Product Overview
The Suining Hongming Huaci Technology Co., Ltd. offers a series of General Purpose Multilayer Ceramic Capacitors (MLCCs) designed for high-density, high-efficiency SMT applications. These capacitors are available in sizes ranging from 0201 to 1210 and are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, ensuring superior electrical performance and high reliability. They are suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| General Information | Product Name | Multilayer Ceramic Capacitors |
| Series | General Purpose Series (4V~63V) | |
| Specification | 0201 ~ 1210 Size | |
| Supplier | Suining Hongming Huaci Technology Co., Ltd. | |
| Product Features | Size Range | 0201 to 1210 |
| Capacity | High capacity in a small size | |
| Applications | General Digital Circuits | |
| Power Supply Bypass | ||
| Consumer Electronics | ||
| Telecommunication Industry | ||
| Temperature Coefficient / Characteristics | Dielectric Type | C0G, C0H, X7R, X5R, X7S, X6S |
| Operation Temperature Range | -55125 (varies by dielectric) | |
| Temperature Coefficient | 30 ppm/ (C0G), 60 ppm/ (C0H), 15% (X7R, X5R), 22% (X7S, X6S) | |
| External Dimensions | Size | 0201 (0.60x0.30mm) to 1210 (3.20x2.50mm) |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) | |
| Packaging | Paper Taping, Embossed Taping, Bulk | |
| Capacitance Range and Rated Voltage | Dielectric | C0G/C0H |
| Sizes | 0201 to 1210 | |
| Rated Voltage (VDC) | 4V to 630V (varies by dielectric and size) | |
| Capacitance | 0.3pF to 0.10F (varies by dielectric and size) | |
| Dielectric | X7R | |
| Capacitance | 100pF to 47F (varies by dielectric and size) | |
| Reliability Test | Appearance, Dimensions, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability. | Detailed requirements and test methods are specified. |
| Storage Method |
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2410121645_Chinocera-HGC1210R5226K350NSVK_C22367836.pdf
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