Product Overview
This specification sheet details the 2.0x1.6mm SMD Crystal Oscillator, 25.000000MHz, 3ESC250C0033L, from CHANGXING ELECTRONICS CO.,LTD. Designed for ultra-small seam-sealed applications, this CMOS output oscillator is suitable for IT products including WLAN, Bluetooth, DSC, and DSL. Key features include a tri-state function and RoHS/Pb-Free compliance.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Series: 3E Series
- Output Type: CMOS Output
- Compliance: RoHS Compliant / Pb Free
- Sealing: seam sealed
- Package Type: SMD
- Origin: Fujian, China
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 25.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm | |
| Aging | 3 | ppm/year | |
| Input Voltage (VDD) | 1.83.3 | Vdc | |
| Input Current (IDD) | 5 | mA max | |
| Standby current | 5010% | A max | |
| Output State Control | Enable/disable | ||
| Rise/Fall Time | 10%VDD to 90%VDD | ns max | |
| Output Voltage VOL | 1.8 | V max | |
| Output Voltage VOH | 90%VDD | V min | |
| Output Load | 15 | pF max | |
| Output Waveform | COMS | ||
| Output Symmetry | 10% | ||
| Start-up Time | 5 | ms max | |
| Jitter (rms) | 25.000000 | ps max | |
| Operating Temperature Range | -4085 | ||
| Storage Temperature Range | -55125 | ||
| Dimensions | 2.0 x 1.6 x 0.75 | mm | |
| MSL Level | 1 | IPC/JEDEC J-STD-033C | |
| Product Model | 3ESC250C0033L | ||
| Product Weight | 8.144 | mg |
Packing Information
| Type | Standard | |
|---|---|---|
| Packaging | EIA-481-2 |
Reliability Specifications
| Item | Test Method | Specification | Notes |
|---|---|---|---|
| High Temperature Storage | GB/T 2423.2-2001, Method Ba | Frequency change after test 5ppm | 72 hrs at 125C3C, measurement after 242 hrs at room temp. |
| Low Temperature Storage | GB/T 2423.1-2001, Method Aa | Frequency change after test 5ppm | 72 hrs at -55C3C, measurement after 242 hrs at room temp. |
| Humidity | GB/T 2423.3-2006, Method Cab | Frequency change after test 5ppm | 96 hrs at 40C 3C, 903% R.H., measurement after 242 hrs at room temp. |
| Temperature Cycle | GB/T2423.22-2002, Method Nb | Frequency change after test 5ppm | 10 cycles from -25C to 85C, measurement after 242 hrs at room temp. |
| Shock | GB/T 2423.5-1995, Method Ea | Frequency change after test 5ppm | Peak 1000m/s, 6ms half sine wave, 3 perpendicular axes, 3 cycles/direction, total 18 cycles. Measurement after 1 hour. |
| Drop | GB/T 2423.8-1995, Method Ed | Frequency change after test 5ppm | Free drop from 1.0 m to wooden plate, 3 times. No visible damages. |
| Vibration | GB/T 2423.10-1995, Method Fc | Frequency change after test 5ppm | 0.75mm vibration at sweep frequency 10500 Hz, for 2h, 10 cycles in each direction of 3 axes. Measurement after 1 hour. |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | Frequency change after test 5ppm. Terminals shall be covered more than 95% with solder. No visible damage. | In 255 5 solder bath for 2 0.5 seconds. |
| Solderability | GB/T 2423.28-2005, Method Tc | No visible damages. | Passed through re-flow oven: Preheat to 150C5C for 60-120s, peak 265C5C for 10s3sec. Measurement after 242 hours at room temp. |
| Terminal Strength | JIS-C-6429 Method 1 & 2 | Frequency change after test 5ppm. No visible damages. | Mount on glass-epoxy board, bend to 2mm displacement (1mm/sec) and hold 5s, or pulling force 0.5 kg for 60s. |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis(%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2o3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-98-7 | 1.00% | |||
| Fe | 7440-33-7 | 9.25% | |||
| Ni | 7439-89-6 | 8.85% | |||
| Co | 7440-02-0 | 4.75% | |||
| Ag | 7440-48-4 | 2.98% | |||
| Cu | 7440-22-4 | 2.80% | |||
| 2 | Lid | Kovar | W | 7440-50-8 | 1.04% |
| Au | 7440-02-0 | 0.24% | |||
| Ni | 7440-57-5 | 0.13% | |||
| 3 | Adhesive Resin | Epoxy Conductive Resin | Fe | 3ESC160C0033L | 54.00% |
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| Ni | 7440-02-0 | 0.66% | |||
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | - | 8.62% | |||
| Silica | - | 8.52% | |||
| Petroleumsolvents | - | 7.00% | |||
| 4 | Blank | Quartz | SiO2 Silicon oxide | 14808-60-7 | 100.00% |
| 5 | Wire | Gold | Au Gold | 7440-57-5 | 100.00% |
| 6 | IC | Silicon | Silicon | 7440-21-3 | 100.00% |
| 7 | Electrode | Electrode | Ag Silver | 7440-22-4 | 100.00% |
| Silver | 7440-22-4 | 74.00% |
2508051459_CHANGXING-ELECTRONICS-3ESC250C0033L_C48927827.pdf
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