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Specifications
Mfr. Part #:
PBY160808T-190Y-N
Package:
0603
Key Attributes
Model Number:
PBY160808T-190Y-N
Product Description
Product Overview
This specification applies to MULTILAYER FERRITE CHIP BEADS, specifically the PBY160808T Series. These components are designed for various electronic applications, offering effective impedance control.
Product Attributes
- Brand: Chilisin
- Certifications: RoHS & Halogen Free & REACH Compliance
- Origin: Chilisin Electronics (Dongguan) Co., Ltd., HuNan Chilisin Electronics Technology Co., Ltd, Chilisin Electronics Corp, Chilisin Electronics (Vietnam) Limited
Technical Specifications
| Part Number | Size Code | Impedance () @ 100 MHz, 200 mV | RDC () Max. | Rated Current (mA) Max. | Operating Temperature | Storage Temperature | Net Weight (grms) | Tolerance |
| PBY160808T-190Y-N | 160808 | 19 | 0.03 | 3000 | -55 ~ 125 (Including self-temperature rise) | -55 ~ 125 (after PCB) / -5~40, Humidity 40%~70% (before PCB) | 0.00576 | Y=25% |
| PBY160808T-190T-N | 160808 | 19 | 0.03 | 3000 | -55 ~ 125 (Including self-temperature rise) | -55 ~ 125 (after PCB) / -5~40, Humidity 40%~70% (before PCB) | 0.00576 | T=30% |
Reliability
| Category | Item | Specification |
| Mechanical Performance | Flexure Strength | Forces applied must not damage terminal electrode and ferrite. Substrate Dimension: 100x40x1.6mm, Deflection: 2.0mm, Keeping Time: 30sec. (*For 100505, substrate dimension is 100x40x0.8mm) |
| Vibration Test | Device soldered on substrate. Oscillation Frequency: 10 to 55 to 10Hz for 1min, Amplitude: 1.5mm, Time: 2hrs for each axis (X, Y & Z), total 6hrs. | |
| Resistance to Soldering Heat | Appearance: No damage. Pre-heating: 150, 1min. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. Impedance: within 30% of initial value. More than 75% of the terminal electrode should be covered with solder. | |
| Solder Ability | Pre-heating: 150, 1min. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455(Pb-Free). Immersion Time: 41sec. Electrodes shall be at least 95% covered with new solder coating. | |
| Terminal Strength Test | No split termination. Test device soldered on substrate, apply force in direction of arrow. Force: 5N, Keeping Time: 101sec. | |
| Environmental Performance | Temperature Cycle | 100 cycles. Step 1: -553 (30 min), Step 2: 252 (3 min), Step 3: 1253 (30 min), Step 4: 252 (3 min). Measured after 24hrs at room condition. Appearance: No damage. Impedance: within 30% of initial value. |
| Humidity Resistance | Temperature: 402, Relative Humidity: 90 ~ 95%, Time: 1000hrs. Measured after 24hrs at room condition. | |
| High Temperature Resistance | Temperature: 1253, Relative Humidity: 0%, Applied Current: Rated Current, Time: 1000hrs. Measured after 24hrs at room condition. | |
| Low Temperature Resistance | Temperature: -553, Relative Humidity: 0%, Time: 1000hrs. Measured after 24hrs at room condition. |
2512291641_Chilisin-PBY160808T-190Y-N_C365834.pdf
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