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quality Seam Sealed 8D Series Crystal Resonator CHANGXING ELECTRONICS 8DSC135G0012L 13.56MHz AT Cut Frequency Stability factory
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quality Seam Sealed 8D Series Crystal Resonator CHANGXING ELECTRONICS 8DSC135G0012L 13.56MHz AT Cut Frequency Stability factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
12pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
13.56MHz
Mfr. Part #:
8DSC135G0012L
Package:
SMD3225-4P
Key Attributes
Model Number: 8DSC135G0012L
Product Description

Product Overview

The Seam 3225 4PIN Quartz Crystal Resonator, model DSC135G0012L, is a high-precision frequency control component designed for demanding applications. It offers high frequency stability and is particularly effective in reducing EMI effects, making it an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. This product is RoHS Compliant and Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD. ()
  • Product Model: Seam 3225 4PIN 13.560000MHz 8DSC135G0012L
  • Series: 8D Series
  • Sealing: Seam Sealing
  • Crystal Cutting Type: AT CUT (thickness shear mode)
  • Certifications: RoHS Compliant / Pb Free
  • Origin: Fujian, China

Technical Specifications

Parameter Units Min. Max. Notes
Nominal Frequency MHz 13.560000
Frequency Tolerance (at 25 3 ) ppm 10
Load Capacitance pF 12
Oscillation Mode - Fund
Drive Level uW 100
Shunt Capacitance (C0) pF 5
Operating Temperature -40 +85
Aging (1st Year) ppm 3
Frequency Tolerance (Over Operating Temp. Range) ppm 30
Pulling Sensitivity (TS) ppm/pF 12
Insulation Resistance M 500 at DC 100V
Spurious Response dB -3.0
Motional Capacitance (C1) fF 60
Effective Resistance (Rr) 10
Storage Temperature Range -55 +125
Dimensions (L x W x H) mm 3.2 x 2.5 x 0.7
Reel Quantity pcs per reel 3,000 (WHITE)
Weight mg 17.322

Dimensions

Dimension Value (mm)
L 3.400.1
W 2.700.1
H 1.400.1
L1 4.000.1
W1 1.550.05
A 1.750.1
B 4.000.11
C 8.00.2
D 11.50.2
E 130.5
F 1781.0
G
H

Marking

LOGO, Nominal Frequency (MHz), Line Code, Last Three Digits of Batch Number, Year-Month Code (4-year cycle).

Reflow Condition

Standard conditions apply.

Packing

(EIA-481-2) Standard Reel Quantity: 3,000 pcs per reel (WHITE).

Reliability Specifications

Mechanical Endurance
  • Vibration: Perpendicular axes, 4 hours each test time (10 ~ 2000 Hz).
  • Drop Test: 150 cm height, 3 times on concrete floor.
  • Mechanical Shock: Half sine wave (1000 G), 0.5 m sec. duration, 3 times each on mutually perpendicular axes.
  • Shock Test: 150g / 150cm Height, 3 times in the direction of X, Y, Z on concrete floor.
Environmental Endurance
  • High Temp & Humidity: 85 3, RH 85%, 500Hrs.
  • Low Temp. Storage: -40 3 for 500 12 hours.
  • Temperature Cycling: 100 cycles of -40 to +125.
  • Pressure Cooker Storage: 125 3, RH 100%, 2 bar, 240Hrs.
  • Resistance To Soldering Heat: Pre-heat time 60 ~ 120 sec, Pre-heat temperature 125 . Test temperature 260 5, Test time 10 1 sec.
  • High Temp. Storage: +125 3 for 500 12 hours.
  • Helium Bombing: 4.5 Kgf / cm2 for 2 hr.
  • Fine Leak: Flux Rosin resin methyl alcohol solvent (1:4), Immersion time 5 1 seconds.
  • Gross Leak Test: Standard Sample For Automatic Gross Leak Detector, Test Pressure: 2Kg / cm2.

Material Composition Declaration

Part Material Name Material Mass (mg) Material Mass (%) Constituent Name CAS No. Material Analysis (%)
1. Base Ceramics 23.09 23.09% Al2O3 1344-28-1 92.40%
SiO2 7631-86-9 4.31%
Cr2o3 1308-38-9 1.50%
MgO 1309-48-4 0.69%
CaO 1305-78-8 1.10%
2. Cover Metallizing 6.40 6.40% Fe 7439-89-6 40.70%
Ni 7440-02-0 21.80%
Co 7440-48-4 12.80%
Ag 7440-22-4 21.00%
Cu 7440-50-8 3.70%
3. Adhesive Polymer 15.01 15.01%
4. Electrode Metal 20.91 20.91% W 7440-33-7 62.50%
Au 7440-57-5 4.61%
Ni 7440-02-0 32.89%
5. Electrode (Plating) Metal Fe 7439-89-6 47.71%
Ni 7440-02-0 26.11%
Co 7440-48-4 15.44%
Ni (Plating) 7440-02-0 10.74%
6. Solder Metal 3.62 3.62% Ag 7440-22-4 75.00%
- 5.00%
- 5.00%
- 15.00%
Chip Quartz 0.45 2.60% SiO2 14808-60-7 100.00%
4J29 (Substrate) 0.20 1.15% Cr 7440-47-3 5.56%
Ag 7440-22-4 94.44%

2504101957_CHANGXING-ELECTRONICS-8DSC135G0012L_C46613745.pdf

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