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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
30MHz
Mfr. Part #:
8ESC300C0033L
Package:
SMD3225-4P
Key Attributes
Model Number:
8ESC300C0033L
Product Description
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 8ESC300C0033L is a 3.2x2.5mm SMD Crystal Oscillator (OSC) with a nominal frequency of 30.000000MHz. Designed for IT products, it features ultra-small seam-sealed units and a tri-state function. This RoHS Compliant / Pb Free product is suitable for applications in WLAN, Bluetooth, DSC, and DSL.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Type: Quartz Crystal Oscillator
- Series: 8E Series
- Output Type: CMOS
- Compliance: RoHS Compliant / Pb Free
- Origin: Fujian, China
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Model | 8ESC300C0033L | ||
| Nominal Frequency | 30.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm/year | |
| Operating Temperature Range | -40 to 85 | ||
| Storage Temperature Range | -55 to 125 | ||
| Supply Voltage (Vdd) | 1.8 to 3.3 | Vdc | |
| Supply Current (Icc) | 5 | mA max | |
| Standby current | 5010% | A max | |
| Output State Control | Enable/disable | ||
| Rise/Fall Time | 5 | ns max | |
| Output Load | 15 | pF max | |
| Start-up Time | 10 | ms max | |
| Phase Jitter (12KHz20MHz) | 5 | ps max | |
| Fundamental Oscillation mode | Level 1 | ||
| Enable Voltage High | 70%Vdd | min | |
| Disable Voltage Low | 30%Vdd | max | |
| Aging | 3 | ppm/year | |
| Dimensions | 3.2 x 2.5 x 1.0mm | SMD | |
| Product Weight | 29.568 | mg |
Reflow Condition
Soldering profile: Preheat zone 1: 150180, 9030s. Soldering zone: 230 or more, 3010s. Peak: 250+50.
Soldering iron method: Bit temperature: 35010. Application time of soldering iron: 31 s.
Reliability Specifications
Standard test condition (TEMP.: 2015. Relative humidity: 6520%). For any discrepancy in GO/NG, test will be done at TEMP. 252. R.H. 655%.
| Item | Test Method | Specification |
|---|---|---|
| Solderability | GB/T 2423.28-2005, Method Tc | Terminals shall be covered more than 95% with solder. No visible damage. |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | Frequency change after test 5ppm. No visible damages. |
| Terminal Strength | JIS-C- 6429 Method 1 & 2 | or pulling force 0.5 kg for at least 60 seconds. Frequency change after test 5ppm. No visible damages. |
| Drop | GB/T 2423.8- 1995, Method Ed | Free drop to the wooden plate from 1.0 m heights for 3 times. Frequency change after test 5ppm. No visible damages. |
| Vibration | GB/T 2423.10- 1995, Method Fc | Peak 1000m/s, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Frequency change after test 5ppm. |
| Shock | GB/T 2423.5- 1995, Method Ea | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Frequency change after test 5ppm. |
| Temperature Cycle | GB/T2423.22-2002, Method Nb | 10 cycles from -25C to 85C. Frequency change after test 5ppm. |
| High Temperature Storage | GB/T 2423.2-2001, Method Ba | Spending 72 hrs at 125C3C constant temperature. Frequency change after test 5ppm. |
| Low Temperature Storage | GB/T 2423.1-2001, Method Aa | Spending 72 hrs at -55C3C constant temperature. Frequency change after test 5ppm. |
| Humidity | GB/T 2423.3- 2006, Method Cab | Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Frequency change after test 5ppm. |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2o3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-98-7 | 1.00% | |||
| Fe | 7440-33-7 | 9.25% | |||
| Ni | 7439-89-6 | 8.85% | |||
| Co | 7440-02-0 | 4.75% | |||
| Ag | 7440-48-4 | 2.98% | |||
| Cu | 7440-22-4 | 2.80% | |||
| Metallization | W | 7440-50-8 | 1.04% | ||
| Au | 7440-02-0 | 0.24% | |||
| Ni | 7440-57-5 | 0.13% | |||
| Fe | 7439-89-6 | 54.00% | |||
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| Plating | Ni (Plating) | 7440-02-0 | 0.66% | ||
| 2 | Lid | Kovar | |||
| Epoxy Conductive Resin | Adhesive Resin | 100.00% | |||
| 3 | Blank | Quartz | SiO2 | 14808-60-7 | 100.00% |
| 4 | Wire | Gold | Au | 7440-57-5 | 100.00% |
| 5 | IC | Silicon | Silicon | 7440-21-3 | 100.00% |
| 6 | Electrode | Electrode | Ag | 7440-22-4 | 100.00% |
| Solder | Silver | 7440-22-4 | 74.00% | ||
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | - | 8.62% | |||
| Silica | - | 8.52% | |||
| Petroleum solvents | - | 7.00% |
2512081627_CHANGXING-ELECTRONICS-8ESC300C0033L_C48927814.pdf
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