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quality 26.298200MHz Quartz Crystal Resonator CHANGXING ELECTRONICS 8DSC262G0015L Seam Sealing and Pb Free Design factory
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quality 26.298200MHz Quartz Crystal Resonator CHANGXING ELECTRONICS 8DSC262G0015L Seam Sealing and Pb Free Design factory
>
Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
15pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
26.2982MHz
Mfr. Part #:
8DSC262G0015L
Package:
SMD3225-4P
Key Attributes
Model Number: 8DSC262G0015L
Product Description

Product Overview

The Seam 3225 4PIN 26.298200MHz Quartz Crystal Resonator, model 8DSC262G0015L, is a high-precision, high-frequency stability component designed to reduce EMI effects. It is an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. This product is RoHS Compliant and Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Series: 8D Series
  • Crystal Cutting Type: AT CUT (thickness shear mode)
  • Compliance: RoHS Compliant / Pb Free
  • Sealing Type: Seam Sealing
  • Packaging: EIA-481-2

Technical Specifications

Parameter Value Units Notes
Nominal Frequency 26.298200 MHz Fund
Frequency Tolerance (at 25 3 ) 10 ppm
Load Capacitance 15 pF
Operating Temperature Range -40+85
Storage Temperature Range -55+125
Aging (1st Year) 3 ppm
Frequency Tolerance (Over Operating Temp. Range) 30 ppm
Shunt Capacitance (C0) 5 Max. pF
Motional Capacitance (C1) -
Effective Resistance (Rr) 40 Max.
Drive Level 100 uW Max.
Pulling Sensitivity (TS) - ppm/pF
Spurious Response -3.0 dB
Insulation Resistance 500 Min. M (at DC 100V)
Dimensions (L x W x H) 3.2 x 2.5 x 0.7 mm SMD
Reel Quantity 3,000 pcs per reel (WHITE)
Product Weight 17.322 mg

Dimensions (mm):

Dimension Value
A 1.400.1
B 3.400.1
C 2.700.1
D 4.000.1
E 8.00.2
F 4.000.1
G 1.550.05
H 1.750.1
L 1781.0
L1 130.5
W 11.50.2
W1 8.0+1.0

Marking: LOGO, MHz, , ,

Reflow Condition: CX26.2 ****

Material Composition:

  • Base (Ceramics): Al2O3 (92.40%), SiO2 (4.31%), Cr2o3 (1.50%), MgO (0.69%), CaO (1.10%)
  • Electrode (Metal): Fe (47.71%), Ni (26.11%), Co (15.44%), Ni (10.74%)
  • Metallizing (Metal): W (62.50%), Au (4.61%), Ni (32.89%)
  • (Metal): Ag (75.00%), Ni (25.00%)
  • (Quartz): SiO2 (100.00%)
  • (Polymer): (5.00%), (5.00%), (15.00%)
  • (Solder): Ag (94.44%), Cr (5.56%)
  • (Adhesive): 4J29 ()

2504101957_CHANGXING-ELECTRONICS-8DSC262G0015L_C46613762.pdf

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