<
>
Specifications
Current Rating:
200mA
DC Resistance(DCR):
800mΩ
Tolerance:
±25%
Impedance @ Frequency:
240Ω@100MHz
Mfr. Part #:
SBY060303T-241Y-N
Package:
0201
Key Attributes
Model Number:
SBY060303T-241Y-N
Product Description
Product Overview
This specification applies to MULTILAYER FERRITE CHIP BEADS from the SBY060303T Series. These components are designed for various electronic applications, offering lead-free and RoHS compliance.
Product Attributes
- Brand: Chilisin
- Origin: Dongguan, China; Suzhou, China; Taiwan
- Certifications: Lead-Free & RoHS Compliance
Technical Specifications
| Part No. | Impedance () | Test Freq. | RDC () Max. | Rated Current (mA) Max. | Tolerance |
|---|---|---|---|---|---|
| SBY060303T-241-N | 240 | 100 MHz, 200 mV | 0.8 | 100 | -tolerance Y=25% / T=30% / V=5 |
| Item | Specification | Test Method |
|---|---|---|
| Mechanical Performance | Flexure Strength: The forces applied on the right Test device shall be soldered on the substrate conditions must not damage the terminal electrode and the ferrite | Substrate Dimension: 100x40x1.6mm Deflection: 2.0mm Keeping Time: 30sec *For 100505, substrate dimension is 100x40x0.8mm |
| Vibration Test | Oscillation Frequency: 10 to 55 to 10Hz for 1min Amplitude: 1.5mm Time: 2hrs for each axis (X, Y & Z), total 6hrs | |
| Resistance to Soldering Heat | Appearance: No damage Pre-heating: 150, 1min Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free) Solder Temperature: 2605 Immersion Time: 101sec Impedance : within 30% of initial value | |
| Solder ability | The electrodes shall be at least 95% covered with new solder coating | Pre-heating: 150, 1min Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free) Solder Temperature: 2455(Pb-Free) Immersion Time: 41sec |
| Terminal Strength Test | No split termination | Test device shall be soldered on the substrate, then apply a force in the direction of the arrow. Force : 5N Keeping Time: 101sec |
| Environmental Performance | Temperature Cycle: Appearance: No damage; Impedance: within30% of initial value | One cycle: Step Temperature () Time (min) 1 -553 30 2 252 3 3 1253 30 4 252 3 Total: 100cycles Measured after exposure in the room condition for 24hrs |
| Humidity Resistance: Temperature: 402; Relative Humidity: 90 ~ 95% | Time: 1000hrs Measured after exposure in the room condition for 24hrs | |
| High Temperature Resistance: 1253; Relative Humidity: 0% | Applied Current: Rated Current /Time: 1000hrs Measured after exposure in the room condition for 24hrs | |
| Low Temperature Resistance: -553; Relative Humidity: 0% | Time: 1000hrs Measured after exposure in the room condition for 24hrs |
| Rating | Specification |
|---|---|
| Operating Temperature | (Including self - temperature rise) |
| Storage Temperature | (after PCB) ,Humidity (before PCB) |
| Standard Testing Condition - Temperature | Ordinary Temperature(15 to 35) 202 |
| Standard Testing Condition - Humidity | Ordinary Humidity(25 to 85% RH) 60 to 70 % RH |
2411280107_Chilisin-SBY060303T-241Y-N_C2913981.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible