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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
40Ω
Frequency:
24.576MHz
Mfr. Part #:
9ASC245G0020L
Package:
SMD5032-2P
Key Attributes
Model Number:
9ASC245G0020L
Product Description
Product Overview
The Glass 5032 2PIN 24.576000MHz is a high-reliability SMD glass-sealed quartz crystal resonator from CHANGXING ELECTRONICS CO.,LTD. Designed for automatic mounting and reflow soldering, it offers tight tolerance, stability, and excellent environmental performance. This crystal resonator is an ideal choice for portable PCs, PDAs, DSCs, and USB interface cards, featuring a reasonable cost and good delivery performance. It contains Pb in sealing glass, exempted by the RoHS directive.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Series: 9A Series
- Product Type: Quartz Crystal Resonator
- Sealing Type: SMD Glass Sealed
- RoHS Exemption: Contains Pb in sealing glass exempted by RoHS directive.
- Origin: Fujian, China
Technical Specifications
| Parameter | Specification | Notes |
|---|---|---|
| Model | Glass5032 2PIN 24.576000MHz (9ASC245G0020L) | |
| Nominal Frequency | 24.576000 MHz | |
| Oscillation Mode | Fund | |
| Crystal Cutting Type | AT CUT (thickness shear mode) | |
| Load Capacitance | 20 pF | |
| Frequency Tolerance (at 25 ) | 10 ppm | |
| Frequency Tolerance (Over Operating Temp. Range) | 30 ppm | |
| Operating Temperature | -40 to +85 | |
| Storage Temperature Range | -55 to +125 | |
| Aging (1st Year) | 3 ppm | |
| Drive Level | 100 uW | |
| Effective Resistance (Rr) | 40 Max. | |
| Shunt Capacitance (C0) | 5 pF Max. | |
| Insulation Resistance | 500 M Min. at DC 100V | |
| Pulling Sensitivity (TS) | 20 ppm/pF | |
| Spurious Response | -3.0 dB Max. | |
| Dimensions (L x W x H) | 5.0 x 3.2 x 1.2 mm | |
| Reel Quantity | 1,000 pcs per reel | (WHITE) |
| Product Weight | 52.850 mg |
Marking
The marking consists of:
- LOGO
- Nominal Frequency (MHz)
- Line Code
- Last three digits of Production Batch Number
- Year-Month Code (4-year cycle)
Example: CX24.5 ****
Reflow Condition
Refer to standard reflow soldering profiles for SMD components. Specific parameters are not detailed in the provided text.
Packing
Standard Reel Quantity: 1,000 pcs per reel (WHITE). Packing follows EIA-481-2 standards.
Reliability Specifications
1. Mechanical Endurance
- Resistance To Soldering Heat: Pre-heat 125 (60-120 sec), Test Temp 2605 (101 sec). (MIL-STD-202F)
- Mechanical Shock: Half sine wave (1000 G), 0.5 m sec duration, 3 axes, 3 times each. (MIL-STD-202F)
- Vibration: Frequency 10-2000 Hz, Amplitude 1.52 mm/20G, 20 min sweep, 4 hours per axis. (MIL-STD-883E)
- Drop Test: 75 cm height onto concrete floor, 3 times. (JIS C6701)
2. Environmental Endurance
- High Temp Storage: +125 3 for 100012 hours. (MIL-STD-883E)
- Low Temp Storage: -40 3 for 100012 hours. (MIL-STD-883E)
