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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
12MHz
Mfr. Part #:
3ESC120C0033L
Package:
SMD2016-4P
Key Attributes
Model Number:
3ESC120C0033L
Product Description
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 3E Series 2.0x1.6 SMD Crystal Oscillator (Model: 3ESC120C0033L) is an ultra-small, seam-sealed clock crystal oscillator unit designed for applications in WLAN, Bluetooth, DSC, DSL, and other IT products. It features a CMOS output and an optional tri-state function, making it a versatile component for modern electronic devices. This RoHS Compliant and Pb Free oscillator offers a nominal frequency of 12.000000MHz.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Line: 3E Series
- Type: SMD Crystal Oscillator
- Output Type: CMOS Output
- Sealing: Seam sealed
- Compliance: RoHS Compliant / Pb Free
- Origin: Fujian Province, China
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 12.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm | |
| Aging | 3 | ppm/year | |
| Operating Temperature Range | -40 | to 85 | |
| Storage Temperature Range | -55 | to 125 | |
| Input Voltage (VDD) | 1.83.3 | Vdc | |
| Input Current (IDD) | 5 | mA max | |
| Standby current | 10 | A max | |
| Output State Control | Enable/disable | Tri-state function available | |
| Rise/Fall Time | 5010% | ns max | @ 10%VDD to 90%VDD |
| Output Voltage VOL | 10%VDD | ||
| Output Voltage VOH | 90%VDD | ||
| Output Load | 15 | pF max | |
| Output Waveform | COMS | ||
| Output Symmetry | 5010% | ||
| Start-up Time | 12 | ms max | |
| Jitter (rms) | 5 | ps max | |
| Fundamental Oscillation mode | 3 | ||
| MSL Level | 1 | ||
| Dimensions | 2.0 x 1.6 x 0.75 | mm | |
| Product Number | 3ESC120C0033L | ||
| Model | 2.0x1.6 OSC 12.000000MHz | ||
| Product Weight | 8.144 | mg |
Marking
The marking includes: Changxing Electronics LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Production Batch Code, Year-Month Code.
Reflow Condition
Temperature profile for reflow soldering:
Pre-heating zone 1: 150180, 9030s.
Soldering zone: 230 or more, 3010s.
Peak: 250+50.
Soldering iron method:
Bit temperature: 35010.
Application time of soldering iron: 3+1 s.
Packing
EIA-481-2 standard packing (TAPE (CARRIER) DIMENSIONS).
Reliability Specifications
| Item | Test Method | Specification | Notes |
|---|---|---|---|
| High Temperature Storage | GB/T 2423.2-2001, MethodBa | Frequency change after test5ppm | 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. |
| Low Temperature Storage | GB/T 2423.1-2001, MethodAa | Frequency change after test5ppm | 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. |
| Humidity | GB/T 2423.3-2006, Method Cab | Frequency change after test5ppm | 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after DUT being left at room temperature for 242 hours. |
| Temperature Cycle | GB/T2423.22-2002, Method Nb | Frequency change after test5ppm | 10 cycles from -25C to 85C. Measurement taken after DUT being left at room temperature for 242 hours. |
| Shock | GB/T 2423.5-1995, Method Ea | Frequency change after test5ppm | Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1 hour. |
| Drop | GB/T 2423.8-1995, Method Ed | Frequency change after test5ppm | Free drop to the wooden plate from 1.0 m heights for 3 times. |
| Vibration | GB/T 2423.10-1995, Method Fc | Frequency change after test5ppm | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour. |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | Frequency change after test5ppm. No visible damages. | In 255 5 solder bath for 2 0.5 seconds. |
| Solderability | GB/T 2423.28-2005, Method Tc | Terminals shall be covered more then 95% with solder. No visible damage. | Passed through the re-flow oven under the following condition. Preheat to 150 C5C for 60 to 120sec, and peak 265 C5C for 10s3sec. Measurement taken after DUT being left at room temperature for at 242 hours. |
| Terminal Strength | JIS-C-6429 Method 1 & 2 | Frequency change after test5ppm. No visible damages. | Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60 seconds. |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2o3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-33-7 | 1.00% | |||
| Fe | 7440-33-7 | 9.25% | |||
| Ni | 7439-89-6 | 8.85% | |||
| Co | 7440-02-0 | 4.75% | |||
| Ag | 7440-48-4 | 2.98% | |||
| Cu | 7440-22-4 | 2.80% | |||
| 2 | Lid | Kovar | W | 7440-50-8 | 1.04% |
| Au | 7440-02-0 | 0.24% | |||
| Ni | 7440-57-5 | 0.13% | |||
| Fe | 7439-89-6 | 54.00% | |||
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| Plate | Ni () | Ni | 7440-02-0 | 0.66% | |
| 3 | Adhesive Resin | Epoxy | Silicone resin | - | 8.62% |
| Silica | - | 8.52% | |||
| Petroleumsolvents | - | 7.00% | |||
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| 4 | Blank | Quartz | SiO2 (Silicon oxide) | 14808-60-7 | 100.00% |
| 5 | Wire | Gold | Au (Gold) | 7440-57-5 | 100.00% |
| 6 | IC | Silicon | Silicon | 7440-21-3 | 100.00% |
| 7 | Electrode | Electrode | Ag (Silver) | 7440-22-4 | 100.00% |
| Solder | Solder | Silver | 7440-22-4 | 74.00% |
2508051459_CHANGXING-ELECTRONICS-3ESC120C0033L_C48927823.pdf
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