Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 2.5x2.0 SMD Crystal Oscillators, specifically the 4E Series with CMOS Output, are ultra-small, seam-sealed clock crystal oscillator units designed for IT products such as WLAN, Bluetooth, DSC, and DSL. These oscillators offer a tri-state function and are RoHS Compliant / Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Origin: Fujian, China
- Series: 4E Series
- Output Type: CMOS
- Compliance: RoHS Compliant / Pb Free
- Certifications: EIA-481-2 (Packing), IPC/JEDEC J-STD-033C (MSL Level 1)
Technical Specifications
| Specification | Value | Unit | Condition/Notes |
|---|---|---|---|
| Nominal Frequency | 10.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm | -55125 |
| Aging | 3 | ppm/year | -4085 |
| Operating Temperature Range | -55125 | ||
| Storage Temperature Range | -4085 | ||
| Supply Current (Icc) | 5010% | % | |
| Standby current | 1.83.3 | Vdc | |
| Supply Voltage (Vdd) | 15 | Vdc | |
| Output Load | 10 | pF | max |
| Rise/Fall Time | 15 | ns | max |
| Output Voltage VOL | 10%VDD | min | |
| Output Voltage VOH | 90%VDD | min | |
| Output Symmetry | 5010% | % | |
| Phase Jitter(12KHz 20MHz) | 3 | ps | max |
| Start-up Time | 5 | ms | max |
| Enable Voltage High | 70%Vdd | min | |
| Disable Voltage Low | 30%Vdd | max | |
| MSL Level | 1 | IPC/JEDEC J-STD-033C | |
| Product Model | 2.5x2.0 OSC 10.000000MHz | 4ESC100C0033L | |
| Dimensions | 2.5x2.0x0.8 | mm | SMD |
| Reflow Peak Temperature | 250+50 | ||
| Reflow Soldering Zone Temp. | 230 | 3010s | |
| Reflow Pre-heating Zone 1 Temp. | 150180 | 9030s | |
| Soldering Iron Bit Temperature | 35010 | ||
| Soldering Iron Application Time | 3 | s | +1 s |
| Production Weight | 13.843 | mg |
Marking Information
The marking includes: CHANGXING ELECTRONICS LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Production Batch Number, Year-Month Code.
Reliability Specifications
This section details various reliability tests including Resistance to Soldering Heat, Solderability, Terminal Strength, Drop, Vibration, Shock, Humidity, Temperature Cycle, High Temperature Storage, and Low Temperature Storage. All tests have specified conditions and acceptance criteria, typically a frequency change of 5ppm and no visible damage.
Material Composition Declaration
The product is composed of various materials including Ceramics (Base), Kovar (Lid), Solder (Pin), Gold (Wire), Silicon (IC), Silver (Electrode), and Epoxy/Conductive Resin (Adhesive Resin). Detailed elemental analysis and CAS numbers are provided for each component.
2512081627_CHANGXING-ELECTRONICS-4ESC100C0033L_C48927836.pdf
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