- Thermal Shock: 100 cycles of specified temperature cycle. (MIL-STD-883E)
- High Temp & Humidity: 85 3, RH 85% for 1000Hrs. (JIS C5023)
- Gross Leak: Test Pressure: 2Kg / cm. (MIL-STD-883E)
- Fine Leak: Helium Bombing 4.5 Kgf / cm for 2 hr. (MIL-STD-883E)
- Solderability: Temperature 260 5, Immersing depth 0.5 mm minimum, Immersion time 5 1 seconds. Flux: Rosin resin methyl alcohol solvent (1:4). (MIL-STD-883E)
Material Composition Declaration
| Part | Material Name | Material Mass (mg) | Material Mass (%) | Constituent Element Name | CAS No. | Element Percentage (%) |
|---|---|---|---|---|---|---|
| Base (Ceramics) | Al2O3 | 92.41% | Aluminum oxide | 1344-28-1 | ||
| SiO2 | 4.30% | Silicon oxide | 14808-60-7 | |||
| Cr2O3 | 1.51% | Chromium Oxide | 1308-38-9 | |||
| MgO | 0.69% | Magnesium Oxide | 1309-48-4 | |||
| CaO | 1.09% | Cclcium oxide | 1305-78-8 | |||
| Electrode (Metal) | W | 2.142 | 4.05% | Tungsten | 7440-33-7 | 100.00% |
| Au | Gold | 7440-57-5 | 17.69% | |||
| Ni | Nickel | 7440-02-0 | 82.31% | |||
| Cover (Glass) | Al2O3 | 7.702 | 14.57% | Aluminum oxide | 1344-28-1 | 84.12% |
| MnO2 | Manganese oxide | 1313-13-9 | 2.87% | |||
| SiO2 | Silicon oxide | 14808-60-7 | 2.87% | |||
| TiO2 | Titanium oxide | 13463-67-7 | 5.22% | |||
| Cr2O3 | Chromium oxide | 1308-38-9 | 1.91% | |||
| Fe2O3 | Iron oxide | 1309-37-1 | 2.06% | |||
| MgO | Magnesium oxide | 1309-48-4 | 0.48% | |||
| Co3O4 | Cobalt oxide | 1308-06-1 | 0.48% | |||
| PbO | Lead oxide | 1317-36-8 | 57.29% | |||
| PbF2 | Lead fluoride | 7783-46-2 | 19.29% | |||
| Bi2O3 | Bismuth oxide | 1304-76-3 | 5.30% | |||
| Nb2O5 | Niobium oxide | 1313-96-8 | 4.30% | |||
| B2O3 | Boron oxide | 1303-86-2 | 2.30% | |||
| ZnO | Zinc oxide | 1314-13-2 | 2.30% | |||
| CuO | Copper oxide | 1317-38-0 | 1.30% | |||
| CaO | Calcium oxide | 1305-78-8 | 0.30% | |||
| TiO2 | Titanium oxide | 13463-67-7 | 5.30% | |||
| Fe2O3 | Iron oxide | 1309-37-1 | 2.30% | |||
| Adhesive (Polymer) | 0.340 | 0.64% | Polymer | |||
| Electrode (Plating) | Ag | Silver | 7440-22-4 | 75.00% | ||
| 0.06 | 0.11% | |||||
| Crystal Wafer | SiO2 | 1.500 | 2.84% | Silicon oxide | 14808-60-7 | 100.00% |
| Base (Ceramics) | Cr | Chromium | 7440-47-3 | 5.56% | ||
| Ag | Silver | 7440-22-4 | 94.44% | |||
| Base (Ceramics) | Al2O3 | 25.446 | 48.15% | Aluminum oxide | 1344-28-1 | |
| Base (Ceramics) | SiO2 | 4.30% | Silicon oxide | 14808-60-7 | ||
| Base (Ceramics) | Cr2O3 | 1.51% | Chromium Oxide | 1308-38-9 | ||
| Base (Ceramics) | MgO | 0.69% | Magnesium Oxide | 1309-48-4 | ||
| Base (Ceramics) | CaO | 1.09% | Cclcium oxide | 1305-78-8 | ||
| Base (Ceramics) | Petroleum solvent | 5.00% | Petroleum solvent | |||
| Base (Ceramics) | Silicone resin | 15.00% | Silicone resin |
2504101957_CHANGXING-ELECTRONICS-9ASC245G0020L_C46613809.pdf
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