<
>
Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
40MHz
Mfr. Part #:
4ESC400C0033L
Package:
SMD2520-4P
Key Attributes
Model Number:
4ESC400C0033L
Product Description
Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 2.5x2.0mm SMD Crystal Oscillators, part of the CMOS Output / 4E Series, are ultra-small, seam-sealed clock crystal oscillator units designed for IT product applications including WLAN, Bluetooth, DSC, and DSL. These oscillators offer a tri-state function and are RoHS Compliant / Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Origin: Fujian, China
- Certifications: RoHS Compliant / Pb Free
- Series: 4E Series
- Output Type: CMOS
- Package Type: SMD
- Sealing: Seam sealed
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 40.000000 | MHz | |
| Tolerance @ 25 Degree | ±10 | ppm | |
| Stability over Operation Temp. (-40~85°C) | ±20 | ppm | |
| Aging (per year) | ±3 | ppm/year | |
| Operating Temperature Range | -55 ~ 125 | °C | |
| Storage Temperature Range | -40 ~ 85 | °C | |
| Supply Voltage (Vdd) | 1.8 ~ 3.3 | Vdc | |
| Supply Current (Icc) | 50 | mA max | |
| Standby current | <10 | μA max | |
| Output Load | 10 | pF max | |
| Rise/Fall Time | <15 | ns max | |
| Output Voltage VOL | 10% VDD | ||
| Output Voltage VOH | 90% VDD | ||
| Output Symmetry | 50 ±10% | ||
| Phase Jitter (12KHz ~ 20MHz) | <15 | ps max | |
| Start-up Time | 5 | ms max | |
| Enable Voltage High | 70% Vdd min | ||
| Disable Voltage Low | 30% Vdd max | ||
| Output Waveform | CMOS | ||
| Fundamental Oscillation mode | |||
| MSL Level | 1 | IPC/JEDEC J-STD-033C | |
| Dimensions (L x W x H) | 2.5 x 2.0 x 0.8 | mm | |
| Product Number | 4ESC400C0033L | ||
| Model | OSC 2.5x2.0 | ||
| Product Weight | 13.843 | mg |
Reflow Condition
Temperature profile for reflow soldering:
Peak: 250+50°C
Soldering zone: ≥ 230°C, 30±10s.
Pre-heating zone 1: 150180°C, 90±30s.
Soldering iron method:
Bit temperature: 350±10°C
Application time of soldering iron: 3+1 s
Reliability Specifications
Standard test condition (TEMP.: 20±15°C. Relative humidity: 65±20%). For any discrepancy in GO/NG, test will be done at TEMP. 25±2°C. R.H. 65±5%.
| No. | SPECIFICATION ITEM | TEST METHOD | Frequency change after test | Notes |
|---|---|---|---|---|
| 1 | Resistance to SolderingHeat | GB/T 2423.28-2005, Test Tb Method 1B | ≤±5ppm | Passed through the re-flow oven under the following condition. Preheat to 150 °C±5°C for 60 to 120sec, and peak 265 °C±5°C for 10s±3sec. Measurement taken after DUT being left at room temperature for at 24±2 hours. |
| 2 | Solderability | GB/T 2423.28-2005, Method Tc | In 255 ± 5°C solder bath for 2 ± 0.5 seconds. Terminals shall be covered more then 95% with solder. No visible damage. | |
| 3 | Terminal Strength | JIS-C- 6429 Method 1 & 2 | Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60 seconds. No visible damages. | |
| 4 | Drop | GB/T 2423.8- 1995, Method Ed | ≤±5ppm | Free drop to the wooden plate from 1.0 m heights for 3 times. Measurement taken after 1 hour. |
| 5 | Vibration | GB/T 2423.10- 1995, Method Fc | ≤±5ppm | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour. |
| 6 | Shock | GB/T 2423.5- 1995, Method Ea | ≤±5ppm | Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1 hour. |
| 7 | Humidity | GB/T 2423.3- 2006, Method Cab | ≤±5ppm | Spending 96 hrs at 40 °C ± 3 °C, with 90± 3% R.H. Measurement taken after DUT being left at room temperature for 24±2 hours. |
| 8 | Temperature Cycle | GB/T2423.22-2002, Method Nb | ≤±5ppm | 10 cycles from -25°C to 85°C. Measurement taken after DUT being left at room temperature for 24±2 hours. |
| 9 | High Temperature Storage | GB/T 2423.2-2001, Method Ba | ≤±5ppm | Spending 72 hrs at 125°C±3°C constant temperature. Measurement taken after DUT being left at room temperature for 24±2 hours. |
| 10 | Low Temperature Storage | GB/T 2423.1-2001, Method Aa | ≤±5ppm | Spending 72 hrs at -55°C±3°C constant temperature. Measurement taken after DUT being left at room temperature for 24±2 hours. |
Material Composition Declaration
| No. | PRODUCTION NAME | Name of Part | Material Name | CAS No. | Material Analysis (%) |
|---|---|---|---|---|---|
| 1 | OSC 2520 | Base () | Aluminum oxide | 1344-28-1 | 63.88% |
| Silica | 14464-46-1 | 3.79% | |||
| Chromium oxide | 1308-38-9 | 1.29% | |||
| Molybdenum | 7439-98-7 | 1.00% | |||
| Iron | 7440-33-7 | 9.25% | |||
| Nickel | 7439-89-6 | 8.85% | |||
| Cobalt | 7440-02-0 | 4.75% | |||
| Silver | 7440-48-4 | 2.98% | |||
| Copper | 7440-22-4 | 2.80% | |||
| 2 | Metallization () | Tungsten | 7440-50-8 | 1.04% | |
| Gold | 7440-02-0 | 0.24% | |||
| Nickel | 7440-57-5 | 0.13% | |||
| Iron | 7439-89-6 | 54.00% | |||
| Cobalt | 7440-48-4 | 17.02% | |||
| Nickel | 7440-02-0 | 28.32% | |||
| Plate () | Nickel () | 7440-02-0 | 0.66% | ||
| 3 | Adhesive Resin | Epoxy | 25068-38-6 | 0.60% | |
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | - | 8.62% | |||
| Silica | - | 8.52% | |||
| Petroleumsolvents | - | 7.00% | |||
| 4 | Blank () | Quartz | 14808-60-7 | 100.00% | |
| 5 | Wire | Gold | 7440-57-5 | 100.00% | |
| 6 | IC | Silicon | 7440-21-3 | 100.00% | |
| 7 | Electrode () | Silver | 7440-22-4 | 100.00% | |
| 8 | Solder () | Silver | 7440-22-4 | 74.00% |
2512081627_CHANGXING-ELECTRONICS-4ESC400C0033L_C48927844.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
