Product Overview
The Hongming Huaci Multilayer Ceramic Capacitors (MLCC) - General Purpose Series (4V~63V) are designed for high-density and high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G, C0H), X7R, X5R, X7S, and X6S dielectric materials, offering excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in small dimensions. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: Hongming Huaci
- Series: General Purpose Series (4V~63V)
- Supplier: Suining Hongming Huaci Ceramic Technology Co., Ltd.
- Issue Date: 20201116
- Version: HC202002
Technical Specifications
| Section | Details |
|---|---|
| Model Designation | HGC [Series] [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] |
| Available Sizes | 0201 ~ 1210 |
| Dielectric Materials | NP0 (C0G/C0H), X7R, X5R, X7S, X6S |
| Temperature Characteristics |
|
| External Dimensions (Example: 0201) | Length: 0.600.03 mm, Width: 0.300.03 mm, Thickness: 0.300.03 mm |
| Soldering Methods | Reflow Soldering (R), Wave Soldering (W) |
| Packaging Quantities (Examples) |
|
| Capacitance Range & Rated Voltage | Refer to detailed tables (Sections 8-1 to 8-5) for specific dielectric types and sizes. |
| Reliability Test Standards | Appearance, Dimensions, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% (Guaranteed solderability for 6 months) |
| Soldering Profiles | Refer to specific temperature profile charts for Reflow Soldering, Wave Soldering, and Hand Soldering. |
2410121645_Chinocera-HGC1206R5476M100NSPJ_C7432787.pdf
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