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quality Seam Sealed Quartz Crystal Oscillator 8E Series CHANGXING ELECTRONICS 8ESC200C0033L Ultra Small Size factory
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quality Seam Sealed Quartz Crystal Oscillator 8E Series CHANGXING ELECTRONICS 8ESC200C0033L Ultra Small Size factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
20MHz
Mfr. Part #:
8ESC200C0033L
Package:
SMD3225-4P
Key Attributes
Model Number: 8ESC200C0033L
Product Description

Product Overview

The CHANGXING ELECTRONICS CO.,LTD. 3.2x2.5mm SMD Crystal Oscillators (OSC 20.000000MHz, 8E Series) are ultra-small, seam-sealed clock crystal oscillator units designed for IT products such as WLAN, Bluetooth, DSC, and DSL. These RoHS Compliant / Pb Free oscillators offer a tri-state function for enhanced application flexibility.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Line: 8E Series
  • Certifications: RoHS Compliant / Pb Free
  • Origin: Fujian Province, China
  • Product Type: Quartz Crystal Oscillator
  • Output Type: CMOS

Technical Specifications

Specification Value Unit Notes
Nominal Frequency 20.000000 MHz
Tolerance @ 25 Degree ±10 ppm
Stability over Operation Temp. ±20 ppm -40 to 85 °C
Aging ±3 ppm/year
Operating Temperature Range -40 to 85 °C
Storage Temperature Range -55 to 125 °C
Supply Voltage (Vdd) 1.8 to 3.3 Vdc
Supply Current (Icc) 5 mA max
Standby current 8 μA max
Rise/Fall Time 5 ns max
Output Load 15 pF max
Output Symmetry 10% VDD 90% VDD
Start-up Time 5 ms max
Phase Jitter (12KHz~20MHz) 50 ps max Level 1
Output State Control Enable/disable
Enable Voltage High 70% Vdd min
Disable Voltage Low 30% Vdd max
Fundamental Oscillation mode 3.2x2.5x1.0mm SMD
Dimensions 3.2 x 2.5 x 1.0 mm
Product No. 8ESC200C0033L
Product Weight 29.568 mg

Marking: LOGO, Nominal Frequency (MHz), Line Code, Last three digits of production batch code, Year/Month Code.

Reflow Condition: Peak: 250+50°C, Soldering zone: ≥230°C for 30±10s. Pre-heating zone 1: 150-180°C for 90±30s.

Soldering Iron Method: Bit temperature: 350±10°C, Application time: 3+1 s.

Reliability Specifications: Frequency change after test ≤±5ppm for Drop, Vibration, Resistance to Soldering Heat, Temperature Cycle, Low Temperature Storage, Humidity, Shock, and High Temperature Storage tests.

Material Composition: Includes Ceramic Base, Kovar Lid, Solder, Gold, Tungsten, Nickel, Iron, Cobalt, Silver, Copper, Silicon, and Adhesive Resin.


2512081627_CHANGXING-ELECTRONICS-8ESC200C0033L_C48927810.pdf

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