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quality SMD Quartz Crystal Resonator Seam3225 10MHz CHANGXING ELECTRONICS 8DSC100G0012L Seam Sealing 4PIN Device factory
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quality SMD Quartz Crystal Resonator Seam3225 10MHz CHANGXING ELECTRONICS 8DSC100G0012L Seam Sealing 4PIN Device factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
12pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
10MHz
Mfr. Part #:
8DSC100G0012L
Package:
SMD3225-4P
Key Attributes
Model Number: 8DSC100G0012L
Product Description

Product Overview

The Seam3225 4PIN 10.000000MHz 8DSC100G0012L is a Quartz Crystal Resonator manufactured by CHANGXING ELECTRONICS CO.,LTD. This SMD Seam Sealing Crystal from the 8D Series offers high precision and frequency stability, making it an excellent choice for reducing EMI effects. It is ideally suited for applications in Bluetooth, wireless communication sets, DSC, PDA, and mobile phones. The product is RoHS Compliant and Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Model: Seam3225 4PIN 10.000000MHz 8DSC100G0012L
  • Series: 8D Series
  • Type: Quartz Crystal Resonator
  • Sealing: Seam Sealing
  • Mounting Type: SMD
  • Crystal Cutting Type: AT CUT (thickness shear mode)
  • Certifications: RoHS Compliant / Pb Free
  • Origin: Fujian, China

Technical Specifications

Parameter Model Units Min. Max. Notes
Nominal Frequency 10.000000 MHz Fund
Frequency Tolerance (at 25 3 ) ppm 10
Load Capacitance 12 pF
Operating Temperature Range -40 +85
Storage Temperature Range -55 +125
Aging (1st Year) ppm 3
Drive Level uW 100
Shunt Capacitance (C0) pF 5 Max.
Motional Capacitance (C1) fF
Effective Resistance (Rr) 150 Max.
Insulation Resistance M 500 at DC 100V
Pulling Sensitivity (TS) ppm/pF
Spurious Response dB -3.0
Dimensions (L x W x H) 3.2 x 2.5 x 0.7 mm SMD
Reel Quantity pcs per reel 3,000 (WHITE)
Product Weight mg 17.322

Packing

EIA-481-2 standard reel packaging.

Reliability Specifications

Mechanical Endurance: Vibration (10-2000 Hz, 4 hours per axis), Mechanical Shock (1000 G, 0.5ms, 3 times per axis), Drop Test (150 cm, 3 times).

Environmental Endurance: High Temp & Humidity (85, RH 85%, 500Hrs), Low Temp Storage (-40, 500Hrs), Thermal Shock (100 cycles), Resistance to Soldering Heat (260, 10 sec), High Temp Storage (125, 12 hours), Pressure Cooker Storage (125, RH 100%, 2 bar, 240Hrs).

Other Tests: Fine Leak, Gross Leak Test.

Material Composition Declaration

Base: Ceramics (Al2O3, SiO2, Cr2o3, MgO, CaO)

Wafer: Quartz (SiO2)

Electrode: Metal (W, Au, Ni, Fe)

Metallizing: Metal (Ni, Co)

Plating: Metal (Ni, Ag)

Adhesive: Polymer (Silicone resin, Petroleum solvent)

Solder: Metal (Ag, Cu)

Cover: Metal (Cr, Ag)


2504101957_CHANGXING-ELECTRONICS-8DSC100G0012L_C46613546.pdf

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