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quality SMD crystal oscillator CHANGXING ELECTRONICS 4ESC240C0033L with Pb free RoHS compliance and CMOS output factory
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quality SMD crystal oscillator CHANGXING ELECTRONICS 4ESC240C0033L with Pb free RoHS compliance and CMOS output factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
24MHz
Mfr. Part #:
4ESC240C0033L
Package:
SMD2520-4P
Key Attributes
Model Number: 4ESC240C0033L
Product Description

Product Overview

The CHANGXING ELECTRONICS CO.,LTD. 4E Series is an ultra-small SMD seam-sealed clock crystal oscillator unit designed for IT products such as WLAN, Bluetooth, DSC, and DSL. It features a CMOS output and an optional tri-state function, making it a versatile component for modern electronic devices. This RoHS Compliant / Pb Free oscillator offers reliable performance within a wide operating temperature range.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Line: 4E Series
  • Type: SMD Crystal Oscillators
  • Output Type: CMOS Output
  • Certifications: RoHS Compliant / Pb Free
  • Origin: Fujian, China

Technical Specifications

Specification Value Unit Notes
Nominal Frequency 24.000000 MHz
Tolerance @ 25 Degree 10 ppm
Stability over Operation Temp. 20 ppm -4085
Aging 3 ppm/year
Operating Temperature Range -55125
Storage Temperature Range
Supply Voltage (Vdd) 1.83.3 Vdc
Supply Current (Icc) 5010% mA max
Standby current A max
Output State Control Enable/disable
Rise/Fall Time ps max
Output Voltage VOL 10%VDD min
Output Voltage VOH 90%VDD min
Output Load 10 pF max
Output Waveform CMOS
Output Symmetry %
Phase Jitter(12KHz 20MHz)
Fundamental Oscillation mode
Enable Voltage High 70%Vdd min
Disable Voltage Low 30%Vdd max
Start-up Time 5 ms max
Dimensions 2.52.00.8 mm SMD
MSL Level 1 IPC/JEDEC J-STD-033C
Product Number 4ESC240C0033L
Model 2.52.0 OSC 24.000000MHz
Production Weight 13.843 mg

Marking

Element Description
Logo LOGO
Nominal Frequency (MHz)
Line Code
Production Batch Code Last three digits
Year/Month Code Year (4-year cycle), Month (a-z for Jan-Dec)

Reflow Condition

Stage Temperature Time Notes
Peak 250+50
Soldering Zone 230 3010s
Pre-heating Zone 1 150180 9030s

Soldering Iron Method

Parameter Value Notes
Bit Temperature 35010
Application Time 31 s

Packing

EIA-481-2 standard tape packaging.

Reliability Specifications

Test Item Test Method Condition Frequency Change After Test Other Criteria
Resistance to Soldering Heat GB/T 2423.28-2005, Test Tb Method 1B Passed through re-flow oven (Preheat 150C5C for 60-120s, Peak 265C5C for 10s3s) 5ppm No visible damages.
Solderability GB/T 2423.28-2005, Method Tc 255 5 solder bath for 2 0.5 seconds 5ppm Terminals shall be covered more than 95% with solder. No visible damage.
Terminal Strength JIS-C- 6429 Method 1 & 2 Mount on glass-epoxy board, bend 2mm (velocity 1mm/sec) and hold 5s; or pulling force 0.5 kg for 60s. 5ppm No visible damages.
Drop GB/T 2423.8-1995, Method Ed Free drop from 1.0 m height onto wooden plate, 3 times. 5ppm No visible damages.
Vibration GB/T 2423.10-1995, Method Fc 0.75mm vibration, sweep frequency 10500 Hz, for 2h. 10 cycles in each of 3 perpendicular axes. 5ppm Measurement taken after 1 hour.
Shock GB/T 2423.5-1995, Method Ea Peak 1000m/s, 6ms half sine wave, 3.7m/s, 3 perpendicular axes, 3 cycles/direction, total 18 cycles. 5ppm Measurement taken after 1 hour.
Humidity GB/T 2423.3-2006, Method Cab 96 hrs at 40 C 3 C, 90 3% R.H. 5ppm Measurement taken after DUT being left at room temperature for 242 hours.
High Temperature Storage GB/T 2423.2-2001, Method Ba 72 hrs at 125C3C constant temperature. 5ppm Measurement taken after DUT being left at room temperature for 242 hours.
Low Temperature Storage GB/T 2423.1-2001, Method Aa 72 hrs at -55C3C constant temperature. 5ppm Measurement taken after DUT being left at room temperature for 242 hours.
Temperature Cycle GB/T2423.22-2002, Method Nb 10 cycles from -25C to 85C. 5ppm Measurement taken after DUT being left at room temperature for 242 hours.

Material Composition Declaration

No. Part Name Material Name Constituent Name CAS No. Material Analysis (%)
1 Base Ceramics Al2O3 1344-28-1 63.88%
SiO2 14464-46-1 3.79%
Cr2o3 1308-38-9 1.29%
Mo 7439-98-7 1.00%
Fe 7440-33-7 9.25%
Ni 7439-89-6 8.85%
Co 7440-02-0 4.75%
Ag 7440-48-4 2.98%
Cu 7440-22-4 2.80%
2 Lid Kovar W 7440-50-8 1.04%
Au 7440-02-0 0.24%
Ni 7440-57-5 0.13%
Fe 7439-89-6 54.00%
Co 7440-48-4 17.02%
Ni 7440-02-0 28.32%
Ni (Plating) 7440-02-0 0.66%
3 Adhesive Resin Epoxy 100.00%
4 Chip Quartz SiO2 14808-60-7 100.00%
5 Wire Gold Au 7440-57-5 100.00%
6 IC Silicon Silicon 7440-21-3 100.00%
7 Electrode Silver Ag 7440-22-4 100.00%
Solder Solder Ag 7440-22-4 74.00%
Ethyl alcohol 64-17-5 0.60%
Bisphenol A-epichlorohydrin polymer 25068-38-6 0.60%
Xylenes (o-, m-, p-isomers) 1330-20-7 0.60%
Ethylbenzene 100-41-4 0.06%
Silicone resin - 8.62%
Silica - 8.52%
Petroleum solvents - 7.00%

2512081627_CHANGXING-ELECTRONICS-4ESC240C0033L_C48927840.pdf

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