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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
12MHz
Mfr. Part #:
4ESC120C0033L
Package:
SMD2520-4P
Key Attributes
Model Number:
4ESC120C0033L
Product Description
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 4E Series is an ultra-small SMD seam-sealed crystal oscillator designed for IT products such as WLAN, Bluetooth, DSC, and DSL. It features a CMOS output and offers a tri-state function for enhanced application flexibility. This RoHS Compliant and Pb Free oscillator is built for reliable performance in demanding environments.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Origin: Fujian, China
- Series: 4E Series
- Output Type: CMOS
- Certifications: RoHS Compliant, Pb Free
- Packaging: EIA-481-2
Technical Specifications
| Specification | Value | Unit | Condition |
|---|---|---|---|
| Model | 4ESC120C0033L | ||
| Nominal Frequency | 12.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm | -4085 |
| Aging | 3 | ppm/year | |
| Operating Temperature Range | -55125 | ||
| Storage Temperature Range | -4085 | ||
| Supply Current (Icc) | 5010% | mA | 1.8V3.3V |
| Standby current | < 1 | A | |
| Rise/Fall Time | 15 | ps | max |
| Output Voltage VOL | 10%VDD | %VDD | |
| Output Voltage VOH | 90%VDD | %VDD | |
| Supply Voltage (Vdd) | 1.83.3 | Vdc | |
| Output Load | 10 | pF | max |
| Output Symmetry | 5010% | % | |
| Phase Jitter(12KHz 20MHz) | 3 | ps | max |
| Start-up Time | 5 | ms | max |
| Enable Voltage High | 70%Vdd | min | |
| Disable Voltage Low | 30%Vdd | max | |
| Dimensions | 2.52.00.8 | mm | SMD |
| MSL Level | 1 | IPC/JEDEC J-STD-033C | |
| Fundamental Oscillation mode |
Packing Information
| Type | Standard |
|---|---|
| Carrier Tape | EIA-481-2 |
Reflow Condition
| Stage | Temperature | Time |
|---|---|---|
| Peak | 250+50 | |
| Soldering Zone | 230 | 3010s |
| Pre-heating Zone 1 | 150180 | 9030s |
Reliability Specifications
| Test Item | Test Method | Frequency Change After Test | Notes |
|---|---|---|---|
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | 5ppm | Passed through re-flow oven (Preheat to 150 C5C for 60 to 120sec, peak 265 C5C for 10s3sec). Measurement taken after 242 hours at room temperature. |
| Solderability | GB/T 2423.28-2005, Method Tc | Terminals shall be covered >95% with solder. No visible damage. Tested in 255 5 solder bath for 2 0.5 seconds. | |
| Terminal Strength | JIS-C- 6429 Method 1 & 2 | 5ppm | Mount on glass-epoxy board, bend to 2mm displacement (velocity 1mm/sec) and hold for 5 seconds, or pulling force 0.5 kg for at least 60 seconds. No visible damages. |
| Drop | GB/T 2423.8- 1995, Method Ed | 5ppm | Free drop from 1.0 m height for 3 times. Measurement taken after 1 hour. |
| Vibration | GB/T 2423.10- 1995, Method Fc | 5ppm | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axes. Measurement taken after 1 hour. |
| Shock | GB/T 2423.5- 1995, Method Ea | 5ppm | Peak 1000m/s, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axes, 3 cycles/direction, total 18 cycles. Measurement taken after 1 hour. |
| Humidity | GB/T 2423.3- 2006, Method Cab | 5ppm | 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after 242 hours at room temperature. |
| High Temperature Storage | GB/T 2423.2-2001, Method Ba | 5ppm | 72 hrs at 125C3C. Measurement taken after 242 hours at room temperature. |
| Low Temperature Storage | GB/T 2423.1-2001, Method Aa | 5ppm | 72 hrs at -55C3C. Measurement taken after 242 hours at room temperature. |
| Temperature Cycle | GB/T2423.22-2002, Method Nb | 5ppm | 10 cycles from -25C to 85C. Measurement taken after 242 hours at room temperature. |
Material Composition Declaration
| No. | Part Name | Material Name | Constituent Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2o3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-98-7 | 1.00% | |||
| Fe | 7440-33-7 | 9.25% | |||
| Ni | 7439-89-6 | 8.85% | |||
| Co | 7440-02-0 | 4.75% | |||
| Ag | 7440-48-4 | 2.98% | |||
| Cu | 7440-22-4 | 2.80% | |||
| 2 | Lid | Kovar | W | 7440-50-8 | 1.04% |
| Au | 7440-02-0 | 0.24% | |||
| Ni | 7440-57-5 | 0.13% | |||
| Fe | 7439-89-6 | 54.00% | |||
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| Plate | Ni () | 7440-02-0 | 0.66% | ||
| 3 | Adhesive Resin | Epoxy | - | - | 100.00% |
| 4 | Blank | Quartz | Silicon oxide | 14808-60-7 | 100.00% |
| 5 | Wire | Gold | Au | 7440-57-5 | 100.00% |
| 6 | IC | Silicon | Silicon | 7440-21-3 | 100.00% |
| 7 | Electrode | Electrode | Ag | 7440-22-4 | 100.00% |
| Solder | Solder | Silver | 7440-22-4 | 74.00% | |
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | - | 8.62% | |||
| Silica | - | 8.52% | |||
| Petroleum solvents | - | 7.00% |
2512081627_CHANGXING-ELECTRONICS-4ESC120C0033L_C48927837.pdf
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