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quality 12 MHz Quartz Crystal Resonator CHANGXING ELECTRONICS 9ASC120G0020L SMD Glass Sealing 2PIN 9A Series factory
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quality 12 MHz Quartz Crystal Resonator CHANGXING ELECTRONICS 9ASC120G0020L SMD Glass Sealing 2PIN 9A Series factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
12MHz
Mfr. Part #:
9ASC120G0020L
Package:
SMD5032-2P
Key Attributes
Model Number: 9ASC120G0020L
Product Description

Product Overview

The Glass5032 2PIN 12.000000MHz 9ASC120G0020L is a 5.0x3.2x1.2mm SMD Glass Sealing Crystal Resonator from the 9A Series. It features 2 pads, SMD glass sealing, and offers high reliability, tight tolerance, and stability. Designed for automatic mounting and reflow soldering, this crystal resonator provides a reasonable cost and good delivery performance, making it an ideal choice for portable PCs, PDAs, DSCs, and USB interface cards. It contains Pb in sealing glass, exempted by the RoHS directive.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Model: Glass5032 2PIN 12.000000MHz
  • Series: 9A Series
  • Product Type: Quartz Crystal Resonator
  • Sealing: SMD Glass Sealing
  • RoHS Exemption: Contains Pb in sealing glass exempted by RoHS directive.

Technical Specifications

Parameter Specification Notes
Nominal Frequency 12.000000 MHz
Oscillation Mode Fund
Load Capacitance 20 pF
Frequency Tolerance (at 25 ) 10 ppm
Frequency Tolerance Over Operating Temp. Range 30 ppm
Aging (1st Year) 3 ppm
Drive Level 100 uW
Operating Temperature -40 to +85
Storage Temperature Range -55 to +125
Effective Resistance (Rr) 40 Max.
Shunt Capacitance (C0) 5 pF Max.
Insulation Resistance 500 M Min. at DC 100V
Pulling Sensitivity (TS) 125 ppm/pF
Spurious Response -3.0 dB
Crystal Cutting Type AT CUT (thickness shear mode)
Dimensions (L x W x H) 5.0 x 3.2 x 1.2 mm
Reel Quantity 1,000 pcs per reel (WHITE)

Packing

EIA-481-2 Standard

Marking

  • LOGO
  • Nominal Frequency (MHz)
  • Line Code
  • Last three digits of Batch Number
  • Year/Month Code (4-year cycle)

Reflow Condition

Refer to datasheet for specific conditions.

Reliability Specifications

1. Mechanical Endurance

  • Mechanical Shock: MIL-STD-202F (1000 G, 0.5 ms duration)
  • Vibration: MIL-STD-883E (10-2000 Hz, 1.52 mm/20G)
  • Drop Test: JIS C6701 (75 cm height onto concrete floor, 3 times)

2. Environmental Endurance

  • Resistance To Soldering Heat: MIL-STD-202F (260 5 , 10 1 sec)
  • Thermal Shock: MIL-STD-883E (100 cycles)
  • High Temp. Storage: MIL-STD-883E (+125 3 for 1000 12 hours)
  • Low Temp. Storage: MIL-STD-883E (-40 3 for 1000 12 hours)
  • High Temp & Humidity: JIS C5023 (85 3 , RH 85%, 1000Hrs)
  • Solderability: MIL-STD-883E (260 5 , 5 1 seconds)
  • Gross Leak: MIL-STD-883E (2Kg / cm)
  • Fine Leak: MIL-STD-883E (Helium Bombing 4.5 Kgf / cm for 2 hr)

Material Composition Declaration

Part Material Name Material Mass (mg) Material Mass (%) Constituent Name CAS No. Material Analysis (%)
Base (Ceramics) Ceramics 25.446 48.15% Al2O3 Aluminum oxide 1344-28-1 92.41%
SiO2 Silicon oxide 14808-60-7 4.30%
Cr2O3 Chromium Oxide 1308-38-9 1.51%
MgO Magnesium Oxide 1309-48-4 0.69%
CaO Cclcium oxide 1305-78-8 1.09%
Metalization (W, Au, Ni) 4.05%
Cover (Glass) Glass 15.248 28.85% Al2O3 Aluminum oxide 1344-28-1 84.12%
MnO2 Manganese oxide 1313-13-9 2.87%
SiO2 Silicon oxide 14808-60-7 2.87%
TiO2 Titanium oxide 13463-67-7 5.22%
Cr2O3 Chromium oxide 1308-38-9 1.91%
Fe2O3 Iron oxide 1309-37-1 2.06%
MgO Magnesium oxide 1309-48-4 0.48%
Co3O4 Cobalt oxide 1308-06-1 0.48%
PbO Lead oxide 1317-36-8 57.29%
PbF2 Lead fluorid 7783-46-2 19.29%
Cover (Glass) Glass 15.248 28.85% Bi2O3 Bismuth oxide 1304-76-3 5.30%
Nb2O5 Niobium oxide 1313-96-8 4.30%
B2O3 Boron oxide 1303-86-2 2.30%
ZnO Zinc oxide 1314-13-2 2.30%
CuO Copper oxide 1317-38-0 1.30%
CaO Cclcium oxide 1305-78-8 0.30%
TiO2 Titanium oxide 13463-67-7 5.30%
Fe2O3 Iron oxide 1309-37-1 2.30%
Metal (Ag) 75.00%
Crystalline Silicon Dioxide 5.00%
Petroleum Solvent 5.00%
Silicone Resin 15.00%
Adhesive (Polymer) Polymer 0.340 0.64%
Electrode (Plating) Electrode 0.06 0.11% Cr Chromium 7440-47-3 5.56%
Ag silver 7440-22-4 94.44%
Plating (Ceramic) Ceramic 0.412 0.78%
Chip (Quartz) Quartz 1.500 2.84% SiO2 Silicon oxide 14808-60-7 100.00%

2504101957_CHANGXING-ELECTRONICS-9ASC120G0020L_C46613800.pdf

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