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quality Seam sealed quartz crystal resonator CHANGXING ELECTRONICS 8DSC500G0010L 50 MHz ideal for Bluetooth and mobile devices factory
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quality Seam sealed quartz crystal resonator CHANGXING ELECTRONICS 8DSC500G0010L 50 MHz ideal for Bluetooth and mobile devices factory
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Specifications
Mfr. Part #:
8DSC500G0010L
Package:
SMD3225-4P
Key Attributes
Model Number: 8DSC500G0010L
Product Description

Product Overview

The Seam3225 4PIN 50.000000MHz 8DSC500G0010L is a high-precision quartz crystal resonator designed for applications requiring high frequency stability and EMI reduction. It is an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. This product is RoHS Compliant and Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Model: Seam3225
  • Series: 8D Series
  • Sealing Type: Seam Sealing
  • Certifications: RoHS Compliant / Pb Free

Technical Specifications

Parameter Value Units Notes
Nominal Frequency 50.000000 MHz Fund
Frequency Tolerance 10 ppm at 25 3
Load Capacitance 10 pF 0.01100W/Step
Operating Temperature Range -40+85
Storage Temperature Range -55+125
Frequency Stability 30 ppm Over Operating Temp. Range
Aging (1st Year) 3 ppm
Pulling Sensitivity (TS) - ppm/pF 125 at DC 100V
Shunt Capacitance (C0) 5 Max. pF
Motional Capacitance (C1) - Max.
Effective Resistance (Rr) 40 Max.
Insulation Resistance 500 Min. M
Drive Level 100 uW Max.
Spurious Response -3.0 Max. dB
Dimensions (L x W x H) 3.2 x 2.5 x 0.7 mm SMD
Reel Quantity 3,000 pcs per reel (WHITE)
Weight 17.322 mg (PRODUCTION WEIGHT)

Packing Information

Packing: EIA-481-2 Standard Reel Quantity: 3,000 pcs per reel (WHITE)

Material Composition Declaration

Base (Ceramics): Al2O3 (92.40%), SiO2 (4.31%), Cr2o3 (1.50%), MgO (0.69%), CaO (1.10%)

Cover (4J29 Base Material): 20.91%

Adhesive (Polymer): Silicone resin (15.00%), Undecane (5.00%), Dodecane (5.00%), 1.15%

Electrode: Ag (75.00%), 5.00%, 5.00%, 15.00%

Chip (Quartz): SiO2 (100.00%), 2.60%

Metallizing: W (100.00%), Au (100.00%), Ni (100.00%)

Metal: Fe (53.45%), Ni (29.25%), Co (17.30%)

Plating (Ni): Ni (100.00%)

Solder: Fe (40.70%), Ni (21.80%), Co (12.80%), Ag (21.00%), Cu (3.70%), 23.09%

KV Ring: Cr (5.56%), Ag (94.44%), 15.01%


2509161435_CHANGXING-ELECTRONICS-8DSC500G0010L_C51902151.pdf

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