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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
24MHz
Mfr. Part #:
7ESC240C0033L
Package:
SMD7050-4P
Key Attributes
Model Number:
7ESC240C0033L
Product Description
Product Overview
The 7ESC240C0033L is a 7.0x5.0mm SMD Crystal Oscillator from CHANGXING ELECTRONICS CO.,LTD. This CMOS output oscillator offers high precision across a wide frequency range, designed for automatic mounting and reflow soldering. It features a Tri-State function, a supply voltage range of 1.8V to 5.0V, high stability, low jitter, and low power consumption. Ideal for applications in wireless communication, PCs, and LCDMs, this product is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Type: Quartz Crystal Oscillator
- Series: 7E Series
- Output Type: CMOS Output
- Certifications: RoHS Compliant / Pb Free
- MSL Level: 1
Technical Specifications
| Specification | Value | Unit |
|---|---|---|
| Model | 7ESC240C0033L | |
| Nominal Frequency | 24.000000 | MHz |
| Tolerance @ 25 Degree | 10 | ppm |
| Stability over Operation Temp. | 20 | ppm |
| Operating Temperature Range | -4085 | |
| Storage Temperature Range | -55125 | |
| Supply Voltage (Vdd) | 1.8V5.0V | Vdc |
| Supply Current (Icc) | 5 | mA max |
| Standby current (1.8V3.3V) | 10 | A max |
| Phase Jitter (12KHz 20MHz) | 5 | ps max |
| Aging | 3 | ppm/year |
| Rise/Fall Time | 5 | ns max |
| Output Voltage VOL | 30%Vdd max | |
| Output Voltage VOH | 70%Vdd min | |
| Output Load | 15 | pF |
| Start-up Time | 10 | ms max |
| Output State Control | Enable/disable | |
| Enable Voltage High | 5010% | %VDD |
| Disable Voltage Low | 1.8V | V |
| Dimensions | 7.0x5.0x1.3mm | SMD |
| Product No. | 7ESC240C0033L | |
| Product Name | OSC 7050 | |
| Production Weight | 123.031 | mg |
Reflow Condition
Soldering iron method:
- Bit temperature: 35010
- Application time of soldering iron: 31 s
Solder profile:
- Peak: 250+50
- Soldering zone: 230 or more, 3010s.
- Pre-heating zone 1: 150180, 9030s
For other procedures, refer to IEC 60068-2-20.
Reliability Specifications
| Item | Test Method | Specification | Measurement Timing |
|---|---|---|---|
| Temperature Cycle | GB/T2423.22-2002, Method Nb (10 cycles from -25C to 85C) | Frequency change after test5ppm. No visible damages. | After DUT being left at room temperature for 242 hours. |
| Low Temperature Storage | GB/T2423.1-2001, Method Aa (Spending 72 hrs at -55C3C) | Frequency change after test5ppm. No visible damages. | After DUT being left at room temperature for 242 hours. |
| Humidity | GB/T2423.3-2006, Method Cab (Spending 96 hrs at 40 C 3 C, with 90 3% R.H.) | Frequency change after test5ppm. No visible damages. | After DUT being left at room temperature for 242 hours. |
| High Temperature Storage | GB/T2423.2-2001, Method Ba (Spending 72 hrs at 125C3C) | Frequency change after test5ppm. No visible damages. | After DUT being left at room temperature for 242 hours. |
| Drop | GB/T 2423.8-1995, Method Ed (Free drop to the wooden plate from 1.0 m heights for 3 times) | Frequency change after test5ppm. No visible damages. | Measurement taken after 1 hour. |
| Vibration | GB/T 2423.10-1995, Method Fc (Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis) | Frequency change after test5ppm. No visible damages. | Measurement taken after DUT being left at room temperature for 242 hours. |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B (Passed through the re-flow oven under the following condition: Preheat to 150 C5C for 60 to 120sec, and peak 265 C5C for 10s3sec) | Frequency change after test5ppm. No visible damages. | Measurement taken after DUT being left at room temperature for 242 hours. |
| Shock | GB/T 2423.5-1995, Method Ea (Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles) | Frequency change after test5ppm. No visible damages. | Measurement taken after 1hour. |
| Solderability | GB/T 2423.28-2005, Method Tc (In 255 5 solder bath for 2 0.5 seconds) | Terminals shall be covered more than 95% with solder. No visible damage. (8-12X magnifier) | There is noneed to do functioned test. |
| Terminal Strength | JIS-C-6429 Method 1 & 2 (Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60 seconds) | Frequency change after test5ppm. No visible damages. | Measurement taken after DUT being left at room temperature for 242 hours. |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis(%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2o3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-98-7 | 1.00% | |||
| Fe | 7439-89-6 | 8.85% | |||
| Ni | 7440-02-0 | 4.75% | |||
| Co | 7440-48-4 | 2.98% | |||
| Ag | 7440-22-4 | 2.80% | |||
| Cu | 7440-50-8 | 1.04% | |||
| Metallization | W | 7440-33-7 | 9.25% | ||
| Au | 7440-57-5 | 0.13% | |||
| Ni | 7440-02-0 | 0.24% | |||
| Fe | 7439-89-6 | 54.00% | |||
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| Plate | Ni | 7440-02-0 | 0.66% | ||
| 2 | Adhesive Resin | - | - | 100.00% | |
| 3 | Blank | Quartz | SiO2 | 14808-60-7 | 100.00% |
| 4 | Wire | Gold | Au | 7440-57-5 | 100.00% |
| 5 | IC Ssilicon | Silicon | Silicon | 7440-21-3 | 100.00% |
| 6 | Electrode | Electrode | Ag | 7440-22-4 | 100.00% |
| 7 | Lid | Kovar | Ag | 7440-22-4 | 74.00% |
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | - | 8.62% | |||
| Silica | - | 8.52% | |||
| Petroleumsolvents | - | 7.00% |
2512081627_CHANGXING-ELECTRONICS-7ESC240C0033L_C48927861.pdf
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