Product Overview
The 9ESC480C0033L is a compact SMD seam-sealed crystal oscillator unit from CHANGXING ELECTRONICS CO.,LTD. Designed for automatic mounting and reflow soldering, this CMOS output oscillator offers high precision across a wide frequency range, making it suitable for applications such as wireless communication sets, PDAs, and DSCs. It features a Tri-State function, a wide supply voltage range (1.8V to 5.0V), high stability, low jitter, and low power consumption. This product is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Series: 9E Series
- Product Type: SMD Crystal Oscillators CMOS Output
- Certifications: RoHS Compliant / Pb Free
- Origin: Fujian, China
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 48.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm | -4085 |
| Aging | 3 | ppm/year | |
| Operating Temperature Range | -55125 | ||
| Storage Temperature Range | |||
| Supply Voltage (Vdd) | 1.8 ~ 5.0 | Vdc | |
| Supply Current (Icc) | mA | ||
| Standby current (1.8V3.3V) | 5010% | A max | |
| Output State Control | Enable/disable | ||
| Rise/Fall Time | 5 | ns max | |
| Output Voltage VOL | V | ||
| Output Voltage VOH | V | ||
| Output Load | 15 | pF max | |
| Output Waveform | CMOS | ||
| Output Symmetry | 70%Vdd min / 30%Vdd max | ||
| Start-up Time | 10 | ms max | |
| Enable Voltage High | V | ||
| Disable Voltage Low | V | ||
| Phase Jitter (12KHz 20MHz) | ps max | ||
| Fundamental Oscillation mode | Level 1 | ||
| Dimensions | 5.0 x 3.2 x 1.2 | mm | SMD |
| Product Number | 9ESC480C0033L | ||
| Model | OSC 5.0x3.2 48.000000MHz | ||
| Production Weight | 55.653 | mg |
Reflow Condition
Soldering profile: Peak: 250+50, Soldering zone: 230 or more, 3010s. Pre-heating zone 1: 150180, 9030s
Soldering iron method: Bit temperature: 35010, Application time of soldering iron: 31 s. For other procedures, refer to IEC 60068-2-20.
Marking
LOGO, MHz, , ,
Packing
EIA-481-2
Reliability Specifications
Standard test condition (TEMP.: 2015. Relative humidity: 6520%). For any discrepancy in GO/NG, test will be done at TEMP.252. R.H. 655%.
| ITEM | TEST METHOD | SPECIFICATION |
|---|---|---|
| Resistance to Soldering Heat | GB/T 2423.28-2005,Test Tb Method 1B | Frequency change after test5ppm. No visible damages. Terminals shall be covered more than 95% with solder. |
| Temperature Cycle | GB/T2423.22-2002, Method Nb | 10 cycles from -25C to 85C. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. |
| High Temperature Storage | GB/T 2423.2-2001, Method Ba | Spending 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. |
| Shock | GB/T 2423.5-1995,Method Ea | Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1 hour. Frequency change after test5ppm. No visible damages. |
| Drop | GB/T 2423.8- 1995,Method Ed | Free drop to the wooden plate from 1.0 m heights for 3 times. Frequency change after test5ppm. No visible damages. |
| Vibration | GB/T 2423.10- 1995, Method Fc | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour. Frequency change after test5ppm. |
| Humidity | GB/T 2423.3- 2006, Method Cab | Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. |
| Low Temperature Storage | GB/T 2423.1-2001, Method Aa | Spending 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. Frequency change after test5ppm. |
| Solderability | GB/T 2423.28-2005, Method Tc | In 255 5 solder bath for 2 0.5 seconds. Terminals shall be covered more than 95% with solder. No visible damage. |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2o3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-98-7 | 1.00% | |||
| Fe | 7440-33-7 | 9.25% | |||
| Ni | 7439-89-6 | 8.85% | |||
| Co | 7440-02-0 | 4.75% | |||
| Ag | 7440-48-4 | 2.98% | |||
| Cu | 7440-22-4 | 2.80% | |||
| Pin | Solder | W | 7440-50-8 | 1.04% | |
| Au | 7440-02-0 | 0.24% | |||
| Ni | 7440-57-5 | 0.13% | |||
| Plate | Fe | 7439-89-6 | 54.00% | ||
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| Ni () | 7440-02-0 | 0.66% | |||
| 2 | Adhesive Resin | Epoxy Conductive Resin | - | - | 100.00% |
| 3 | Blank | Quartz | SiO2 | 14808-60-7 | 100.00% |
| 4 | Wire | Gold | Au | 7440-57-5 | 100.00% |
| 5 | IC | Silicon | Silicon | 7440-21-3 | 100.00% |
| 6 | Electrode | Electrode | Ag | 7440-22-4 | 100.00% |
| 7 | Lid | Kovar | Ag | 7440-22-4 | 74.00% |
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | - | 8.62% | |||
| Silica | - | 8.52% | |||
| Petroleumsolvents | - | 7.00% |
2512081627_CHANGXING-ELECTRONICS-9ESC480C0033L_C48927856.pdf
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