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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
8.192MHz
Mfr. Part #:
9ASC081G0020L
Package:
SMD5032-2P
Key Attributes
Model Number:
9ASC081G0020L
Product Description
Product Overview
The Changxing Glass5032 2PIN 8.000000MHz Quartz Crystal Resonator is a 5.0x3.2x1.2mm SMD glass-sealed crystal unit designed for automatic mounting and reflow soldering. It offers high reliability, tight tolerance, and stability, making it an ideal choice for portable PCs, PDAs, DSCs, and USB interface cards. This product is RoHS exempted for lead content in sealing glass.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Type: Quartz Crystal Resonator
- Series: 9A Series / Glass5032
- Sealing Type: SMD Glass Sealed
- Origin: Fujian, China
- Certifications/Directives: RoHS exempted (Pb in sealing glass)
Technical Specifications
| Parameter | Specification | Notes |
|---|---|---|
| Nominal Frequency | 8.192000 MHz | |
| Oscillation Mode | Fund | |
| Frequency Tolerance (at 25 ) | 10 ppm | |
| Frequency Tolerance Over Operating Temp. Range | 30 ppm | |
| Load Capacitance | 20 pF | |
| Drive Level | 100 uW | |
| Aging (1st Year) | 3 ppm | |
| Operating Temperature | -40 to +85 | |
| Storage Temperature Range | -55 to +125 | |
| Shunt Capacitance (C0) | 5 pF Max. | |
| Motional Capacitance (C1) | - | |
| Effective Resistance (Rr) | 100 Max. | |
| Insulation Resistance | 500 M Min. at DC 100V | |
| Pulling Sensitivity (TS) | - | |
| Spurious Response | -3.0 dB Max. | |
| Crystal Cutting Type | AT CUT (thickness shear mode) | |
| Dimensions (L x W x H) | 8.000.1 x 5.400.1 x 1.450.1 mm | |
| Reel Quantity | 1,000 pcs per reel | (WHITE) |
| Product Weight | 52.850 mg |
Material Composition
| Part | Material Name | Material Mass (mg) | Material Mass (%) | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|---|
| Base (Ceramics) | Ceramics | 25.446 | 48.15% | Al2O3 | 1344-28-1 | 92.41% |
| SiO2 | 14808-60-7 | 4.30% | ||||
| Cr2O3 | 1308-38-9 | 1.51% | ||||
| MgO | 1309-48-4 | 0.69% | ||||
| CaO | 1305-78-8 | 1.09% | ||||
| Cover (Glass) | Glass | 15.248 | 28.85% | PbO | 1317-36-8 | 57.29% |
| PbF2 | 7783-46-2 | 19.29% | ||||
| Bi2O3 | 1304-76-3 | 5.30% | ||||
| Nb2O5 | 1313-96-8 | 4.30% | ||||
| B2O3 | 1303-86-2 | 2.30% | ||||
| ZnO | 1314-13-2 | 2.30% | ||||
| CuO | 1317-38-0 | 1.30% | ||||
| CaO | 1305-78-8 | 0.30% | ||||
| TiO2 | 13463-67-7 | 5.30% | ||||
| Fe2O3 | 1309-37-1 | 2.30% | ||||
| Adhesive (Polymer) | Polymer | 0.340 | 0.64% | |||
| Electrode (Metal) | Metal | 0.06 | 0.11% | Ag | 7440-22-4 | 75.00% |
| 5.00% | ||||||
| 5.00% | ||||||
| 15.00% | ||||||
| Plating (Metal) | Metal | 0.412 | 0.78% | W | 7440-33-7 | 100.00% |
| Au | 7440-57-5 | 17.69% | ||||
| Ni | 7440-02-0 | 82.31% | ||||
| Wafer (Quartz) | Quartz | 1.500 | 2.84% | SiO2 | 14808-60-7 | 100.00% |
| Metallization | 2.142 | 4.05% | Al2O3 | 1344-28-1 | 84.12% | |
| MnO2 | 1313-13-9 | 2.87% | ||||
| SiO2 | 14808-60-7 | 2.87% | ||||
| TiO2 | 13463-67-7 | 5.22% | ||||
| Cr2O3 | 1308-38-9 | 1.91% | ||||
| Fe2O3 | 1309-37-1 | 2.06% | ||||
| MgO | 1309-48-4 | 0.48% | ||||
| Co3O4 | 1308-06-1 | 0.48% | ||||
| Plating | Metal | 0.412 | 0.78% | Cr | 7440-47-3 | 5.56% |
| Ag | 7440-22-4 | 94.44% |
2504101957_CHANGXING-ELECTRONICS-9ASC081G0020L_C46613797.pdf
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