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quality 12.288000MHz Quartz Crystal CHANGXING ELECTRONICS 8DSC122G0020L for Mobile Phones and Communication Sets factory
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quality 12.288000MHz Quartz Crystal CHANGXING ELECTRONICS 8DSC122G0020L for Mobile Phones and Communication Sets factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
12.288MHz
Mfr. Part #:
8DSC122G0020L
Package:
SMD3225-4P
Key Attributes
Model Number: 8DSC122G0020L
Product Description

Product Overview

The Seam3225 4PIN 12.288000MHz 8DSC122G0020L is a high-precision Quartz Crystal Resonator designed for demanding applications. It offers high frequency stability and is exceptionally effective at reducing EMI effects, making it an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. This product is RoHS Compliant and Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Model: Seam3225, 8D Series, DSC122G0020L
  • Nominal Frequency: 12.288000MHz
  • Crystal Cutting Type: AT CUT (thickness shear mode)
  • Sealing Type: Seam Sealing
  • Compliance: RoHS Compliant / Pb Free

Technical Specifications

Parameter Units Min. Max. Typical Notes
Nominal Frequency MHz - - 12.288000 Fund
Frequency Tolerance at 25 3 ppm - - 10 Load Capacitance 20 pF
Load Capacitance pF - - 20 -
Operating Temperature Range -40 +85 - -
Storage Temperature Range -55 +125 - -
Frequency Tolerance Over Operating Temp. Range ppm - - 30 -
Aging (1st Year) ppm - - 3 -
Drive Level uW - 100 - -
Shunt Capacitance C0 pF - 5 - -
Motional Capacitance C1 fF - - 0.01100W/Step -
Effective Resistance Rr - 80 - -
Pulling Sensitivity TS ppm/pF - - 30 DLD2
Insulation Resistance M 500 - - at DC 100V
Spurious Response dB - -3.0 - DLDF
Mechanical Shock - - - 1000 G half sine wave, 0.5 m sec. duration time, 3 times each on 3 mutually perpendicular axes
Vibration Hz 10 2000 - Perpendicular axes each test time 4 hours
Drop Test cm - 150 - 3 times on concrete floor
Resistance To Soldering Heat - 260 5 - Pre-heat time 60 120 sec.
High Temp. Storage - 125 3 - Total test time 12 hours
Pressure Cooker Storage - 125 3 - RH100%, 2 bar, 240Hrs
Thermal Shock - - - 100 cycles Total 100 cycles of the following temperature cycle
Fine Leak Kgf/cm - 4.5 - Helium Bombing for 2 hr
Gross Leak Test Kgf/cm - 2 - Standard Sample For Automatic Gross Leak Detector, Test Pressure
Solderability - 260 5 - Test time 10 1 sec.
Dimension Unit Value
L mm 3.400.1
L1 mm 4.000.1
W mm 2.700.1
W1 mm 4.000.11
A mm 1.400.1
B mm 2.700.1
C mm 0.700.1
D mm -
E mm -
F mm -
G mm -
H mm -
Standard Reel Quantity pcs per reel 3,000 (WHITE)
Marking Description
LOGO LOGO
MHz Nominal Frequency (MHz)
Line Code
Last three digits of Batch Code
Year/Month Code (4-year cycle)
CX12.2 Product Code
Item Name of Part Material Name Material Mass(mg) Material mass (%) Constituent name CAS No. Material Analysis(%)
1 Base Ceramics 23.09 23.09% Al2O3 1344-28-1 92.40%
SiO2 7631-86-9 4.31%
Cr2o3 1308-38-9 1.50%
MgO 1309-48-4 0.69%
CaO 1305-78-8 1.10%
Fe 7439-89-6 40.70%
2 Cover Metallizing 20.91 20.91% Ni 7440-02-0 21.80%
Co 7440-48-4 12.80%
Ag 7440-22-4 21.00%
Cu 7440-50-8 3.70%
3 Adhesive Polymer 15.01 15.01% W 7440-33-7 62.50%
Au 7440-57-5 4.61%
Ni 7440-02-0 32.89%
4 Electrode Metal 3.62 3.62% Ni 7440-02-0 26.11%
Co 7440-48-4 15.44%
Ni 7440-02-0 10.74%
5 Solder Metal 6.40 6.40% Ag 7440-22-4 75.00%
Ni 7440-02-0 32.89%
6 Quartz 0.45 0.45% SiO2 14808-60-7 100.00%
Cr 7440-47-3 5.56%
Item Name of Part Material Name Material Mass(mg) Material mass (%) Constituent name CAS No. Material Analysis(%)
4J29 () - - 0.20 1.15% Ag 7440-22-4 94.44%
KV - - 0.05 0.29% - - -
Polymer - - - - - - -
Quartz - - - - - - -
- - - - - - -
Silicone resin - - - - - - -

2504101957_CHANGXING-ELECTRONICS-8DSC122G0020L_C46613744.pdf

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