Product Overview
The Glass5032 2PIN 12.000000MHz 9ASC120G0020L is a 5.0x3.2x1.2mm SMD Glass Sealing Crystal Resonator from the 9A Series. It features 2 pads, SMD glass sealing, and offers high reliability, tight tolerance, and stability. Designed for automatic mounting and reflow soldering, this crystal resonator provides a reasonable cost and good delivery performance, making it an ideal choice for portable PCs, PDAs, DSCs, and USB interface cards. It contains Pb in sealing glass, exempted by the RoHS directive.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Model: Glass5032 2PIN 12.000000MHz
- Series: 9A Series
- Product Type: Quartz Crystal Resonator
- Sealing: SMD Glass Sealing
- RoHS Exemption: Contains Pb in sealing glass exempted by RoHS directive.
Technical Specifications
| Parameter | Specification | Notes |
|---|---|---|
| Nominal Frequency | 12.000000 MHz | |
| Oscillation Mode | Fund | |
| Load Capacitance | 20 pF | |
| Frequency Tolerance (at 25 ) | 10 ppm | |
| Frequency Tolerance Over Operating Temp. Range | 30 ppm | |
| Aging (1st Year) | 3 ppm | |
| Drive Level | 100 uW | |
| Operating Temperature | -40 to +85 | |
| Storage Temperature Range | -55 to +125 | |
| Effective Resistance (Rr) | 40 Max. | |
| Shunt Capacitance (C0) | 5 pF Max. | |
| Insulation Resistance | 500 M Min. at DC 100V | |
| Pulling Sensitivity (TS) | 125 ppm/pF | |
| Spurious Response | -3.0 dB | |
| Crystal Cutting Type | AT CUT (thickness shear mode) | |
| Dimensions (L x W x H) | 5.0 x 3.2 x 1.2 mm | |
| Reel Quantity | 1,000 pcs per reel | (WHITE) |
Packing
EIA-481-2 Standard
Marking
- LOGO
- Nominal Frequency (MHz)
- Line Code
- Last three digits of Batch Number
- Year/Month Code (4-year cycle)
Reflow Condition
Refer to datasheet for specific conditions.
Reliability Specifications
1. Mechanical Endurance
- Mechanical Shock: MIL-STD-202F (1000 G, 0.5 ms duration)
- Vibration: MIL-STD-883E (10-2000 Hz, 1.52 mm/20G)
- Drop Test: JIS C6701 (75 cm height onto concrete floor, 3 times)
2. Environmental Endurance
- Resistance To Soldering Heat: MIL-STD-202F (260 5 , 10 1 sec)
- Thermal Shock: MIL-STD-883E (100 cycles)
- High Temp. Storage: MIL-STD-883E (+125 3 for 1000 12 hours)
- Low Temp. Storage: MIL-STD-883E (-40 3 for 1000 12 hours)
- High Temp & Humidity: JIS C5023 (85 3 , RH 85%, 1000Hrs)
- Solderability: MIL-STD-883E (260 5 , 5 1 seconds)
- Gross Leak: MIL-STD-883E (2Kg / cm)
- Fine Leak: MIL-STD-883E (Helium Bombing 4.5 Kgf / cm for 2 hr)
Material Composition Declaration
| Part | Material Name | Material Mass (mg) | Material Mass (%) | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|---|
| Base (Ceramics) | Ceramics | 25.446 | 48.15% | Al2O3 Aluminum oxide | 1344-28-1 | 92.41% |
| SiO2 Silicon oxide | 14808-60-7 | 4.30% | ||||
| Cr2O3 Chromium Oxide | 1308-38-9 | 1.51% | ||||
| MgO Magnesium Oxide | 1309-48-4 | 0.69% | ||||
| CaO Cclcium oxide | 1305-78-8 | 1.09% | ||||
| Metalization (W, Au, Ni) | 4.05% | |||||
| Cover (Glass) | Glass | 15.248 | 28.85% | Al2O3 Aluminum oxide | 1344-28-1 | 84.12% |
| MnO2 Manganese oxide | 1313-13-9 | 2.87% | ||||
| SiO2 Silicon oxide | 14808-60-7 | 2.87% | ||||
| TiO2 Titanium oxide | 13463-67-7 | 5.22% | ||||
| Cr2O3 Chromium oxide | 1308-38-9 | 1.91% | ||||
| Fe2O3 Iron oxide | 1309-37-1 | 2.06% | ||||
| MgO Magnesium oxide | 1309-48-4 | 0.48% | ||||
| Co3O4 Cobalt oxide | 1308-06-1 | 0.48% | ||||
| PbO Lead oxide | 1317-36-8 | 57.29% | ||||
| PbF2 Lead fluorid | 7783-46-2 | 19.29% | ||||
| Cover (Glass) | Glass | 15.248 | 28.85% | Bi2O3 Bismuth oxide | 1304-76-3 | 5.30% |
| Nb2O5 Niobium oxide | 1313-96-8 | 4.30% | ||||
| B2O3 Boron oxide | 1303-86-2 | 2.30% | ||||
| ZnO Zinc oxide | 1314-13-2 | 2.30% | ||||
| CuO Copper oxide | 1317-38-0 | 1.30% | ||||
| CaO Cclcium oxide | 1305-78-8 | 0.30% | ||||
| TiO2 Titanium oxide | 13463-67-7 | 5.30% | ||||
| Fe2O3 Iron oxide | 1309-37-1 | 2.30% | ||||
| Metal (Ag) | 75.00% | |||||
| Crystalline Silicon Dioxide | 5.00% | |||||
| Petroleum Solvent | 5.00% | |||||
| Silicone Resin | 15.00% | |||||
| Adhesive (Polymer) | Polymer | 0.340 | 0.64% | |||
| Electrode (Plating) | Electrode | 0.06 | 0.11% | Cr Chromium | 7440-47-3 | 5.56% |
| Ag silver | 7440-22-4 | 94.44% | ||||
| Plating (Ceramic) | Ceramic | 0.412 | 0.78% | |||
| Chip (Quartz) | Quartz | 1.500 | 2.84% | SiO2 Silicon oxide | 14808-60-7 | 100.00% |
2504101957_CHANGXING-ELECTRONICS-9ASC120G0020L_C46613800.pdf
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