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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Frequency Stability:
±30ppm
Load Capacitance:
20pF
Operating Temperature:
-40℃~+85℃
Equivalent Series Resistance(ESR):
-
Frequency:
20MHz
Mfr. Part #:
9ASC200G0020L
Package:
SMD5032-2P
Key Attributes
Model Number:
9ASC200G0020L
Product Description
Product Overview
The Glass5032 2PIN 20.000000MHz 9ASC200G0020L is a 2-pad SMD glass-sealed quartz crystal resonator designed for automatic mounting and reflow soldering. It offers high reliability, tight tolerance, and stability, making it a cost-effective and well-delivered solution for portable PCs, PDAs, DSCs, and USB interface cards. The product contains Pb in sealing glass, exempted by RoHS directive.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Model: Glass5032 2PIN 20.000000MHz 9ASC200G0020L
- Series: 9A Series
- Type: Quartz Crystal Resonator
- Sealing: SMD Glass Sealing
- Origin: Fujian Province, China
- RoHS Exemption: Contains Pb in sealing glass exempted by RoHS directive.
Technical Specifications
| Parameter | Specification | Units | Notes |
|---|---|---|---|
| Nominal Frequency | 20.000000 | MHz | |
| Load Capacitance | 20 | - | |
| Frequency Tolerance (at 25 ) | 10 | ppm | |
| Frequency Tolerance Over Operating Temp. Range | 30 | ppm | |
| Operating Temperature | -40+85 | ||
| Storage Temperature Range | -55+125 | ||
| Aging (1st Year) | 3 | ppm | |
| Effective Resistance (Rr) | 40 | Max. | |
| Shunt Capacitance (C0) | 5 | Max. pF | |
| Insulation Resistance | 500 | Min. M | at DC 100V |
| Drive Level | 100 | uW | |
| Pulling Sensitivity (TS) | - | ppm/pF | 0.0130W/15 steps |
| Spurious Response | -3.0 | dB | |
| Crystal Cutting Type | AT CUT | (thickness shear mode) | |
| Dimensions (L x W x H) | 5.0 x 3.2 x 1.2 | mm | |
| Reel Quantity | 1,000 | pcs/reel | (WHITE) |
| Base Material | Ceramics | ||
| Cover Material | Glass | ||
| Electrode Material | Tungsten, Gold, Nickel | ||
| Adhesive Material | Lead oxide, Lead fluoride, Bismuth oxide, Niobium oxide, Boron oxide, Zinc oxide, Copper oxide, Calcium oxide | ||
| Plating Material | Silver | ||
| Chip Material | Quartz (Silicon oxide) |
Packing Details
| Dimension | Value | Unit |
|---|---|---|
| A | 1.45 | 0.1 mm |
| B | 5.40 | 0.1 mm |
| C | 3.60 | 0.1 mm |
| D | 8.00 | 0.1 mm |
| E | 12.0 | 0.2 mm |
| F | 4.00 | 0.1 mm |
| G | 1.55 | 0.05 mm |
| H | 1.75 | 0.1 mm |
| L | 180 | 1.0 mm |
| L1 | 13 | 0.5 mm |
| W | 16.5 | 0.2 mm |
| W1 | 12.0 | +1.0 mm |
Reliability Specifications
1. Mechanical Endurance
- Resistance To Soldering Heat: Pre-heat 125 (60120 sec), Test 2605 (101 sec)
- Mechanical Shock: Half sine wave (1000 G), 0.5 msec duration, 3 axes, 3 times each.
- Vibration: Frequency 102000 Hz, Amplitude 1.52 mm/20G, Sweep time 20 min, 4 hours per axis (Total 12 hours).
2. Environmental Endurance
- High Temp & Humidity: 85 3, RH 85%, 1000Hrs
- Thermal Shock: 100 cycles of specified temperature cycle.
- High Temp. Storage: +125 3 for 1000 12 hours
- Low Temp. Storage: -40 3 for 1000 12 hours
- Gross Leak: Test Pressure: 2Kg / cm
- Fine Leak: Helium Bombing 4.5 Kgf / cm for 2 hr
- Solderability: Temperature 260 5, Immersing depth 0.5 mm minimum, Immersion time 5 1 seconds
Marking
LOGO, Product Model (CX20.0), Line Code, Last three digits of batch number, Year-Month Code (4-year cycle).
2504101957_CHANGXING-ELECTRONICS-9ASC200G0020L_C46613806.pdf
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