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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
48MHz
Mfr. Part #:
4ESC480C0033L
Package:
SMD2520-4P
Key Attributes
Model Number:
4ESC480C0033L
Product Description
Product Overview
This document details the specification for the 2.5x2.0 SMD Crystal Oscillators with CMOS Output, part of the 4E Series from CHANGXING ELECTRONICS CO.,LTD. These ultra-small, seam-sealed clock crystal oscillator units are designed for applications in WLAN, Bluetooth, DSC, DSL, and other IT products. They feature a tri-state function and are RoHS Compliant / Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Series: 4E Series
- Product Type: SMD Crystal Oscillators
- Output Type: CMOS Output
- Certifications: RoHS Compliant / Pb Free
- Origin: Fujian Province, China
Technical Specifications
| Specification | Value | Unit | Condition/Notes |
|---|---|---|---|
| Nominal Frequency | 48.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm | -4085 |
| Aging | 3 | ppm/year | |
| Operating Temperature Range | -55125 | ||
| Storage Temperature Range | -4085 | ||
| Supply Voltage (Vdd) | 1.83.3 | Vdc | |
| Supply Current (Icc) | 15 | mA max | |
| Standby current | 10 | A max | |
| Output Load | 10 | pF max | |
| Output Symmetry | 5010% | ||
| Output Waveform | CMOS | ||
| Rise/Fall Time | 15 | ns max | |
| Output Voltage VOL | 10%VDD | min | |
| Output Voltage VOH | 90%VDD | min | |
| Enable Voltage High | 70%Vdd | min | |
| Disable Voltage Low | 30%Vdd | max | |
| Start-up Time | 5 | ms max | |
| Phase Jitter(12KHz 20MHz) | 3 | ps max | |
| Output State Control | Enable/disable | ||
| Fundamental Oscillation mode | |||
| Dimensions | 2.52.00.8 | mm | (SMD) |
| MSL Level | 1 | IPC/JEDEC J-STD-033C | |
| Product Weight | 13.843 | mg | (OSC 2520) |
Marking Code
The marking code consists of: CHANGXING ELECTRONICS LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Production Batch Code, Year-Month Code.
Reflow Condition
Solder profile: Peak: 250+50, Soldering zone: 230 or more, 3010s. Pre-heating zone 1: 150180, 9030s.
Soldering iron method: Bit temperature: 35010, Application time of soldering iron: 3+1 s.
Packing
EIA-481-2 standard packaging is used.
Reliability Specifications
Standard test condition: TEMP.: 2015, Relative humidity: 6520%. For any discrepancy in GO/NG, test will be done at TEMP. 252, R.H. 655%.
| No. | SPECIFICATION ITEM | TEST METHOD | Frequency change after test | Notes |
|---|---|---|---|---|
| 1 | Resistance to SolderingHeat | GB/T 2423.28-2005, Test Tb Method 1B | 5ppm | Passed through re-flow oven (Preheat 150C5C for 60-120s, peak 265C5C for 10s3s). Measurement after 242 hours at room temperature. |
| 2 | Solderability | GB/T 2423.28-2005, Method Tc | Terminals shall be covered more than 95% with solder. No visible damage. | |
| 3 | Terminal Strength | JIS-C- 6429 Method 1 & 2 | Mount on glass-epoxy board, bend 2mm displacement (velocity 1mm/sec) and hold for 5s, or pulling force 0.5 kg for 60s. No visible damages. | |
| 4 | Drop | GB/T 2423.8-1995, Method Ed | 5ppm | Free drop from 1.0 m height for 3 times. Measurement after 1 hour. |
| 5 | Vibration | GB/T 2423.10-1995, Method Fc | 5ppm | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axes. Measurement after 1 hour. |
| 6 | Shock | GB/T 2423.5-1995, Method Ea | 5ppm | Peak 1000m/s, normal width 6ms half sine wave, 3.7m/s, 3 perpendicular axes, 3 cycles/direction, total 18 cycles. Measurement after 1 hour. |
| 7 | Humidity | GB/T 2423.3-2006, Method Cab | 5ppm | Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement after 242 hours at room temperature. |
| 8 | Temperature Cycle | GB/T2423.22-2002, Method Nb | 5ppm | 10 cycles from -25C to 85C. Measurement after 242 hours at room temperature. |
| 9 | High Temperature Storage | GB/T 2423.2-2001, Method Ba | 5ppm | Spending 72 hrs at 125C3C. Measurement after 242 hours at room temperature. |
| 10 | Low Temperature Storage | GB/T 2423.1-2001, Method Aa | 5ppm | Spending 72 hrs at -55C3C. Measurement after 242 hours at room temperature. |
Component Material Analysis
| No. | PRODUCTION NAME | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|---|
| 1 | OSC 2520 | Base () | Ceramics () | Aluminum oxide (Al2O3) | 1344-28-1 | 63.88% |
| Silica (SiO2) | 14464-46-1 | 3.79% | ||||
| Chromium oxide (Cr2o3) | 1308-38-9 | 1.29% | ||||
| Molybdenum (Mo) | 7439-98-7 | 1.00% | ||||
| Iron (Fe) | 7440-33-7 | 9.25% | ||||
| Nickel (Ni) | 7439-89-6 | 8.85% | ||||
| Cobalt (Co) | 7440-02-0 | 4.75% | ||||
| Silver (Ag) | 7440-48-4 | 2.98% | ||||
| Copper (Cu) | 7440-22-4 | 2.80% | ||||
| 2 | Lid () | Kovar | Tungsten (W) | 7440-50-8 | 1.04% | |
| Gold (Au) | 7440-02-0 | 0.24% | ||||
| Nickel (Ni) | 7440-57-5 | 0.13% | ||||
| Metallization () | Iron (Fe) | 7439-89-6 | 54.00% | |||
| Cobalt (Co) | 7440-48-4 | 17.02% | ||||
| Nickel (Ni) | 7440-02-0 | 28.32% | ||||
| Plate () | Nickel (Ni) () | Nickel (Ni) | 7440-02-0 | 0.66% | ||
| 3 | Adhesive Resin () | Epoxy () | Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | ||||
| Ethylbenzene | 100-41-4 | 0.06% | ||||
| Silicone resin () | Silicone resin | - | 8.62% | |||
| Silica () | Silica | - | 8.52% | |||
| Petroleum solvents () | Petroleumsolvents | - | 7.00% | |||
| Ethyl alcohol () | Ethyl alcohol | 64-17-5 | 0.60% | |||
| 4 | Blank () | Quartz () | Silicon oxide (SiO2) | 14808-60-7 | 100.00% | |
| 5 | Wire () | Gold () | Gold (Au) | 7440-57-5 | 100.00% | |
| 6 | IC | Silicon () | Silicon | 7440-21-3 | 100.00% | |
| 7 | Electrode () | Silver () | Silver (Ag) | 7440-22-4 | 100.00% | |
| Solder () | Silver (Ag) | 7440-22-4 | 74.00% | |||
| Tin | 7440-31-5 | 26.00% |
2512081627_CHANGXING-ELECTRONICS-4ESC480C0033L_C48927845.pdf
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