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quality 32 MHz SMD Quartz Crystal Resonator CHANGXING ELECTRONICS 3DSC320G0009L for PDA DSC DVC Applications factory
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quality 32 MHz SMD Quartz Crystal Resonator CHANGXING ELECTRONICS 3DSC320G0009L for PDA DSC DVC Applications factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
9pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
32MHz
Mfr. Part #:
3DSC320G0009L
Package:
SMD2016-4P
Key Attributes
Model Number: 3DSC320G0009L
Product Description

Product Overview

The Seam 2016 is a Quartz Crystal Resonator designed for high-precision applications. This extremely small SMD type crystal unit offers high frequency stability and excellent heat resistance and environmental characteristics. It is suitable for applications in PDAs, DSCs, DVCs, PCs, and more. The product is RoHS Compliant and Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Model: Seam2016
  • Series: 3D Series
  • Origin: Fujian, China
  • Certifications: RoHS Compliant / Pb Free
  • Crystal Cutting Type: AT CUT (thickness shear mode)
  • Sealing Type: Seam Sealing
  • Mounting Type: SMD

Technical Specifications

Parameter Specification Unit Notes
Nominal Frequency 32.000000 MHz
Frequency Tolerance 30 ppm at 25 3
Load Capacitance 9 pF
Drive Level 100 uW Max.
Operating Temperature -40+85
Aging (1st Year) 3 ppm
Insulation Resistance 500 M Min. at DC 100V
Effective Resistance (Rr) 50 Max.
Shunt Capacitance (C0) 5 pF Max.
Pulling Sensitivity (TS) - ppm/pF
Spurious Response - dB 10 Max.
Storage Temperature Range -55+125
Dimensions (L x W x H) 2.0 x 1.6 x 0.50 mm
Reel Quantity 3,000 pcs per reel (WHITE)
Product Weight 6.144 mg

Packing

Standard Reel Quantity: 3,000 pcs per reel (WHITE)

Material Composition Declaration

Part Name of Part Material Name Material Mass (mg) Material Mass (%) Constituent Name CAS No. Material Analysis (%)
1 Base Ceramics 2.153 35.04% Al2O3 1344-28-1 92.40%
SiO2 14808-60-7 4.30%
Cr2o3 1308-38-9 1.51%
MgO 1309-48-4 0.69%
CaO 7439-98-7 1.09%
2 Cover (4J29) 1.301 21.18% Fe 7439-89-6 40.70%
Ni 7440-02-0 21.79%
Co 7440-48-4 12.78%
Ag 7440-22-4 21.02%
Cu 7440-50-8 3.71%
3 Adhesive 0.058 0.94% SiO2 14808-60-7 100.00%
Cr 7440-47-3 5.56%
Ag 7440-22-4 94.44%
4 Wafer (Chip) Quartz 0.250 4.07%
5 Electrode 0.015 0.24% W 7440-33-7 86.04%
Au 7440-57-5 2.88%
Ni 7440-02-0 11.07%
Metallizing (Metal) Fe 7439-89-6 47.70%
Ni 7440-02-0 26.10%
Co 7440-48-4 15.44%
Plating (Ni) Ni 7440-02-0 10.76%
Solder 1.490 24.25% Ag 7440-22-4 75.00%
Petroleum Solvent 5.00%
Silicone Resin 15.00%

2504101957_CHANGXING-ELECTRONICS-3DSC320G0009L_C46613785.pdf

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