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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
50MHz
Mfr. Part #:
4ESC500C0033L
Package:
SMD2520-4P
Key Attributes
Model Number:
4ESC500C0033L
Product Description
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 2.5x2.0mm SMD Crystal Oscillators (Model: 4ESC500C0033L) are ultra-small, seam-sealed clock crystal oscillator units designed for IT product applications including WLAN, Bluetooth, DSC, and DSL. These CMOS output oscillators offer a nominal frequency of 50.000000MHz and feature a tri-state function, with RoHS compliance and Pb-free construction.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Line: 4E Series
- Type: SMD Crystal Oscillators
- Output Type: CMOS Output
- Construction: Seam sealed
- Compliance: RoHS Compliant / Pb Free
- Origin: Fujian Province, China
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 50.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm/year | -4085 |
| Aging | 3 | ppm/year | |
| Operating Temperature Range | -55125 | ||
| Storage Temperature Range | -4085 | ||
| Supply Voltage (Vdd) | 1.83.3 | Vdc | |
| Supply Current (Icc) | 5 | mA max | |
| Standby current | 10 | A max | |
| Output Load | 10 | pF max | |
| Output Symmetry | 5010% | ||
| Output Voltage VOL | 10%VDD | min | |
| Output Voltage VOH | 90%VDD | min | |
| Enable Voltage High | 70%Vdd | min | |
| Disable Voltage Low | 30%Vdd | max | |
| Start-up Time | 5 | ms max | |
| Rise/Fall Time | 15 | ps max | |
| Phase Jitter(12KHz 20MHz) | 3 | ||
| Dimensions | 2.5x2.0x0.8 | mm | |
| MSL Level | 1 | IPC/JEDEC J-STD-033C Phase | |
| Fundamental Oscillation mode | |||
| Output State Control | Enable/disable | ||
| Output Waveform | CMOS | ||
| Product No. | 4ESC500C0033L | ||
| Model | 2.52.0 OSC 50.000000MHz | ||
| Product Weight | 13.843 | mg |
Reflow Condition
Temperature profile for reflow soldering: Peak: 250+50, Soldering zone: 230 or more, 3010s. Pre-heating zone 1: 150180, 9030s.
Soldering iron method: Bit temperature: 35010, Application time of soldering iron: 31 s. For other procedures, refer to IEC 60068-2-20.
Packing
EIA-481-2
Reliability Specifications
Standard test condition (TEMP.: 2015. Relative humidity: 6520%). For any discrepancy in GO/NG, test will be done at TEMP. 252. R.H. 655%.
| No. | SPECIFICATION ITEM | TEST METHOD | Frequency change after test | Notes |
|---|---|---|---|---|
| 1 | Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | 5ppm | Passed through the re-flow oven under the following condition. Preheat to 150 C5C for 60 to 120sec, and peak 265 C5C for 10s3sec. Measurement taken after DUT being left at room temperature for at 242 hours. |
| 2 | Solderability | GB/T 2423.28-2005, Method Tc | 5ppm | In 255 5 solder bath for 2 0.5 seconds. There is noneed to do functioned test. 8-12X magnifier. |
| 3 | Terminal Strength | JIS-C- 6429 Method 1 & 2 | 5ppm | Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60seconds. No visible damages. Terminals shall be covered more then 95% with solder. No visible damage |
| 4 | Drop | GB/T 2423.8- 1995, Method Ed | 5ppm | Free drop to the wooden plate from 1.0 m heights for 3 times. No visible damages. |
| 5 | Vibration | GB/T 2423.10- 1995, Method Fc | 5ppm | Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1hour. |
| 6 | Shock | GB/T 2423.5- 1995, Method Ea | 5ppm | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour. |
| 7 | Humidity | GB/T 2423.3- 2006, Method Cab | 5ppm | Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after DUT being left at room temperature for 242 hours. |
| 8 | High Temperature Storage | GB/T 2423.2-2001, Method Ba | 5ppm | Spending 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. |
| 9 | Low Temperature Storage | GB/T 2423.1-2001, Method Aa | 5ppm | Spending 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. |
| 10 | Temperature Cycle | GB/T2423.22-2002, Method Nb | 5ppm | 10 cycles from -25C to 85C. Measurement taken after DUT being left at room temperature for 242 hours. |
Material Composition Declaration
| No. | PRODUCTION NAME | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis(%) |
|---|---|---|---|---|---|---|
| 1 | OSC 2520 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | ||||
| Cr2o3 | 1308-38-9 | 1.29% | ||||
| Mo | 7439-98-7 | 1.00% | ||||
| Fe | 7440-33-7 | 9.25% | ||||
| Ni | 7439-89-6 | 8.85% | ||||
| Co | 7440-02-0 | 4.75% | ||||
| Ag | 7440-48-4 | 2.98% | ||||
| Cu | 7440-22-4 | 2.80% | ||||
| Metallization | Pin | Metallization | W | 7440-50-8 | 1.04% | |
| Au | 7440-02-0 | 0.24% | ||||
| Ni | 7440-57-5 | 0.13% | ||||
| Solder | Solder | Fe | 7439-89-6 | 54.00% | ||
| Co | 7440-48-4 | 17.02% | ||||
| Ni | 7440-02-0 | 28.32% | ||||
| Plate | Plate | Ni | 7440-02-0 | 0.66% | ||
| 2 | Lid | Kovar | ||||
| 3 | Adhesive Resin | Epoxy | 100.00% | |||
| 4 | Blank | Quartz | SiO2 | 14808-60-7 | 100.00% | |
| 5 | Wire | Gold | Au | 7440-57-5 | 100.00% | |
| 6 | IC | Silicon | Silicon | 7440-21-3 | 100.00% | |
| 7 | Electrode | Electrode | Ag | 7440-22-4 | 100.00% | |
| Silver | 7440-22-4 | 74.00% | ||||
| Conductive Resin | Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | ||||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | ||||
| Ethylbenzene | 100-41-4 | 0.06% | ||||
| Silicone resin | - | 8.62% | ||||
| Silica | - | 8.52% | ||||
| Petroleumsolvents | - | 7.00% |
2512081627_CHANGXING-ELECTRONICS-4ESC500C0033L_C48927846.pdf
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