solder bath: 2605 (101 sec). Loss of metallization on edges 25%. |
| Bending Test | Apply load until bending reaches 2 mm on test PCB (100 x 40 x 1.6mm). 60sec holding time. |
| Solderability Test | Solder bath: 2455 (31 sec). Solder: Sn3Ag0.5Cu. 95% terminal electrode coverage. |
| Adhesive Strength | 0605~1005 >0.1KgF; 1109~2016 >0.5KgF; 2520~>1KgF |
| Thermal Shock Test | -40~85 for 100 cycles (30 min each cycle). Fulfill electrical spec. after test. |
| Humidity Resistance Test | 852, 80~90% R.H. for 1000 hours. Fulfill electrical spec. after test. |
| High Temperature Resistance Test | 852 for 1000 hours. Fulfill electrical spec. after test. |
| Low Temperature Resistance Test | -403 for 1000 hours. Fulfill electrical spec. after test. |
| Peel-off Force (Cover Tape) | 10 grams in the arrow direction. |
| Taping Quantity (PCS/Reel) | 1608: 10000 |
| Taping Dimensions (W x L x H) | 180.5 x 180.5 x 2.40.2 (for 1608 series) |
| Recommended PCB Design | Line width to match 50 characteristic impedance; avoid mechanical stress from board warpage. |
| Storage Conditions | -40 ~85, humidity < 75% RH. Use within 12 months of delivery. |
| Soldering Temperature Profile (Pb-Free) | Preheat ts: 60~180 sec; Tsmax: 200; TL: 217 (60~150 sec); TP: 250~260 (10 sec); Ramp-down: 6/sec max.; Time to peak: 8 min max. |
2410121541_Chilisin-BTLL001608JXVSBA10_C2981221.pdf
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