Product Overview
The Seam3225 is a high-precision Quartz Crystal Resonator designed for demanding applications. It offers high frequency stability and is exceptionally effective at reducing EMI effects, making it an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. This product is RoHS Compliant and Pb Free.
Product Attributes
- Brand: CHANGXING ELECTRONICS CO.,LTD.
- Product Type: Quartz Crystal Resonator
- Series: 8D Series / Seam Sealing Crystals
- Model: Seam3225 (8DSC400G0011L)
- Origin: Fujian, China
- Certifications: RoHS Compliant / Pb Free
- Sealing Type: Seam Sealing
Technical Specifications
| Parameter | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 40.000000 | MHz | |
| Frequency Tolerance | 10 | ppm | at 25 3 |
| Load Capacitance | 11 | pF | 0.01100W/Step |
| Frequency Stability | 30 | ppm | Over Operating Temp. Range |
| Aging (1st Year) | 3 | ppm | |
| Operating Temperature | -40+85 | ||
| Storage Temperature Range | -55+125 | ||
| Motional Capacitance (C1) | - | fF | |
| Effective Resistance (Rr) | 40 | Max. | |
| Shunt Capacitance (C0) | 5 | Max. pF | at DC 100V |
| Drive Level | 100 | uW | |
| Insulation Resistance | 500 | Min. M | |
| Pulling Sensitivity (TS) | - | ppm/pF | |
| Spurious Response | -3.0 | dB | DLD2 |
| Crystal cutting type | AT CUT (thickness shear mode) | - | |
| Dimensions (L x W x H) | 3.2 x 2.5 x 0.7 | mm | SMD |
| Reel Quantity | 3,000 | pcs per reel | (WHITE) |
| MSL Level | 1 | - | IPC/JEDEC J-STD-033C |
| Product Weight | 17.322 | mg |
Marking
LOGO, Nominal Frequency (MHz), Line Code, Last three digits of Batch Number, Year-Month Code.
Reflow Condition
Refer to standard reflow soldering profiles for SMD components.
Packing
(EIA-481-2) Standard Reel Quantity: 3,000 pcs per reel (WHITE).
Reliability Specifications
Mechanical Endurance: Vibration (10-2000 Hz), Mechanical Shock (1000 G), Drop Test (150 cm).
Environmental Endurance: High Temp & Humidity (85, RH 85%, 500Hrs), Low Temp. Storage (-40, 500Hrs), Temperature Cycling (100 cycles), Thermal Shock, Resistance to Soldering Heat (260), Pressure Cooker Storage (125, RH100%, 2 bar, 240Hrs), Helium Bombing (4.5 Kgf/cm2).
Material Composition Declaration
| Part | Material Name | CAS No. | Material Mass (%) | Constituent Name | Material Analysis (%) |
|---|---|---|---|---|---|
| Base (Ceramics) | Al2O3 | 1344-28-1 | 36.95% | Al2O3 | 92.40% |
| SiO2 | 7631-86-9 | SiO2 | 4.31% | ||
| Cr2o3 | 1308-38-9 | Cr2o3 | 1.50% | ||
| MgO | 1309-48-4 | MgO | 0.69% | ||
| CaO | 1305-78-8 | CaO | 1.10% | ||
| Metallizing | Fe | 7439-89-6 | 23.09% | Fe | 40.70% |
| Ni | 7440-02-0 | Ni | 21.80% | ||
| Co | 7440-48-4 | Co | 12.80% | ||
| Ag | 7440-22-4 | Ag | 21.00% | ||
| Cu | 7440-50-8 | Cu | 3.70% | ||
| Electrode (Metal) | W | 7440-33-7 | 0.29% | W | 100.00% |
| Au | 7440-57-5 | Au | 100.00% | ||
| Ni | 7440-02-0 | Ni | 100.00% | ||
| Metal | Fe | 7439-89-6 | 15.01% | Fe | 53.45% |
| Ni | 7440-02-0 | Ni | 29.25% | ||
| Co | 7440-48-4 | Co | 17.30% | ||
| Plating (Ni) | Ni | 7440-02-0 | 20.91% | Ni | 100.00% |
| Adhesive (Polymer) | Ag | 7440-22-4 | 1.15% | Ag | 75.00% |
| Undecane | 1120-21-4 | C11H24 | 5.00% | ||
| Dodecane | 112-40-3 | C12H26 | 5.00% | ||
| Silicone resin | - | Silicone resin | 15.00% | ||
| Chip (Quartz) | SiO2 | 14808-60-7 | 2.60% | SiO2 | 100.00% |
| Cover (4J29 base material) | Cr | 7440-47-3 | 15.01% | Cr | 5.56% |
| Ag | 7440-22-4 | Ag | 94.44% |
2509161435_CHANGXING-ELECTRONICS-8DSC400G0011L_C51902149.pdf
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