Product Overview
The Seam2016 is a compact SMD type quartz crystal resonator designed for high-precision and stable frequency applications. It offers excellent heat resistance and environmental characteristics, making it suitable for demanding applications such as PDAs, DSCs, DVCs, and PCs. This RoHS compliant and Pb Free product ensures reliable performance in various electronic devices.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Series: 3D Series
- Model: Seam2016
- Product Number: 3DSC400G0009L
- Certifications: RoHS Compliant / Pb Free
- Crystal Cutting Type: AT CUT (thickness shear mode)
- Sealing Type: Seam Sealing
Technical Specifications
| Parameter | Specification | Units | Notes |
|---|---|---|---|
| Nominal Frequency | 40.000000 | MHz | at 25 3 |
| Frequency Tolerance | 10 | ppm | at 25 3 |
| Load Capacitance | 9 | pF | |
| Oscillation Mode | Fund | ||
| Drive Level | 100 | uW | Max. |
| Operating Temperature | -40+85 | ||
| Aging (1st Year) | 3 | ppm | |
| Over Operating Temp. Range | 30 | ppm | |
| Effective Resistance (Rr) | 50 | Max. | |
| Shunt Capacitance (C0) | 5 | Max. | pF |
| Motional Capacitance (C1) | 10 | Max. | fF |
| Pulling Sensitivity (TS) | 125 | ppm/pF | Max. |
| Insulation Resistance | 500 | Min. | M at DC 100V |
| Spurious Response | - | dB | - |
| Storage Temperature Range | -55+125 | ||
| Dimensions | 2.01.60.50 | mm | SMD |
| Reel Quantity | 3,000 | pcs per reel | (WHITE) |
| Production Weight | 6.144 | mg |
Marking
The marking on the product includes the Changxing Electronics LOGO, nominal frequency (MHz), line code, last three digits of the production batch number, and a four-year cycle year/month code.
Reflow Condition
Refer to the datasheet for specific reflow soldering conditions.
Packing
Standard reel quantity is 3,000 pcs per reel (WHITE), following EIA-481-2 standards.
Reliability Specifications
The product has undergone various reliability tests including Mechanical Endurance (Shock, Vibration, Solderability) and Environmental Endurance (Temperature Cycle, High Temp & Humidity, Low Temp Storage, High Temp Storage, Pressure Cooker Storage, Thermal Shock, Resistance To Soldering Heat).
Material Composition Declaration
The product consists of the following main components:
- Base: Ceramics (Al2O3, SiO2, Cr2o3, MgO, CaO)
- Cover: 4J29 ()
- Electrode: Metal (W, Au, Ni)
- Adhesive: Polymer (Ag, SiO2, Petroleum solvent, Silicone resin)
- Wafer: Quartz (SiO2)
- Metallizing: Metal (Cr, Ag)
- Plating: Metal (Ni)
- Solder: Metal (Ag)
2504101957_CHANGXING-ELECTRONICS-3DSC400G0009L_C46613787.pdf
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