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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
16MHz
Mfr. Part #:
9ESC160C0033L
Package:
SMD5032-4P
Key Attributes
Model Number:
9ESC160C0033L
Product Description
Product Overview
The 9ESC160C0033L is a 5.0x3.2mm SMD Crystal Oscillator from CHANGXING ELECTRONICS CO.,LTD. This CMOS output oscillator offers high precision across a wide frequency range, designed for automatic mounting and reflow soldering. It features a Tri-State function, a supply voltage range of 1.8V to 5.0V, high stability, low jitter, and low power consumption. Ideal for applications in wireless communication sets, PDAs, and DSCs, this RoHS Compliant / Pb Free product ensures reliable performance.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Series: 9E Series
- Product Type: Quartz Crystal Oscillator
- Output Type: CMOS Output
- Mounting Type: SMD (Surface Mount Device)
- Certifications: RoHS Compliant / Pb Free
- Origin: Fujian Province, China
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 16.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm | -4085 |
| Aging | 3 | ppm/year | |
| Operating Temperature Range | -4085 | ||
| Storage Temperature Range | -55125 | ||
| Supply Voltage (Vdd) | 1.8 ~ 5.0 | Vdc | |
| Supply Current (Icc) | 5.0 | mA max | @ 1.8V~3.3V |
| Standby current | 1.0 | A max | |
| Output State Control | Enable/disable | ||
| Enable Voltage High | 70%Vdd | min | |
| Disable Voltage Low | 30%Vdd | max | |
| Rise/Fall Time | 15 | ns max | |
| Output Voltage VOL | 10%VDD | min | |
| Output Voltage VOH | 90%VDD | min | |
| Output Load | 15 | pF max | |
| Output Waveform | CMOS | ||
| Output Symmetry | 5010% | ||
| Start-up Time | 5 | ms max | |
| Phase Jitter(12KHz 20MHz) | 5 | ps max | |
| Fundamental Oscillation mode | 3 | Level 1 | |
| MSL | 2 | IPC/JEDEC J-STD-033C | |
| Dimensions | 5.0x3.2x1.2 | mm | SMD |
| Product Model | 9ESC160C0033L | ||
| Product No. | OSC 16.000000MHz 5.0x3.2 | ||
| Product Weight | 55.653 | mg |
Reflow Condition
Soldering profile: Peak: 250+50, Soldering zone: 230 or more, 3010s. Pre-heating zone 1: 150180, 9030s.
Soldering iron method: Bit temperature: 35010, Application time of soldering iron: 31 s. For other procedures, refer to IEC 60068-2-20.
Packing
EIA-481-2 TAPE (CARRIER) DIMENSIONS
Reliability Specifications
Standard test condition (TEMP.: 2015. Relative humidity: 6520%). For any discrepancy in GO/NG, test will be done at TEMP. 252. R.H. 655%.
| ITEM | TEST METHOD | SPECIFICATION |
|---|---|---|
| Drop | GB/T 2423.8-1995, Method Ed | Free drop to the wooden plate from 1.0 m heights for 3 times. Frequency change after test5ppm. No visible damages. |
| Vibration | GB/T 2423.10-1995, Method Fc | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour. Frequency change after test5ppm. No visible damages. |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | In 255 5 solder bath for 2 0.5 seconds. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. No visible damages. Terminals shall be covered more than 95% with solder. |
| Temperature Cycle | GB/T2423.22-2002, Method Nb | 10 cycles from -25C to 85C. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. No visible damages. |
| Low Temperature Storage | GB/T 2423.1-2001, Method Aa | Spending 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. No visible damages. |
| Humidity | GB/T 2423.3-2006, Method Cab | Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. No visible damages. |
| Shock | GB/T 2423.5-1995, Method Ea | Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1 hour. Frequency change after test5ppm. No visible damages. |
| High Temperature Storage | GB/T 2423.2-2001, Method Ba | Spending 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. No visible damages. |
| Solderability | GB/T 2423.28-2005, Method Tc | Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60 seconds. Frequency change after test5ppm. No visible damages. |
| Terminal Strength | JIS-C-6429 Method 1 & 2 | Passed through the re-flow oven under the following condition. Preheat to 150 C5C for 60 to 120sec, and peak 265 C5C for 10s3sec. Measurement taken after DUT being left at room temperature for at 242 hours. Frequency change after test5ppm. No visible damages. |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis(%) | |
|---|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% | |
| SiO2 | 14464-46-1 | 3.79% | ||||
| Cr2o3 | 1308-38-9 | 1.29% | ||||
| Mo | 7439-98-7 | 1.00% | ||||
| Fe | 7440-33-7 | 9.25% | ||||
| Ni | 7439-89-6 | 8.85% | ||||
| Co | 7440-02-0 | 4.75% | ||||
| Ag | 7440-48-4 | 2.98% | ||||
| Cu | 7440-22-4 | 2.80% | ||||
| 2 | Metallization | W | Tungsten | 7440-50-8 | 1.04% | |
| Au | 7440-02-0 | 0.24% | ||||
| Ni | 7440-57-5 | 0.13% | ||||
| Fe | 7439-89-6 | 54.00% | ||||
| Co | 7440-48-4 | 17.02% | ||||
| Ni | 7440-02-0 | 28.32% | ||||
| Plate | Ni | Nickel | 7440-02-0 | 0.66% | ||
| 3 | Adhesive Resin | - | - | - | 100.00% | |
| 4 | Blank | Quartz | SiO2 Silicon oxide | 14808-60-7 | 100.00% | |
| 5 | Wire | Gold | Au Gold | 7440-57-5 | 100.00% | |
| 6 | IC | Silicon | Silicon | 7440-21-3 | 100.00% | |
| 7 | Electrode | Electrode | Ag Silver | 7440-22-4 | 100.00% | |
| Silver | Silver | 7440-22-4 | 74.00% | |||
| Ethyl alcohol | Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | Silicone resin | - | 8.62% | |||
| Silica | Silica | - | 8.52% | |||
| Petroleum solvents | Petroleum solvents | - | 7.00% | |||
| Lid | Kovar | 8.00 | ||||
| Epoxy Conductive Resin |
2512081627_CHANGXING-ELECTRONICS-9ESC160C0033L_C48927849.pdf
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