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quality Quartz Crystal Resonator CHANGXING ELECTRONICS 9ASC250G0020L 25MHz SMD Glass Sealed Component factory
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quality Quartz Crystal Resonator CHANGXING ELECTRONICS 9ASC250G0020L 25MHz SMD Glass Sealed Component factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
25MHz
Mfr. Part #:
9ASC250G0020L
Package:
SMD5032-2P
Key Attributes
Model Number: 9ASC250G0020L
Product Description

Product Overview

The CHANGXING ELECTRONICS CO.,LTD. Glass 5032 2PIN 25.000000MHz Quartz Crystal Resonator (Model: 9ASC250G0020L) is a 5.0x3.2x1.2mm SMD glass-sealed crystal unit designed for automatic mounting and reflow soldering. It offers high reliability, tight tolerance, and stability, making it an ideal choice for portable PCs, PDAs, DSCs, and USB interface cards. The product features Pb in sealing glass, exempted by RoHS directive, and provides reasonable cost with good delivery performance.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Line: 9A Series
  • Product Type: SMD Glass Sealing Crystals / Quartz Crystal Resonator
  • Origin: Fujian, China
  • RoHS Exemption: Contains Pb in sealing glass exempted by RoHS directive.

Technical Specifications

Electrical Specifications
Parameter Notes Value
Nominal Frequency 25.000000 MHz
Oscillation Mode Fund -
Load Capacitance 20 pF -
Frequency Tolerance 10 ppm at 25 -
Frequency Tolerance Over Operating Temp. Range 30 ppm -40+85
Aging 1st Year 100 ppm -
Drive Level 100 uW Max. -
Effective Resistance (Rr) 40 Max. -
Shunt Capacitance (C0) 5 pF Max. -
Motional Capacitance (C1) - -
Pulling Sensitivity (TS) - ppm/pF
Spurious Response -3.0 dB Max. -
Insulation Resistance 500 M Min. at DC 100V -
Storage Temperature Range -55+125 -
DLDF 10 Max. -
DLD2 0.0130W/15 steps -
FDLDH 5 Max. -
RLD2 40 Max. -
FDLD 10 Max. -
DLDH2 5 Max. -
Dimensions
Dimension Value (mm)
A 1.450.1
B 5.400.1
C 3.600.1
D 8.000.1
E 12.00.2
F 4.000.1
G 1.550.05
H 1.750.1
L 1801.0
L1 130.5
W 16.50.2
W1 12.0+1.0
Marking Details
LOGO CX25.0 ****
Nominal Frequency (MHz) 25.0
Line Code ****
Last Three Digits of Production Batch No. ****
Year-Month Code (4-year cycle) ****
Packing Details
Standard Reel Quantity 1,000 pcs per reel (WHITE)
Standard EIA-481-2
Reliability Specifications
Category Test Item Test Methods / Reference
Mechanical Endurance Resistance To Soldering Heat MIL-STD-202F (Pre-heat 125, 60-120s; Test 2605, 101s)
Mechanical Shock MIL-STD-202F (1000G, 0.5ms, 3 axes)
Vibration MIL-STD-883E (10-2000Hz, 1.52mm/20G, 4 hrs per axis)
Drop Test JIS C6701 (75cm height, 3 times on concrete floor)
Environmental Endurance Gross Leak MIL-STD-883E (Test Pressure: 2Kg/cm)
Fine Leak MIL-STD-883E (Helium Bombing 4.5 Kgf/cm for 2 hr)
Solderability MIL-STD-883E (2605, 51s, 0.5mm depth)
High Temp & Humidity JIS C5023 (853, RH 85%, 1000Hrs)
Thermal Shock MIL-STD-883E (100 cycles)
High Temp. Storage MIL-STD-883E (+1253 for 100012 hours)
Low Temp. Storage MIL-STD-883E (-403 for 100012 hours)
Material Composition Declaration
Part Material Name CAS No. Material Mass (%) Constituent Element (%)
Base (Ceramics) Al2O3 1344-28-1 92.41% Al2O3: 92.41%, SiO2: 4.30%, Cr2O3: 1.51%, MgO: 0.69%, CaO: 1.09%
Metalization (Metal) W 7440-33-7 4.05% W: 100.00%
Plating Au 7440-57-5 17.69% Au: 17.69%, Ni: 82.31%
Cover (Glass) PbO 1317-36-8 57.29% PbO: 57.29%, PbF2: 19.29%, Bi2O3: 5.30%, Nb2O5: 4.30%, B2O3: 2.30%, ZnO: 2.30%, CuO: 1.30%, CaO: 0.30%, TiO2: 5.30%, Fe2O3: 2.30%
Electrode (Metal) Ag 7440-22-4 75.00% Ag: 75.00%, Cr: 5.56%, Ag: 94.44%
Adhesive (Polymer) Silicone resin - 15.00% -
Chip (Quartz) SiO2 14808-60-7 100.00% SiO2: 100.00%

2504101957_CHANGXING-ELECTRONICS-9ASC250G0020L_C46613811.pdf

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