Product Overview
The CHANGXING ELECTRONICS CO.,LTD. 7E Series is a line of SMD Crystal Oscillators designed for automatic mounting and reflow soldering. These seam-sealed clock crystal oscillator units offer high precision across a wide frequency range, featuring a Tri-State function and a supply voltage range of 1.8V to 5.0V. They are engineered for high stability, low jitter, and low power consumption, making them ideal for applications in wireless communication, PCs, and LCDM. These oscillators are RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Line: 7E Series
- Certifications: RoHS Compliant / Pb Free
- Packaging: EIA-481-2
- Output Type: CMOS Output
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Model | 7ESC400C0033L | - | |
| Product No. | 7.05.0 OSC 40.000000MHz | - | |
| Dimensions | 7.0x5.0x1.3mm | mm | SMD Crystal Oscillators |
| Nominal Frequency | 40.000000 | MHz | |
| Tolerance @ 25 Degree | 10 | ppm | |
| Stability over Operation Temp. | 20 | ppm/year | |
| Operating Temperature Range | -4085 | ||
| Storage Temperature Range | -55125 | ||
| Supply Voltage (Vdd) | 1.8V5.0V | Vdc | |
| Supply Current (Icc) | 5 | A max | Standby current (1.8V3.3V) |
| Phase Jitter (12KHz 20MHz) | 5 ps max | ps | |
| Output Load | 15 pF | pF | |
| Rise/Fall Time | 5 ns max | ns | |
| Output Voltage VOL | 10% VDD max | % VDD | |
| Output Voltage VOH | 90% VDD min | % VDD | |
| Enable Voltage Low | 30% VDD max | % VDD | |
| Enable Voltage High | 70% VDD min | % VDD | |
| Start-up Time | 10 ms max | ms | |
| Output Symmetry | 5010% | % | |
| Output State Control | Enable/disable | - | |
| Fundamental Oscillation mode | MSL Level 1 | - | IPC/JEDEC J-STD-033C |
| Reflow Condition Peak | 250+50 | ||
| Reflow Soldering zone | 230 or more, 3010s | , s | |
| Reflow Pre-heating zone 1 | 150180, 9030s | , s | |
| Soldering iron method Bit temperature | 35010 | ||
| Soldering iron method Application time | 3+1 | s | |
| Product Weight | 123.031 | mg |
Reliability Specifications
| Item | Test Method | Specification | Measurement Condition |
|---|---|---|---|
| Temperature Cycle | GB/T2423.22-2002, Method Nb | Frequency change after test5ppm. | 10 cycles from -25C to 85C. Measurement taken after DUT being left at room temperature for 242 hours. |
| Low Temperature Storage | GB/T2423.1-2001, MethodAa | Frequency change after test5ppm. | Spending 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. |
| Humidity | GB/T2423.3-2006, Method Cab | Frequency change after test5ppm. | Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after DUT being left at room temperature for 242 hours. |
| High Temperature Storage | GB/T2423.2-2001, MethodBa | Frequency change after test5ppm. No visible damages. | Spending 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours. |
| Drop | GB/T 2423.8- 1995, Method Ed | Frequency change after test5ppm. No visible damages. | Free drop to the wooden plate from 1.0 m heights for 3 times. Measurement taken after 1 hour. |
| Vibration | GB/T 2423.10- 1995, Method Fc | Frequency change after test5ppm. | Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour. |
| Resistance to Soldering Heat | GB/T 2423.28-2005, Test Tb Method 1B | Frequency change after test5ppm. No visible damage | Passed through the re-flow oven under the following condition. Preheat to 150 C5C for 60 to 120sec, and peak 265 C5C for 10s3sec. Measurement taken after DUT being left at room temperature for at 242 hours. |
| Shock | GB/T 2423.5- 1995, Method Ea | Frequency change after test5ppm. | Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1hour. |
| Solderability | GB/T 2423.28-2005, Method Tc | Terminals shall be covered more then 95% with solder. No visible damage. | In 255 5 solder bath for 2 0.5 seconds. There is noneed to do functioned test. 8-12X magnifier. |
| Terminal Strength | JIS-C- 6429 Method 1 & 2 | Frequency change after test5ppm. | Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60seconds. Measurement taken after DUT being left at room temperature for 242 hours. |
Material Composition Declaration
| No. | Name of Part | Material Name | Constituent name | CAS No. | Material Analysis(%) |
|---|---|---|---|---|---|
| 1 | Base | Ceramics | Al2O3 | 1344-28-1 | 63.88% |
| SiO2 | 14464-46-1 | 3.79% | |||
| Cr2o3 | 1308-38-9 | 1.29% | |||
| Mo | 7439-98-7 | 1.00% | |||
| Fe | 7439-89-6 | 8.85% | |||
| Ni | 7440-02-0 | 4.75% | |||
| Co | 7440-48-4 | 2.98% | |||
| Ag | 7440-22-4 | 2.80% | |||
| Cu | 7440-50-8 | 1.04% | |||
| Pin | Solder | Ag | 7440-22-4 | 74.00% | |
| Ethyl alcohol | 64-17-5 | 0.60% | |||
| Bisphenol A-epichlorohydrin polymer | 25068-38-6 | 0.60% | |||
| Xylenes (o-, m-, p-isomers) | 1330-20-7 | 0.60% | |||
| Ethylbenzene | 100-41-4 | 0.06% | |||
| Silicone resin | - | 8.62% | |||
| Silica | - | 8.52% | |||
| Petroleumsolvents | - | 7.00% | |||
| 2 | Lid | Kovar | Fe | 7439-89-6 | 54.00% |
| Co | 7440-48-4 | 17.02% | |||
| Ni | 7440-02-0 | 28.32% | |||
| 3 | Adhesive Resin | Epoxy | Ni () | 7440-02-0 | 0.66% |
| 4 | Blank | Quartz | SiO2 | 14808-60-7 | 100.00% |
| 5 | Wire | Gold | Au | 7440-57-5 | 100.00% |
| 6 | IC | Silicon | Silicon | 7440-21-3 | 100.00% |
| 7 | Electrode | Electrode | Ag | 7440-22-4 | 100.00% |
| Metallization | W | 7440-33-7 | 9.25% | ||
| Au | 7440-57-5 | 0.13% | |||
| Ni | 7440-02-0 | 0.24% | |||
| Fe | - | - | |||
| Co | - | - | |||
| Ni | - | - | |||
| Ni | - | - |
2512081627_CHANGXING-ELECTRONICS-7ESC400C0033L_C48927865.pdf
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