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quality SMD Crystal Oscillator CHANGXING ELECTRONICS 7ESC400C0033L 40MHz CMOS Output RoHS Compliant Pb Free factory
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quality SMD Crystal Oscillator CHANGXING ELECTRONICS 7ESC400C0033L 40MHz CMOS Output RoHS Compliant Pb Free factory
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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Voltage - Supply:
1.8V~3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
40MHz
Mfr. Part #:
7ESC400C0033L
Package:
SMD7050-4P
Key Attributes
Model Number: 7ESC400C0033L
Product Description

Product Overview

The CHANGXING ELECTRONICS CO.,LTD. 7E Series is a line of SMD Crystal Oscillators designed for automatic mounting and reflow soldering. These seam-sealed clock crystal oscillator units offer high precision across a wide frequency range, featuring a Tri-State function and a supply voltage range of 1.8V to 5.0V. They are engineered for high stability, low jitter, and low power consumption, making them ideal for applications in wireless communication, PCs, and LCDM. These oscillators are RoHS Compliant and Pb Free.

Product Attributes

  • Brand: CHANGXING ELECTRONICS CO.,LTD.
  • Product Line: 7E Series
  • Certifications: RoHS Compliant / Pb Free
  • Packaging: EIA-481-2
  • Output Type: CMOS Output

Technical Specifications

Specification Value Unit Notes
Model 7ESC400C0033L -
Product No. 7.05.0 OSC 40.000000MHz -
Dimensions 7.0x5.0x1.3mm mm SMD Crystal Oscillators
Nominal Frequency 40.000000 MHz
Tolerance @ 25 Degree 10 ppm
Stability over Operation Temp. 20 ppm/year
Operating Temperature Range -4085
Storage Temperature Range -55125
Supply Voltage (Vdd) 1.8V5.0V Vdc
Supply Current (Icc) 5 A max Standby current (1.8V3.3V)
Phase Jitter (12KHz 20MHz) 5 ps max ps
Output Load 15 pF pF
Rise/Fall Time 5 ns max ns
Output Voltage VOL 10% VDD max % VDD
Output Voltage VOH 90% VDD min % VDD
Enable Voltage Low 30% VDD max % VDD
Enable Voltage High 70% VDD min % VDD
Start-up Time 10 ms max ms
Output Symmetry 5010% %
Output State Control Enable/disable -
Fundamental Oscillation mode MSL Level 1 - IPC/JEDEC J-STD-033C
Reflow Condition Peak 250+50
Reflow Soldering zone 230 or more, 3010s , s
Reflow Pre-heating zone 1 150180, 9030s , s
Soldering iron method Bit temperature 35010
Soldering iron method Application time 3+1 s
Product Weight 123.031 mg

Reliability Specifications

Item Test Method Specification Measurement Condition
Temperature Cycle GB/T2423.22-2002, Method Nb Frequency change after test5ppm. 10 cycles from -25C to 85C. Measurement taken after DUT being left at room temperature for 242 hours.
Low Temperature Storage GB/T2423.1-2001, MethodAa Frequency change after test5ppm. Spending 72 hrs at -55C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours.
Humidity GB/T2423.3-2006, Method Cab Frequency change after test5ppm. Spending 96 hrs at 40 C 3 C, with 90 3% R.H. Measurement taken after DUT being left at room temperature for 242 hours.
High Temperature Storage GB/T2423.2-2001, MethodBa Frequency change after test5ppm. No visible damages. Spending 72 hrs at 125C3C constant temperature. Measurement taken after DUT being left at room temperature for 242 hours.
Drop GB/T 2423.8- 1995, Method Ed Frequency change after test5ppm. No visible damages. Free drop to the wooden plate from 1.0 m heights for 3 times. Measurement taken after 1 hour.
Vibration GB/T 2423.10- 1995, Method Fc Frequency change after test5ppm. Apply 0.75mm vibration at sweep frequency 10500 Hz, for 2h. 10 cycles in each direction of 3 axis. Measurement taken after 1 hour.
Resistance to Soldering Heat GB/T 2423.28-2005, Test Tb Method 1B Frequency change after test5ppm. No visible damage Passed through the re-flow oven under the following condition. Preheat to 150 C5C for 60 to 120sec, and peak 265 C5C for 10s3sec. Measurement taken after DUT being left at room temperature for at 242 hours.
Shock GB/T 2423.5- 1995, Method Ea Frequency change after test5ppm. Peak 1000m/s2, normal width 6ms half sine wave form, 3.7m/s, 3 perpendicular axis of samples, 3 cycles /direction, total 18 cycles. Measurement taken after 1hour.
Solderability GB/T 2423.28-2005, Method Tc Terminals shall be covered more then 95% with solder. No visible damage. In 255 5 solder bath for 2 0.5 seconds. There is noneed to do functioned test. 8-12X magnifier.
Terminal Strength JIS-C- 6429 Method 1 & 2 Frequency change after test5ppm. Mount on a glass-epoxy board (100x50x1.6mm), then bend to 2mm displacement (velocity 1mm/sec) and keep for 5 seconds. or pulling force 0.5 kg for at least 60seconds. Measurement taken after DUT being left at room temperature for 242 hours.

Material Composition Declaration

No. Name of Part Material Name Constituent name CAS No. Material Analysis(%)
1 Base Ceramics Al2O3 1344-28-1 63.88%
SiO2 14464-46-1 3.79%
Cr2o3 1308-38-9 1.29%
Mo 7439-98-7 1.00%
Fe 7439-89-6 8.85%
Ni 7440-02-0 4.75%
Co 7440-48-4 2.98%
Ag 7440-22-4 2.80%
Cu 7440-50-8 1.04%
Pin Solder Ag 7440-22-4 74.00%
Ethyl alcohol 64-17-5 0.60%
Bisphenol A-epichlorohydrin polymer 25068-38-6 0.60%
Xylenes (o-, m-, p-isomers) 1330-20-7 0.60%
Ethylbenzene 100-41-4 0.06%
Silicone resin - 8.62%
Silica - 8.52%
Petroleumsolvents - 7.00%
2 Lid Kovar Fe 7439-89-6 54.00%
Co 7440-48-4 17.02%
Ni 7440-02-0 28.32%
3 Adhesive Resin Epoxy Ni () 7440-02-0 0.66%
4 Blank Quartz SiO2 14808-60-7 100.00%
5 Wire Gold Au 7440-57-5 100.00%
6 IC Silicon Silicon 7440-21-3 100.00%
7 Electrode Electrode Ag 7440-22-4 100.00%
Metallization W 7440-33-7 9.25%
Au 7440-57-5 0.13%
Ni 7440-02-0 0.24%
Fe - -
Co - -
Ni - -
Ni - -

2512081627_CHANGXING-ELECTRONICS-7ESC400C0033L_C48927865.pdf

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