<
>
Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
20MHz
Mfr. Part #:
3DSC200G0020L
Package:
SMD2016-4P
Key Attributes
Model Number:
3DSC200G0020L
Product Description
Product Overview
The Changxing Electronics Quartz Crystal Resonator, model Seam2016 3DSC200G0020L, is an extremely small SMD type crystal unit designed for high precision and frequency stability. It offers excellent heat resistance and environmental characteristics, making it suitable for applications in PDAs, DSCs, DVCs, and PCs. This RoHS Compliant / Pb Free product operates within a wide temperature range and features AT CUT (thickness shear mode) crystal technology.
Product Attributes
- Brand: Changxing Electronics
- Product Line: 3D Series
- Type: Quartz Crystal Resonator
- Sealing: Seam Sealing
- Certifications: RoHS Compliant / Pb Free
- Crystal Cutting Type: AT CUT (thickness shear mode)
- Origin: Fujian, China
Technical Specifications
| Parameter | Specification | Units | Notes |
|---|---|---|---|
| Nominal Frequency | 20.000000 | MHz | at 25 3 |
| Frequency Tolerance | 10 | ppm | at 25 3 |
| Load Capacitance | 20 | pF | |
| Oscillation Mode | Fund | ||
| Drive Level | 100 | uW | Max. |
| Pulling Sensitivity | 0.0130W/15 steps | ppm/pF | TS |
| Frequency Tolerance (Over Operating Temp. Range) | 30 | ppm | |
| Aging (1st Year) | 3 | ppm | |
| Operating Temperature | -40+85 | ||
| Storage Temperature Range | -55+125 | ||
| Effective Resistance (Rr) | 50 | Max. | |
| Shunt Capacitance (C0) | 5 | pF | Max. |
| Insulation Resistance | 500 | M | Min. at DC 100V |
| Spurious Response | -10 | dB | Max. |
| Dimensions (L x W x H) | 2.0 x 1.6 x 0.50 | mm | SMD |
| Reel Quantity | 3,000 | pcs per reel | (WHITE) |
Dimensions (mm):
| A | B | C | D | E | F | G | H | L | L1 | W | W1 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0.650.1 | 2.300.1 | 1.900.1 | 4.000.1 | 8.00.2 | 4.000.1 | 1.550.05 | 1.750.1 | 1781.0 | 130.5 | 11.50.2 | 8.0+1.0 |
Marking: Changxing Electronics LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Production Batch No., Year-Month Code.
Material Composition Declaration:
| Part | Name of Part | Material Name | Material Mass (mg) | Material Mass (%) | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|---|---|
| 1 | Base | Ceramics | 2.153 | 35.04% | Al2O3 | 1344-28-1 | 92.40% |
| SiO2 | 14808-60-7 | 4.30% | |||||
| Cr2o3 | 1308-38-9 | 1.51% | |||||
| MgO | 1309-48-4 | 0.69% | |||||
| CaO | 7439-98-7 | 1.09% | |||||
| 2 | Cover | 4J29 (Base Material) | 1.301 | 21.18% | Fe | 7439-89-6 | 40.70% |
| Ni | 7440-02-0 | 21.79% | |||||
| Co | 7440-48-4 | 12.78% | |||||
| 3 | Adhesive | Polymer | 0.058 | 0.94% | Ag | 7440-22-4 | 21.02% |
| Cu | 7440-50-8 | 3.71% | |||||
| 4 | Wafer | Quartz | 0.250 | 4.07% | W | 7440-33-7 | 86.04% |
| Au | 7440-57-5 | 2.88% | |||||
| Ni | 7440-02-0 | 11.07% | |||||
| 5 | Electrode | Metal | 0.015 | 0.24% | SiO2 | 14808-60-7 | 100.00% |
| Cr | 7440-47-3 | 5.56% | |||||
| Ag | 7440-22-4 | 94.44% | |||||
| Metallizing (Plating) | Fe | 7439-89-6 | 47.70% | ||||
| Ni | 7440-02-0 | 26.10% | |||||
| Co | 7440-48-4 | 15.44% | |||||
| Ni (Plating) | Ni | 7440-02-0 | 10.76% | ||||
| Metal | Ag | 7440-22-4 | 75.00% | ||||
| Crystalline Silicon Dioxide | Petroleum Solvent | 5.00% | |||||
| Silicone Resin | 15.00% | ||||||
| Solder | 1.490 | 24.25% | |||||
| KV Ring | 0.877 | 14.28% |
Reliability Specifications:
| Category | Test Item | Test Methods | REF.DOC |
|---|---|---|---|
| Mechanical Endurance | Shock Test | Device are shocked to half sine wave (1000 G) three mutually Perpendicular axes each 3 times. | MIL-STD-202F |
| Vibration | Frequency range 10 2000 Hz Amplitude 1.52 mm/20G Sweep time 20 minute Perpendicular axes each test time 4 hours | JIS C6701 | |
| Mechanical Endurance | 0.5m sec. duration time | MIL-STD-883E | |
| Drop Test | 150 cm height,3 times on concrete floor . | IEC-68-02-27 | |
| Environmental Endurance | Resistance To Soldering Heat | Pre-heat temperature 125 Pre-heat time 60 120 sec. Test temperature 260 5 Test time 10 1 sec. | MIL-STD-202F |
| Solderability | Flux Rosin resin methyl alcohol ( 1 : 4 ) Immersing depth 0.5 mm minimum Immersion time 5 1 seconds | MIL-STD-883E | |
| Fine Leak (Total test time 12 hours) | Helium Bombing 4.5 Kgf / cm2 for 2 hr | MIL-STD-883E | |
| Gross Leak | Standard For Automatic Gross Leak Detector, Test Pressure: 2Kg / cm2 | JIS C6701 | |
| Thermal Shock | Total 100 cycles of the following temperature cycle + 125 3 for 500 12 hours to - 40 3 for 500 12 hours | MIL-STD-883E | |
| High Temp. Storage | 125 3 for 500 12 hours | JIS C5023 | |
| High TempHumidity | 85 3 , RH 85% , 500Hrs | JIS C6701 | |
| Pressure Cooker Storage | 125 3 , RH100% , 2 bar , 240Hrs | MIL-STD-883E |
2504101957_CHANGXING-ELECTRONICS-3DSC200G0020L_C46613780.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
