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Specifications
Mfr. Part #:
8DSC384G0007L
Package:
SMD3225-4P
Key Attributes
Model Number:
8DSC384G0007L
Product Description
Product Overview
The Seam3225 4PIN 38.400000MHz Quartz Crystal Resonator is a high-precision, high-frequency stability component designed for demanding applications. It excels at reducing EMI effects and is an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. This product is RoHS Compliant and Pb Free, ensuring environmental responsibility.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Model: Seam3225 4PIN 38.400000MHz
- Product Number: 8DSC384G0007L
- Certifications: RoHS Compliant / Pb Free
- Packaging: EIA-481-2
- Crystal Cutting Type: AT CUT (thickness shear mode)
- MSL Level: 1 (IPC/JEDEC J-STD-033C)
Technical Specifications
| Parameter | Units | Value | Notes |
|---|---|---|---|
| Nominal Frequency | MHz | 38.400000 | |
| Frequency Tolerance | ppm | 10 | at 25 3 |
| Load Capacitance | pF | 7 | |
| Shunt Capacitance C0 | pF | 5 Max. | |
| Effective Resistance Rr | 40 Max. | ||
| Motional Capacitance C1 | fF | ||
| Pulling Sensitivity TS | ppm/pF | ||
| Insulation Resistance | M | 500 Min. | at DC 100V |
| Drive Level | uW | 100 | |
| Aging (1st Year) | ppm | 3 | |
| Frequency Stability (Over Operating Temp. Range) | ppm | 30 | |
| Operating Temperature Range | -40+85 | ||
| Storage Temperature Range | -55+125 | ||
| Spurious Response | dB | -3.0 Max. | |
| Dimensions (L x W x H) | mm | 3.2 x 2.5 x 0.7 | |
| Reel Quantity | pcs per reel | 3,000 | (WHITE) |
| Marking | LOGO, Nominal Frequency (MHz), Line Code, Last three digits of batch number, Year/Month Code | ||
| Reflow Condition | Refer to IPC/JEDEC J-STD-033C | ||
| Material Composition - Base (Ceramics) | % | 36.95% | Al2O3: 92.40%, SiO2: 4.31%, Cr2o3: 1.50%, MgO: 0.69%, CaO: 1.10% |
| Material Composition - Cover (4J29) | % | 20.91% | |
| Material Composition - Adhesive (Polymer) | % | 1.15% | |
| Material Composition - Metallizing | % | 23.09% | W: 100.00%, Au: 100.00%, Ni: 100.00% |
| Material Composition - Electrode | % | 0.29% | Fe: 53.45%, Ni: 29.25%, Co: 17.30% |
| Material Composition - Chip (Quartz) | % | 2.60% | SiO2: 100.00% |
| Material Composition - Metal Plating | % | 15.01% | Ni: 100.00% |
| Material Composition - Solder | % | 4.00% | Ag: 75.00%, Undecane: 5.00%, Dodecane: 5.00%, Silicone resin: 15.00% |
2509161435_CHANGXING-ELECTRONICS-8DSC384G0007L_C51902147.pdf
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