Product Overview
The Suining Hongming Huaci Technology Co., Ltd. offers a series of General Purpose Multilayer Ceramic Capacitors (MLCCs) designed for high-density and high-efficiency Surface Mount Technology (SMT) applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, providing superior electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, these capacitors offer high capacitance in small sizes, making them suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G, C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Name | Multilayer Ceramic Capacitors | HGC Series |
| Series | General Purpose Series | 4V~63V |
| Available Sizes | 0201 ~ 1210 | (0603 to 3225 in mm) |
| Applications | General digital circuits, Power supply bypass, Consumer electronics, Telecommunication | |
| Dielectric Characteristics | C0G/C0H: -55 to 125, 30 ppm/ (C0G), 60 ppm/ (C0H) | |
| X7R: -55 to 125, 15% | ||
| X5R: -55 to 85, 15% | ||
| X7S: -55 to 125, 22% | ||
| X6S: -55 to 105, 22% | ||
| Dimensions (Example: 0805) | Length (L) | 2.00 0.20 mm |
| Width (W) | 1.25 0.20 mm | |
| Thickness (T) | 0.70 0.10 mm (G), 0.80 0.20 mm (H), 1.25 0.20 mm (L) | |
| Termination Width (MB) | 0.50 0.20 mm (G), 0.80 0.20 mm (H), 1.25 0.20 mm (L) | |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) | |
| Packaging | Paper Taping, Embossed Taping, Bulk | 7-inch or 13-inch reels available |
| Rated Voltage | 4Vdc to 630Vdc (depending on dielectric and size) | Specific values listed in section 8 |
| Capacitance Range | 0.3pF to 220F (depending on dielectric and size) | Specific values listed in section 8 |
| Reliability Tests | Appearance, Dimensions, Capacitance, DF, IR, DWV, Solderability, Termination Adhesion, Resistance to Soldering Heat, Flexure, Moisture Resistance, Temperature Cycle, Durability | Details in section 9 |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% | Guaranteed solderability for 6 months |
2410121645_Chinocera-HGC1206R5226K350NSPJ_C22367833.pdf
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