Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency SMT applications. These general-purpose series capacitors are available in a wide range of sizes from 0201 to 1210 and offer excellent electrical performance and high reliability. They are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials. Key features include a broad selection of available sizes and high capacitance in small packages. Applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: Hongming Huaci Technology ()
- Product Series: General Purpose Series (4V~63V)
- Origin: Suining, China ()
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Specification | Details |
|---|---|
| Part Name | Multilayer Ceramic Capacitors |
| Series | General Purpose Series (4V~63V) |
| Specification (Size) | 0201 ~ 1210 |
| Supplier | Suining Hongming Huaci Technology Co., Ltd. |
| Issue Date | 20201116 |
| Model Designation | HGC [Series]-[Size]-[Dielectric]-[Capacitance]-[Tolerance]-[Rated Voltage]-[Termination]-[Packaging]-[Thickness Code]-[Reel Size] |
| Available Sizes (Inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) |
| Dielectric Characteristics |
|
| Rated Voltages (VDC) | 4V, 6.3V, 10V, 16V, 25V, 50V, 100V, 200V, 250V, 500V, 630V, 1kV, 1.5kV, 2kV, 2.5kV, 3kV, 4kV, 5kV, 6kV |
| Termination Types | Cu/Ni/Sn (N) |
| Packaging Types | Paper taping (T), Bulk (B), Embossed taping (S) |
| Reel Sizes | 7 Inch (J, K), 13 Inch (D) |
| External Dimensions (Example: 0805) | Length L: 2.000.20 mm, Width W: 1.250.20 mm, Thickness T: 0.700.10 mm (G), 0.800.20 mm (H), 1.250.20 mm (L) |
| Standard Packaging Quantity (Example: 0805) | Paper tape 7" reel: 4000 pcs (for G/H thickness) |
| Reliability Test Items | Appearance, Dimensions, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance (Steady State), Temperature Cycle, Durability |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% |
| Soldering Methods | Reflow Soldering, Wave Soldering, Manual Soldering |
2410121645_Chinocera-HGC1206R5106K500NSPJ_C7432781.pdf
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