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Specifications
Mfr. Part #:
BTLB002012NXVKBA10
Package:
0805
Key Attributes
Model Number:
BTLB002012NXVKBA10
Product Description
Product Overview
The Chilisin BTLB002012NXVKBA10 is a miniaturized SMD packaged component designed for N77/N78 band applications. It features a compact, low-profile, and lightweight design, making it ideal for high-frequency and space-limited designs. This component offers low insertion loss, high attenuation, and excellent soldering heat resistance, supporting both flow and re-flow soldering methods. It effectively eliminates noise over a wide frequency range and is available in tape and reel packaging for automatic mounting.
Product Attributes
- Brand: Chilisin
- Certifications: RoHS & Halogen Free & REACH Compliance
- Packaging: Tape and reel for automatic mounting
- Material: LTCC components
- Soldering Methods Supported: Flow and re-flow soldering
Technical Specifications
| Item | Frequency Range (MHz) | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|
| Insertion Loss | 3300~4200 | - | 1.2 | 1.4 | dB |
| Return Loss | 3300~4200 | 10 | 20 | - | dB |
| Attenuation | 450~2200 | 40 | 43 | - | dB |
| Attenuation | 2300~2483 | 37 | 43 | - | dB |
| Attenuation | 2496~2690 | 32 | 40 | - | dB |
| Attenuation | 5150~5850 | 22 | 27 | - | dB |
| Attenuation | 6600~8400 | 25 | 36 | - | dB |
| Attenuation | 9900~12600 | 20 | 41 | - | dB |
| Attenuation | 13200~16800 | 15 | 48 | - | dB |
| Operating Temperature Range: -40~85C | |||||
| Power Capacity: 3W max. | |||||
Dimensions
| Parameter | L | W | T | a | b | c | d | Unit |
|---|---|---|---|---|---|---|---|---|
| Dimensions | 2.000.15 | 1.250.10 | 0.65 max | 0.2750.10 | 0.250.05 | 0.600.10 | 0.950.10 | mm |
Mechanical & Environmental Tests
| Test Item | Test Condition | Specification |
|---|---|---|
| Vibration | 10 Hz/min~55 Hz/min~10 Hz/min vibration frequency with 1.5 mm amplitude for two hours in x, y, z directions | No apparent damage |
| Drop shock | Dropped onto printed circuit board from 100cm height three times in x, y, z directions. The terminals shall be protected. | No apparent damage |
| Soldering heat resistance | Preheating temperature: 15010 (1 to 2 minutes), Solder bath temperature: 2605 (101 seconds) | Loss of metallization on the edges of each electrode shall not exceed 25%. |
| Bending test onto printed circuit board | Solder specimen LTCC components on the test printed circuit board (L: 100 x W: 40 x T: 1.6mm) in appended recommended PCB pattern. Apply the load in direction of the arrow until bending reaches 2 mm. 60sec holding time. | No apparent damage |
| Solderability | Solder bath temperature: 2455, Immersion time: 31 seconds. Solder: Sn3Ag0.5Cu for lead-free | At least 95% of a surface of each terminal electrode must be covered by fresh solder. |
| Adhesive strength | - | 1109~2016 >0.5KgF |
| Thermal shock | -40~85 for 100 cycles each cycle being 30 min | No apparent damage, Fulfill the electrical spec. after test |
| Humidity resistance | 852, 80~90% R.H. for 1000 hours | No apparent damage, Fulfill the electrical spec. after test |
| High temperature resistance | 852 for 1000 hours | No apparent damage, Fulfill the electrical spec. after test |
| Low temperature resistance | -403 for 1000 hours | No apparent damage, Fulfill the electrical spec. after test |
Taping Information
| SERIES | PCS/Reel | W | L | H |
|---|---|---|---|---|
| 5824 | 5000 | 180.5 | 1781 | 2.40.2 |
| 5724 | 3000 | 180.5 | 1781 | 3.60.2 |
| 5320 | 1000 | 180.5 | 1781 | 4.80.2 |
| 5220 | 2000 | 180.5 | 1781 | 6.00.2 |
| 4532 | 2500 | 180.5 | 1781 | - |
| 4516 | 3000 | - | - | - |
| 3225 | 4000 | - | - | - |
| 3216 | 10000 | - | - | - |
| 2520 | - | - | - | - |
| 2012 | - | - | - | - |
| 1608 | - | - | - | - |
| 1005 | - | - | - | - |
Temperature Profile
| Feature | Sn-Pb | Pb-Free |
|---|---|---|
| Preheat ts | 60~120 seconds | 60~180 seconds |
| Tsmin | 100 | 150 |
| Tsmax | 150 | 200 |
| Average ramp-up rate (Tsmax to TP) | 3/second max. | 3/second max. |
| Time main above Temperature (TL) | 183 | 217 |
| Time (tL) | 60~150 seconds | 60~150 seconds |
| Peak temperature (TP) | 230 | 250~260 |
| Time within 5 of actual peak temperature (tP) | 10 seconds | 10 seconds |
| Ramp-down rate | 6/sec max. | 6/sec max. |
| Time 25 to peak temperature | 6 minutes max. | 8 minutes max. |
Note: The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order.
2411220316_Chilisin-BTLB002012NXVKBA10_C2981219.pdf
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