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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
12pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
37.4MHz
Mfr. Part #:
8DSC374G0012L
Package:
SMD3225-4P
Key Attributes
Model Number:
8DSC374G0012L
Product Description
Product Overview
The Seam3225 4PIN 37.400000MHz 8DSC374G0012L is a high-precision Quartz Crystal Resonator designed for demanding communication applications. It offers high frequency stability and is engineered to effectively reduce EMI effects, making it an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. This product is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Type: Quartz Crystal Resonator
- Series: 8D Series
- Sealing: Seam Sealing
- Compliance: RoHS Compliant / Pb Free
- Origin: Fujian, China
Technical Specifications
| Parameter | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 37.400000 | MHz | Fund |
| Frequency Tolerance (at 25 3 ) | 10 | ppm | |
| Load Capacitance | 12 | pF | 0.01100W/Step |
| Frequency Tolerance (1st Year) | 30 | ppm | |
| Operating Temperature Range | -40+85 | ||
| Storage Temperature Range | -55+125 | ||
| Aging (1st Year) | 3 | ppm | |
| Drive Level | 100 | uW Max. | |
| Motional Capacitance (C1) | 40 | fF Max. | |
| Effective Resistance (Rr) | 40 | Max. | |
| Shunt Capacitance (C0) | 5 | pF Max. | |
| Insulation Resistance | 500 | M Min. | at DC 100V |
| Pulling Sensitivity (TS) | 125 | ppm/pF | |
| Spurious Response | -3.0 | dB | |
| Dimensions (L x W x H) | 3.2 x 2.5 x 0.7 | mm | |
| Reel Quantity | 3,000 | pcs per reel | (WHITE) |
| Product Weight | 17.322 | mg |
Dimensions
| Dimension | Value | Unit |
|---|---|---|
| A | 1.40 | 0.1 mm |
| B | 3.40 | 0.1 mm |
| C | 2.70 | 0.1 mm |
| D | 4.00 | 0.1 mm |
| E | 8.0 | 0.2 mm |
| F | 4.00 | 0.11 mm |
| G | 1.55 | 0.05 mm |
| H | 1.75 | 0.1 mm |
| L | 178 | 1.0 mm |
| L1 | 13 | 0.5 mm |
| W | 11.5 | 0.2 mm |
| W1 | 8.0 | +1.0 mm |
Marking
The marking includes the following codes:
- LOGO
- Nominal Frequency (MHz)
- Line Code
- Last three digits of production batch number
- Year-Month Code (four-year cycle)
Reflow Condition
Refer to standard reflow soldering profile specifications for SMD components.
Packing
Packing follows EIA-481-2 standards. Standard reel quantity is 3,000 pcs per reel.
Reliability Specifications
1. Mechanical Endurance
- Vibration: Perpendicular axes, 4 hours each axis (JIS C6701).
- Mechanical Shock: Half sine wave (1000 G), 0.5 msec. duration, 3 times each mutually perpendicular axis (MIL-STD-202F).
- Drop Test: 150 cm height, 3 times on concrete floor (JIS C6701).
- Solderability: Test temperature 260 5 , Test time 10 1 sec. (IEC-68-02-27).
2. Environmental Endurance
- High Temp & Humidity: 85 3, RH 85%, 500Hrs (JIS C5023).
- Low Temp. Storage: -40 3 for 500 12 hours (MIL-STD-883E).
- Thermal Shock: Total 100 cycles of temperature cycling between +125 3 and -40 3 (MIL-STD-883E).
- Resistance To Soldering Heat: Pre-heat time 60 120 sec., Pre-heat temperature 125 (Total test time 12 hours) (MIL-STD-883E).
- High Temp. Storage: 125 3 for 500 12 hours (MIL-STD-883E).
- Pressure Cooker Storage: 125 3, RH100%, 2 bar, 240Hrs (MIL-STD-883E).
- Helium Bombing: 4.5 Kgf / cm2 for 2 hr (MIL-STD-883E).
- Gross Leak Test: Test Pressure: 2Kg / cm2 (Standard Sample For Automatic Gross Leak Detector).
- Fine Leak: Flux Rosin resin methyl alcohol solvent (1:4) Immersion time 5 1 seconds (JIS C6701).
Material Composition Declaration
| Part | Material Name | Material Mass (mg) | Material Mass (%) | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|---|
| Base ( Ceramics) | Aluminum oxide | 92.40% | Al2O3 | 1344-28-1 | ||
| Siliconoxide | 4.31% | SiO2 | 7631-86-9 | |||
| Chromium oxide | 1.50% | Cr2o3 | 1308-38-9 | |||
| Magnesium oxide | 0.69% | MgO | 1309-48-4 | |||
| Calcium oxide | 1.10% | CaO | 1305-78-8 | |||
| Fe | 7439-89-6 | 40.70% | ||||
| Electrode () | Nickel | Ni | 7440-02-0 | 21.80% | ||
| Cobalt | Co | 7440-48-4 | 12.80% | |||
| Silver | Ag | 7440-22-4 | 21.00% | |||
| Copper | Cu | 7440-50-8 | 3.70% | |||
| Fe | 7439-89-6 | 47.71% | ||||
| Metallizing () | Tungsten | 62.50% | W | 7440-33-7 | ||
| Gold | 4.61% | Au | 7440-57-5 | |||
| Nickel | 32.89% | Ni | 7440-02-0 | |||
| Nickel | 26.11% | Ni | 7440-02-0 | |||
| Adhesive () | Cobalt | 15.44% | Co | 7440-48-4 | ||
| Nickel | 10.74% | Ni | 7440-02-0 | |||
| Silver | 75.00% | Ag | 7440-22-4 | |||
| Polymer () | Silicone resin | 15.00% | ||||
| Solder () | Crystalline silica | 5.00% | SiO2 | 14808-60-7 | 100.00% | |
| Petroleum solvent | 5.00% | |||||
| Wafer () | Quartz | 0.45 | 2.60% | |||
| Silicon oxide | 100.00% | SiO2 | 14808-60-7 | |||
| Cover () | Chromium | 5.56% | Cr | 7440-47-3 | ||
| Silver | 94.44% | Ag | 7440-22-4 | |||
| 4J29 () | 20.91% |
2504101957_CHANGXING-ELECTRONICS-8DSC374G0012L_C46613770.pdf
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