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quality RoHS Compliant Seam Sealed Quartz Crystal CHANGXING ELECTRONICS 8DSC270G0010L 27 MHz Frequency for Mobile Phones factory
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quality RoHS Compliant Seam Sealed Quartz Crystal CHANGXING ELECTRONICS 8DSC270G0010L 27 MHz Frequency for Mobile Phones factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
10pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
27MHz
Mfr. Part #:
8DSC270G0010L
Package:
SMD3225-4P
Key Attributes
Model Number: 8DSC270G0010L
Product Description

Product Overview

The Seam3225 4PIN 27.000000MHz Quartz Crystal Resonator is a high-precision, high-frequency stability component designed to reduce EMI effects. It is an ideal choice for Bluetooth devices, wireless communication sets, DSC, PDA, and mobile phones. This product is RoHS Compliant and Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Series: 8D Series
  • Sealing Type: Seam Sealing
  • Compliance: RoHS Compliant / Pb Free

Technical Specifications

Parameter Units Min Max Notes
Nominal Frequency MHz 27.000000
Oscillation Mode - Fund -
Frequency Tolerance at 25 3 ppm 10
Load Capacitance pF 10
Frequency Tolerance ppm 30
Operating Temperature Range -40 +85
Storage Temperature Range -55 +125
Aging (1st Year) ppm 3
Pulling Sensitivity ppm/pF 12
Shunt Capacitance C0 pF 5 Max.
Motional Capacitance C1 fF
Effective Resistance Rr 40 Max.
Drive Level uW 100
Insulation Resistance M 500 Min. at DC 100V
Spurious Response dB -3.0
Over Operating Temp. Range ppm 1000 +5000
Dimensions (L x W x H) mm 3.2 x 2.5 x 0.7 SMD
Reel Quantity pcs per reel 3,000 (WHITE)

Dimensions:

A B C D E F G H L L1 W W1
1.400.1 3.400.1 2.700.1 4.000.1 8.00.2 4.000.1 1.550.05 1.750.1 1781.0 130.5 11.50.2 8.0+1.0

DIMENSIONS UNIT : mm

Marking: LOGO, MHz, , ,

Reflow Condition: CX27.0

Packing: EIA-481-2

Material Composition Declaration:

No. Name of Part Material Name Material Mass(mg) Material mass (%) Constituent name CAS No. Material Analysis(%)
1 Base Ceramics 23.09% Al2O3 1344-28-1 92.40%
SiO2 7631-86-9 4.31%
Cr2o3 1308-38-9 1.50%
MgO 1309-48-4 0.69%
CaO 1305-78-8 1.10%
2 Cover Metallizing 36.95% Fe 7439-89-6 40.70%
Ni 7440-02-0 21.80%
Co 7440-48-4 12.80%
Ag 7440-22-4 21.00%
Cu 7440-50-8 3.70%
3 Adhesive Polymer 15.01%
4 Electrode Metal 3.62 W 7440-33-7 62.50%
Au 7440-57-5 4.61%
Ni 7440-02-0 32.89%
Fe 7439-89-6 47.71%
5 Solder Metal 20.91% Ni 7440-02-0 26.11%
Co 7440-48-4 15.44%
Ni 7440-02-0 10.74%
Ag 7440-22-4 75.00%
6 Wafer Quartz 0.45 2.60% SiO2 14808-60-7 100.00%
Cr 7440-47-3 5.56%
Ag 7440-22-4 94.44%
4J29 (Substrate) 0.20 1.15%
KV Ring 20.91%
Solvent 5.00%
Silicone resin 15.00%

2504101957_CHANGXING-ELECTRONICS-8DSC270G0010L_C46613763.pdf

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