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quality Ultra Small Quartz Crystal Oscillator CHANGXING ELECTRONICS 8ESC500C0033L 3.2x2.5mm CMOS Output RoHS factory
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quality Ultra Small Quartz Crystal Oscillator CHANGXING ELECTRONICS 8ESC500C0033L 3.2x2.5mm CMOS Output RoHS factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
50MHz
Mfr. Part #:
8ESC500C0033L
Package:
SMD3225-4P
Key Attributes
Model Number: 8ESC500C0033L
Product Description

Product Overview

This document outlines the specifications for the CHANGXING ELECTRONICS CO.,LTD. Quartz Crystal Oscillator, specifically the 3.2x2.5mm SMD Crystal Oscillators, CMOS Output / 8E Series. These ultra-small, seam-sealed clock crystal oscillator units are designed for applications in WLAN, Bluetooth, DSC, DSL, and other IT products. They feature a tri-state function and are RoHS Compliant / Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Series: 8E Series
  • Product Type: Quartz Crystal Oscillator
  • Output Type: CMOS Output
  • Compliance: RoHS Compliant / Pb Free
  • Origin: Fujian, China

Technical Specifications

Specification Value Unit Notes
Nominal Frequency 50.000000 MHz
Tolerance @ 25 Degree 10 ppm
Stability over Operation Temp. 20 ppm
Operating Temperature Range -4085
Storage Temperature Range -55125
Supply Voltage (Vdd) 1.83.3 Vdc
Supply Current (Icc) 5 mA max
Standby current 1.8 A max
Rise/Fall Time 5 ns max
Output Load 15 pF max
Start-up Time 10 ms max
Phase Jitter(12KHz20MHz) 5010% ps max
Aging 3 ppm/year
Output State Control Enable/disable
Enable Voltage High 70%Vdd min
Disable Voltage Low 30%Vdd max
Output Symmetry 10%VDD
Output Voltage VOL 90%VDD max
Output Waveform CMOS
Fundamental Oscillation mode Level 1
Dimensions 3.2 x 2.5 x 1.0mm SMD
Product Number 8ESC500C0033L
Product Weight 29.568 mg

Reflow Condition

Soldering profile: Peak: 250+50. Soldering zone: 230 or more, 3010s. Pre-heating zone 1: 150180, 9030s.

Soldering iron method: Bit temperature: 35010. Application time of soldering iron: 3+1 s.

Packing

EIA-481-2 standard packing.

Reliability Specifications

Standard test condition (TEMP.: 2015. Relative humidity: 6520%). For any discrepancy in GO/NG, test will be done at TEMP.252. R.H. 655%.

  • Drop: Frequency change after test 5ppm. No visible damages.
  • Vibration: Frequency change after test 5ppm. No visible damages.
  • Resistance to Soldering Heat: Frequency change after test 5ppm. No visible damages. Terminals shall be covered more than 95% with solder.
  • Temperature Cycle: Frequency change after test 5ppm. No visible damages.
  • Low Temperature Storage: Frequency change after test 5ppm.
  • Humidity: Frequency change after test 5ppm.
  • Shock: Frequency change after test 5ppm.
  • High Temperature Storage: Frequency change after test 5ppm.
  • Solderability: Terminals shall be covered more than 95% with solder. No visible damage.
  • Terminal Strength: No visible damages.

Material Composition Declaration

No. Name of Part Material Name Constituent name CAS No. Material Analysis (%)
1 Base Ceramics Aluminum oxide 1344-28-1 63.88%
Silica 14464-46-1 3.79%
Chromium oxide 1308-38-9 1.29%
Molybdenum 7439-98-7 1.00%
Iron 7440-33-7 9.25%
Nickel 7439-89-6 8.85%
Cobalt 7440-02-0 4.75%
Silver 7440-48-4 2.98%
Copper 7440-22-4 2.80%
Metallization Tungsten 7440-50-8 1.04%
Gold 7440-02-0 0.24%
Nickel 7440-57-5 0.13%
Iron 7439-89-6 54.00%
Cobalt 7440-48-4 17.02%
Nickel 7440-02-0 28.32%
Plate Nickel (plating) Nickel 7440-02-0 0.66%
2 Lid Kovar
Epoxy Adhesive Resin - 100.00%
Conductive Resin Silicone resin - 8.62%
Silica - 8.52%
Petroleum solvents - 7.00%
3 Blank Quartz Silicon oxide 14808-60-7 100.00%
4 Wire Gold Gold 7440-57-5 100.00%
5 IC Silicon Silicon 7440-21-3 100.00%
6 Electrode Silver Silver 7440-22-4 74.00%
Ethyl alcohol 64-17-5 0.60%
Bisphenol A-epichlorohydrin polymer 25068-38-6 0.60%
Xylenes (o-, m-, p-isomers) 1330-20-7 0.60%
Ethylbenzene 100-41-4 0.06%

2512081627_CHANGXING-ELECTRONICS-8ESC500C0033L_C48927818.pdf

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